CN112248436B - Multi-laser-based scanning path planning method and device and three-dimensional object manufacturing equipment - Google Patents
Multi-laser-based scanning path planning method and device and three-dimensional object manufacturing equipment Download PDFInfo
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- CN112248436B CN112248436B CN202011015638.4A CN202011015638A CN112248436B CN 112248436 B CN112248436 B CN 112248436B CN 202011015638 A CN202011015638 A CN 202011015638A CN 112248436 B CN112248436 B CN 112248436B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/277—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED]
- B29C64/282—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED] of the same type, e.g. using different energy levels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
A multi-laser-based scanning path planning method, a multi-laser-based scanning path planning device and three-dimensional object manufacturing equipment are provided, wherein the method comprises the following steps: arranging a plurality of lasers above a working area in an array manner, wherein the plurality of lasers are even lasers with more than four; acquiring at least one overlapped part covered by four adjacent lasers respectively, and marking the overlapped part as a core area, wherein the core area is rectangular; extending outwards from the middle point of each edge of the core area to divide the working area into the core area and four areas which are respectively and independently responsible for scanning by the four adjacent lasers; the method and the device for planning the scanning path based on the multiple lasers and the three-dimensional object manufacturing equipment reduce the number of scanning overlapping and further improve the forming quality.
Description
Technical Field
The application relates to the technical field of additive manufacturing, in particular to a scanning path planning method and device based on multiple lasers and three-dimensional object manufacturing equipment.
Background
The additive manufacturing technology is an advanced manufacturing technology with the distinct characteristics of digital manufacturing, high flexibility and adaptability, direct CAD model driving, high speed, rich and various material types and the like, and has a very wide application range because the additive manufacturing technology is not limited by the complexity of the shape of a part and does not need any tool die.
With the continuous development of additive manufacturing technology, the demands of users are increasing, and therefore, a single laser cannot meet all the demands of customers. The multi-laser full-coverage printing device can improve the production efficiency of additive manufacturing through a plurality of lasers, and each laser can be used for manufacturing each independent part in a working area respectively or can be used for manufacturing a single large-scale component in a coordinated mode. Such flexibility enables additive manufacturing production efficiency to be improved.
When multiple lasers are used to cooperatively manufacture a large part, a scan line may span multiple laser scan areas, and thus multiple lasers may be required to scan together, and multiple overlapping areas may exist in the multiple laser scanning together. However, as the number of the overlapped areas increases, the more obvious the overlapping trace of the workpiece is, the more difficult the forging performance and the tensile property of the workpiece are to be controlled, thereby greatly affecting the forming quality.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a multi-laser-based scanning path planning method and device and three-dimensional object manufacturing equipment, wherein the number of scanning overlapping is reduced, so that the forming quality of a workpiece to be printed is improved.
In order to achieve the above object, the present application provides a scanning path planning method based on multiple lasers, including the following steps:
arranging a plurality of lasers above a working area in an array manner, wherein the plurality of lasers are even lasers with more than four lasers;
acquiring at least one overlapped part covered by four adjacent lasers respectively, and marking the overlapped part as a core area, wherein the core area is rectangular;
extending outwards from the middle point of each edge of the core area to divide the working area into the core area and four areas which are respectively and independently responsible for scanning by the four adjacent lasers;
and arranging a plurality of scanning lines in the working area according to the scanning section of the workpiece to be printed, and determining to distribute corresponding lasers to the scanning lines according to the area where each scanning line is positioned.
As a further preferable aspect of the present invention, determining, according to a region in which each scan line is located, to assign a corresponding laser to the scan line specifically includes:
when the scanning line penetrates into and penetrates out of the core area, taking any point on a line segment of the scanning line, which is positioned in the core area, as a dividing point to divide the scanning line into a first line segment and a second line segment, and scanning the first line segment by a corresponding laser in an area where an end point of the scanning line, which is close to the first line segment, is positioned, and scanning the second line segment by a corresponding laser in an area where an end point of the scanning line, which is close to the second line segment, is positioned;
when the scanning line penetrates into the core area and does not penetrate out of the core area, marking a line segment positioned outside the core area in the scanning line as a third line segment, and scanning the third line segment by a corresponding laser in an area where an end point of the scanning line close to the third line segment is positioned;
when the scanning line does not penetrate into the core area, the corresponding laser in the area where the scanning line is located is responsible for scanning.
As a further preferable aspect of the present invention, the division point is located on at least one diagonal line of the core region.
