CN110524883B - Scanning path planning method and device based on double lasers and three-dimensional object manufacturing equipment - Google Patents
Scanning path planning method and device based on double lasers and three-dimensional object manufacturing equipment Download PDFInfo
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- CN110524883B CN110524883B CN201910875799.1A CN201910875799A CN110524883B CN 110524883 B CN110524883 B CN 110524883B CN 201910875799 A CN201910875799 A CN 201910875799A CN 110524883 B CN110524883 B CN 110524883B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/277—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED]
- B29C64/282—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED] of the same type, e.g. using different energy levels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
Abstract
A scanning path planning method, a scanning path planning device and three-dimensional object manufacturing equipment based on twin lasers are disclosed, wherein the method comprises the following steps: at most one workpiece to be printed in the current layer section of the work package is scanned by two lasers, other workpieces to be printed in the current layer section of the work package are scanned by only one laser, the workpieces to be printed scanned by the two lasers belong to contours, and areas filled by the upper surface and the lower surface are scanned by the same laser. According to the scanning path planning method and device based on the twin lasers and the three-dimensional object manufacturing equipment, the scanning time of each laser is reasonably distributed by predicting the scanning time of the section of the current layer, and the idle waiting time of the lasers is reduced, namely the scanning waiting time of the lasers is reduced as far as possible on the premise of ensuring the scanning quality.
Description
Technical Field
The application relates to the technical field of additive manufacturing, in particular to a scanning path planning method and device based on double lasers and three-dimensional object manufacturing equipment.
Background
The additive manufacturing technology is an advanced manufacturing technology with the distinct characteristics of digital manufacturing, high flexibility and adaptability, direct CAD model driving, high speed, rich and various material types and the like, and has a very wide application range because the additive manufacturing technology is not limited by the complexity of the shape of a part and does not need any tool die.
With the continuous development of additive manufacturing technology, the demands of users are increasing, and therefore, a single laser cannot meet all the demands of customers. A multi-laser full-coverage printing device can improve the production efficiency of additive manufacturing through a plurality of lasers, and each laser can be used for manufacturing each independent part in a sintering area respectively or cooperatively manufacturing a single large-scale component. Such flexibility enables additive manufacturing production efficiency to be improved.
In order to ensure the forming quality, the multi-laser is generally formed in an asymmetric construction mode, but the productivity is reduced due to the fact that in the mode, each laser has different workload, and therefore, one part of the lasers needs to be idle for waiting for the other lasers to complete the task; while each laser typically is assigned the same scan time when scanning a workpiece to ensure forming efficiency, each laser has a separate optical system, can be difficult to align, and can suffer from thermal drift relative to each other, and when multiple lasers are applied to the same workpiece, discontinuities in the overlap region result.
From the above, it is difficult to make the molding efficiency and molding quality of the multi-laser full-coverage scanning apparatus compatible, so it becomes more important to control the scanning path of the multi-laser.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a scanning path planning method and device for reducing the scanning waiting time of a laser as much as possible on the premise of ensuring the scanning quality, and a three-dimensional object manufacturing device.
In order to achieve the above object, the present application provides a scanning path planning method based on dual lasers, including: at most one workpiece to be printed in the current layer section of the work package is scanned by two lasers, other workpieces to be printed in the current layer section of the work package are scanned by only one laser, the workpieces to be printed scanned by the two lasers belong to contours, and areas filled by the upper surface and the lower surface are scanned by the same laser.
As a further preferable aspect of the present invention, the method comprises the steps of:
step one, calculating the scanning time of the current layer section of the three-dimensional model corresponding to a plurality of workpieces to be printed in a work package, and calculating the total scanning time of all the three-dimensional models of the current layer section; dividing the total scanning time by 2 equals the preset scanning time of each laser;
selecting the three-dimensional model with the longest scanning time of the section of the current layer in the work package as an alternative model, and respectively selecting one laser for scanning other three-dimensional models in the work package;
step three, calculating the remaining scanning time to be distributed of the two lasers respectively, and selecting one laser to scan the alternative model when the scanning time of the alternative model is less than the remaining scanning time to be distributed of one laser in the two lasers; otherwise, scanning the alternative module by adopting two lasers;
when the two lasers are adopted to scan the alternative module, the total scanning time of the profile, the upper surface filling and the lower surface filling in the alternative model is calculated, and the laser with the largest time to be allocated in the two lasers is selected to scan the area of the profile, the upper surface filling and the lower surface filling in the alternative model.
As a further preferable scheme of the present invention, in the second step, one laser is respectively selected for scanning other three-dimensional models in the work package according to the principle of proximity.
As a further preferred aspect of the present invention, the step of selecting one laser for scanning according to the principle of proximity for other three-dimensional models in the work package comprises:
step 21, selecting a laser, calculating the Euclidean distance from the laser to the section of the current layer of each three-dimensional model, and sequentially selecting the three-dimensional models from near to far;
and 22, accumulating and calculating the sum of the scanning time of the selected three-dimensional model until the sum of the scanning time exceeds the preset scanning time of the laser, selecting another laser, calculating the Euclidean distance from the laser to the current section of the rest three-dimensional model, and sequentially selecting the three-dimensional models from near to far.