As a further preferable aspect of the present invention, when the scan line does not penetrate into the core region, the scanning by the corresponding laser in the region where the scan line is located specifically includes:
when the scanning line does not penetrate into the core area and is only positioned in one area of the working area, the corresponding laser of the area where the scanning line is positioned is responsible for scanning;
when the scanning line does not penetrate into the core area and is positioned in two or more areas of one area of the working area, the corresponding lasers in all the areas where the scanning line is positioned are responsible for scanning.
As a further preferable aspect of the present invention, the method further comprises:
when the number of the lasers is four, the number of the core area is one;
when the number of lasers is six or more, the number of core regions is two or more.
As a further preferable aspect of the present invention, when the number of the lasers is six or more, the core region is obtained by:
and sequentially acquiring overlapped parts in the coverage areas of every two adjacent lasers from one side of the arrayed multi-lasers, and recording the overlapped parts as core areas until the acquisition of the other side of the arrayed multi-lasers is finished.
As a further preferable aspect of the present invention, the scan lines include outline scan lines and fill scan lines.
The invention also provides a multi-laser-based scanning path planning device, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, and is characterized in that the processor implements the steps of the multi-laser-based scanning path planning method according to any one of the above items when executing the computer program.
The invention also provides three-dimensional object manufacturing equipment comprising the multi-laser-based scanning path planning device.
The invention discloses a multi-laser-based scanning path planning method, a multi-laser-based scanning path planning device and three-dimensional object manufacturing equipment, wherein the method comprises the following steps of: arranging a plurality of lasers above a working area in an array manner, wherein the plurality of lasers are even lasers with more than four lasers; acquiring at least one overlapped part covered by four adjacent lasers respectively, and marking the overlapped part as a core area, wherein the core area is rectangular; extending outwards from the middle point of each edge of the core area to divide the working area into the core area and four areas which are respectively and independently responsible for scanning by the four adjacent lasers; a plurality of scanning lines are arranged in the working area according to the scanning section of the workpiece to be printed, and the corresponding laser is determined to be distributed to each scanning line according to the area where each scanning line is located, so that the number of scanned lap joints is reduced, and the forming quality is improved.
Drawings
Fig. 1 is a schematic structural diagram of core area acquisition in an embodiment provided by the multi-laser-based scan path planning method of the present invention;
FIG. 2 is a working area division diagram in an embodiment of the present invention provided by a multi-laser-based scan path planning method;
FIG. 3 is a schematic cross-sectional view of a scan of a workpiece to be printed according to an embodiment of the scan path planning method based on multiple lasers of the present invention;
FIG. 4 is a working area division diagram in another embodiment provided by the multi-laser based scan path planning method of the present invention;
fig. 5 is a flowchart of a method of an embodiment of the present invention for providing a multi-laser based scan path planning method.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In order to achieve the above object, the present application provides a multi-laser-based scan path planning method, as shown in fig. 5, the method includes the following steps:
step S101, arranging a plurality of lasers above a working area in an array manner, wherein the plurality of lasers refer to even number of lasers with more than four, such as 4, 6, 8 and the like, and the specific number is determined according to the size of equipment; preferably, the parameters of the multiple selectable lasers are the same, so that the subsequent operation and the operation processing are convenient;
step S102, acquiring at least one overlapping portion covered by four adjacent lasers, and marking the overlapping portion as a core area, where the core area is rectangular, as shown in fig. 1;
step S103, extending outward from the middle point of each edge of the core region to divide the working region into the core region and four regions separately scanned by the four adjacent lasers, such as an a laser sintering region (which is mainly scanned by the a laser), a B laser sintering region (which is mainly scanned by the B laser), a C laser sintering region (which is mainly scanned by the C laser), and a D laser sintering region (which is mainly scanned by the D laser) in fig. 2;
and step S104, setting a plurality of scanning lines in the working area according to the scanning section of the workpiece to be printed, and determining to distribute corresponding laser to each scanning line according to the area where each scanning line is located. It should be noted that, the plurality of scan lines arranged according to the scan cross section of the to-be-printed object may be set by the prior art, for example, a plurality of scan lines parallel to each other as shown in fig. 3 are arranged, of course, the scan lines may also be arranged by regions, and the specific arrangement of the scan lines is not limited at all.
Specifically, determining to assign a corresponding laser to each scan line according to the area where the scan line is located specifically includes:
when the scan line passes through and out of the core region (e.g., scan line 3 in fig. 3), any point on the line segment of the core region in the scan line is taken as a dividing point to divide the scan line into a first line segment and a second line segment, and the first line segment is scanned by the corresponding laser in the region where an end point of the scan line close to the first line segment is located, and the second line segment is scanned by the corresponding laser in the region where an end point of the scan line close to the second line segment is located;
when the scan line passes through the core region and does not pass through the core region (e.g., scan line 4 in fig. 3), marking a line segment of the scan line located outside the core region as a third line segment, and scanning the third line segment with a laser corresponding to a region where an end point of the scan line close to the third line segment is located;
when the scan line does not penetrate into the core region (e.g., scan line 2, scan line 5, etc. in fig. 3), the corresponding laser in the region where the scan line is located is responsible for scanning.
Preferably, the division point is located on at least one diagonal line of the core region for the convenience of arithmetic processing and operation. For example, two diagonal lines of the core area may be made first, and then an intersection point exists between the line segment located in the core area and which one or those two diagonal lines, and when the intersection point is one, the intersection point is a division point; if the number of the intersections is 2, one point may be selected as the intersection.
As a further preferable aspect of the present invention, when the scan line does not penetrate into the core region, the scanning by the corresponding laser in the region where the scan line is located specifically includes:
when the scanning line does not penetrate into the core area and is only positioned in one area of the working area, the corresponding laser of the area where the scanning line is positioned is responsible for scanning;
when the scanning line does not penetrate into the core area and is located in two or more areas of one area of the working area, the corresponding lasers in all the areas where the scanning line is located are responsible for scanning.
In one implementation, the method further comprises:
when the number of lasers is four, the core area is one (as shown in fig. 1-3);
when the number of the lasers is six or more, the number of the core areas is two or more; as shown in fig. 4, when the number of lasers is six, the number of core regions is two, and as the number of lasers increases, the number of core regions also increases.
Specifically, as shown in fig. 4, when the number of lasers is six or more, the core region is obtained by:
the overlapped part of the coverage area of each adjacent four lasers is sequentially obtained from one side (the left side in fig. 4) of the arrayed multi-lasers, and the part is taken as the core area until the other side (the right side in fig. 4) of the arrayed multi-lasers finishes obtaining.
The scanning lines include a profile scanning line and a fill scanning line, that is, the profile scanning line and the fill scanning line are both assigned to the corresponding lasers according to the method.
In order to make the technical solution of the present invention better understood and realized by those skilled in the art, and to know the beneficial effects of the present invention, the following description will specifically take four lasers as an example and is made with reference to fig. 1 to 3:
the laser A is located at the upper right corner, the laser B is located at the upper left corner, the laser C is located at the lower left corner, and the laser D is located at the lower right corner. To clarify the extent of the core region, as shown in FIG. 1, four lasers overlap at the center of the active area, indicating that all four lasers can scan a fill scan line that falls within this center region. With this as a reference, the overlapping coverage area of 4 lasers is set as the core area.
As shown in fig. 2, the sintered region dividing line and the core region of each laser divide the entire sintered region into five parts.
And if the filling scanning line passes through the core scanning area, taking a certain point of a line segment which is intersected with the scanning line in the core area as a dividing point, and dividing the filling scanning line into two lasers for scanning. As shown in fig. 3, the scanning line 2 passes through three laser sintering regions, and since it does not pass through the core region, it is still scanned by the a laser, the B laser, and the D laser, and in order to ensure the sintering quality, two overlapping amounts are required; while the scan line 3 passes through the core region, though passing through A, B, D three laser sintering regions, since the scan line 3 is divided into two segments, sintering is performed only by the B laser and the D laser, while the a laser does not need to be scanned, and therefore, the scan line only needs one lap amount.
If the scan line has one or both ends within the core region (i.e., the scan line passes through and does not pass through the core region), the entire scan line is scanned with a laser. As shown in fig. 3, one end of scan line 4 is located in the core region and although the scan line passes through B, C, D three laser sintering regions, it is scanned by the D laser only so that there is no overlap. The scan line 5 is scanned by the B and C lasers since it does not pass through the core area.
Therefore, the core area is preset in the overlapped sintering area covered by the four lasers, so that the original three laser cooperative scanning of the scanning line passing through the core area is changed into two laser cooperative scanning or one laser independent scanning, the number of overlapped scanning is reduced, and the forming quality of the to-be-printed workpiece is improved.
The invention also provides a multi-laser-based scanning path planning device, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, and is characterized in that the processor implements the steps of the multi-laser-based scanning path planning method according to any one of the above items when executing the computer program.
The invention also provides three-dimensional object manufacturing equipment comprising the multi-laser-based scanning path planning device.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A scanning path planning method based on multiple lasers is characterized by comprising the following steps:
arranging a plurality of lasers above a working area in an array manner, wherein the plurality of lasers are even lasers with more than four;
acquiring at least one overlapped part covered by four adjacent lasers respectively, and marking the overlapped part as a core area, wherein the core area is rectangular;
extending outwards from the middle point of each edge of the core area to divide the working area into the core area and four areas which are respectively and independently responsible for scanning by the four adjacent lasers;
arranging a plurality of scanning lines in a working area according to the scanning section of a workpiece to be printed, determining to distribute corresponding lasers to the scanning lines according to the area where each scanning line is positioned,
wherein, determining to allocate a corresponding laser to each scan line according to the area where the scan line is located specifically includes:
when the scanning line penetrates into and penetrates out of the core area, taking any point on a line segment of the scanning line, which is positioned in the core area, as a dividing point to divide the scanning line into a first line segment and a second line segment, and scanning the first line segment by a corresponding laser in an area where an end point of the scanning line, which is close to the first line segment, is positioned, and scanning the second line segment by a corresponding laser in an area where an end point of the scanning line, which is close to the second line segment, is positioned;
when the scanning line penetrates into the core area and does not penetrate out of the core area, marking a line segment positioned outside the core area in the scanning line as a third line segment, and scanning the third line segment by a corresponding laser in an area where an end point of the scanning line close to the third line segment is positioned;
when the scanning line does not penetrate into the core area, the corresponding laser in the area where the scanning line is located is responsible for scanning.
2. The multi-laser based scan path planning method of claim 1, wherein the division point is located on at least one diagonal of the core region.
3. The method of claim 1, wherein scanning by the corresponding laser in the area where the scan line is located when the scan line does not penetrate into the core area comprises:
when the scanning line does not penetrate into the core area and is only positioned in one area of the working area, the corresponding laser of the area where the scanning line is positioned is responsible for scanning;
when the scanning line does not penetrate into the core area and is located in two or more areas of one area of the working area, the corresponding lasers in all the areas where the scanning line is located are responsible for scanning.
4. The multi-laser based scan path planning method of claim 1, further comprising:
when the number of the lasers is four, the number of the core area is one;
when the number of lasers is six or more, the number of core regions is two or more.
5. The multi-laser based scan path planning method of claim 4, wherein when the number of lasers is six or more, the core region is obtained by:
and sequentially acquiring overlapped parts in the coverage areas of every two adjacent lasers from one side of the arrayed multi-lasers, and recording the overlapped parts as core areas until the acquisition of the other side of the arrayed multi-lasers is finished.
6. The multi-laser based scan path planning method of any of claims 1 to 5, wherein the scan lines comprise contour scan lines and fill scan lines.
7. A multi-laser based scan path planning apparatus comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the steps of the multi-laser based scan path planning method according to any of claims 1-6 when executing the computer program.
8. A three-dimensional object manufacturing apparatus comprising the multi-laser based scan path planning device of claim 7.
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| IT202100013136A1 (en) | 2021-05-21 | 2021-08-21 | 3D New Tech S R L | Multi laser system for additive manufacturing |
| CN114472924B (en) * | 2022-01-12 | 2022-10-11 | 南昌大学 | Laser path planning method, system, computer and readable storage medium |
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| CN104972121A (en) * | 2014-04-04 | 2015-10-14 | 株式会社松浦机械制作所 | Three-dimensional molding equipment |
| CN110523988A (en) * | 2019-09-29 | 2019-12-03 | 华南理工大学 | One kind four laser, four galvanometer selective laser fusing increase and decrease material molding machine and method |
| CN111014670A (en) * | 2019-12-13 | 2020-04-17 | 株洲国创轨道科技有限公司 | Machining area division and machining method of multi-machining-head additive manufacturing equipment |
| CN111299577A (en) * | 2020-02-29 | 2020-06-19 | 华中科技大学 | SLM forming method and product based on intelligent scanning path planning |
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| KR20150115596A (en) * | 2014-04-04 | 2015-10-14 | 가부시키가이샤 마쓰우라 기카이 세이사쿠쇼 | Device and method for forming a 3-dimensional shaped object |
| US10583529B2 (en) * | 2015-12-17 | 2020-03-10 | Eos Of North America, Inc. | Additive manufacturing method using a plurality of synchronized laser beams |
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| CN104972121A (en) * | 2014-04-04 | 2015-10-14 | 株式会社松浦机械制作所 | Three-dimensional molding equipment |
| CN110523988A (en) * | 2019-09-29 | 2019-12-03 | 华南理工大学 | One kind four laser, four galvanometer selective laser fusing increase and decrease material molding machine and method |
| CN111014670A (en) * | 2019-12-13 | 2020-04-17 | 株洲国创轨道科技有限公司 | Machining area division and machining method of multi-machining-head additive manufacturing equipment |
| CN111299577A (en) * | 2020-02-29 | 2020-06-19 | 华中科技大学 | SLM forming method and product based on intelligent scanning path planning |
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