As a further preferable aspect of the present invention, the method further comprises:
and judging that the laser selected by the contour area in the current layer section of each three-dimensional model is different from the laser selected by the contour area of the previous layer section, and selecting the laser selected by the contour area of the previous layer section of the three-dimensional model to scan the contour area in the current layer section.
As a further preferable aspect of the present invention, the method further comprises:
when the current layer section of the three-dimensional model is scanned by only one laser, judging whether the laser selected by the current layer section of the three-dimensional model is the same as the laser selected by the previous layer section, and when the laser selected by the previous layer section of the three-dimensional model is different, selecting the laser selected by the previous layer section of the three-dimensional model to scan the current layer section.
As a further preferable aspect of the present invention, the scan time to be allocated is equal to the preset scan time of the laser minus the total scan time of the selected at least one three-dimensional model.
The invention also provides a scanning path planning device based on the twin laser, which comprises a memory, a processor and a computer program which is stored on the memory and can run on the processor, and is characterized in that the processor implements the steps of the scanning path planning method based on the twin laser when executing the computer program.
The invention also provides three-dimensional object manufacturing equipment which comprises the scanning path planning device based on the twin laser.
The invention relates to a scanning path planning method, a device and a three-dimensional object manufacturing device based on double lasers, which reasonably plan the scanning area of each laser by presetting an alternative model of multi-laser cooperative scanning, so that at most one workpiece to be printed in the current layer section of each work package is scanned by a plurality of lasers, the current layer sections of other workpieces to be printed are scanned by only one laser, the same workpiece to be printed is cooperatively scanned by a plurality of lasers, the areas belonging to the contour, the upper surface filling and the lower surface filling are scanned by the same laser sintering, the internal common filling adopts a plurality of lasers to cooperatively work, the invention not only reduces the mutual influence among the lasers, promotes the molding surface quality of the workpiece to be printed, but also estimates the scanning time of the current layer section, the scanning time of each laser is reasonably distributed, and the idle waiting time of the lasers is reduced, namely the scanning waiting time of the lasers is reduced as far as possible on the premise of ensuring the scanning quality.
Drawings
FIG. 1 is a flowchart of a method for scanning path planning based on twin lasers according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a top layer according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a current layer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In order to achieve the above object, the present application provides a scanning path planning method based on dual lasers, which includes: the laser scanning device comprises a working bag, wherein the working bag is provided with a laser scanning device, the laser scanning device is arranged on the working bag, the working bag is provided with a scanning device, the scanning device is provided with a scanning device, and the scanning device is provided with a scanning device.
As a preferred embodiment of the present invention, as shown in fig. 1, the method specifically includes the following steps:
step S1, calculating the scanning time of the current layer section of the three-dimensional model corresponding to a plurality of workpieces to be printed in the work package, and calculating the total scanning time of all the three-dimensional models of the current layer section; dividing the total scanning time by 2 equals the preset scanning time of each laser; as shown in fig. 2, if the scanning time of the first three-dimensional model is 40 seconds, the scanning time of the second three-dimensional model is 50 seconds, and the scanning time of the third three-dimensional model is 30 seconds, the preset scanning time allocated to each laser is 60 seconds;
s2, selecting the three-dimensional model with the longest scanning time of the current layer section in the work package as a candidate model, and respectively selecting one laser for scanning other three-dimensional models in the work package; in the step, when the scanning time of all three-dimensional models of the current layer section in the work package is the same, one three-dimensional model is selected as an alternative model;
preferably, in order to minimize the mutual influence between the lasers and the uniformity of the laser radiation, in step S2, one laser is selected for scanning according to the principle of proximity for the other three-dimensional models in the work package, which may specifically include the following steps:
step 21, selecting a laser, calculating the Euclidean distance from the laser to the section of the current layer of each three-dimensional model, and sequentially selecting the three-dimensional models from near to far;
and 22, accumulating and calculating the sum of the scanning time of the selected three-dimensional model until the sum of the scanning time exceeds the preset scanning time of the laser, selecting another laser, calculating the Euclidean distance from the laser to the current section of the rest three-dimensional model, and sequentially selecting the three-dimensional models from near to far. For example, the preset scanning time of the a laser is 50 seconds, when the scanning time of the first three-dimensional model is 20 seconds and the scanning time of the second three-dimensional model is 20 seconds, if the scanning time of the third three-dimensional model is also 20 seconds, since the sum of the scanning times of the first three-dimensional model, the second three-dimensional model and the third three-dimensional model exceeds 50 seconds, the third three-dimensional model can only select another laser, and the laser selects the three-dimensional models to scan in sequence nearby by referring to the method of the last laser, and the repeated description is not repeated here.
Step S3, calculating the remaining scanning time to be distributed of the two lasers respectively, and selecting one laser to scan the alternative model when the scanning time of the alternative model is less than the remaining scanning time to be distributed of the other laser in the two lasers; otherwise, scanning the alternative module by adopting two lasers; the scanning time to be distributed is equal to the sum of the preset scanning time of the laser minus the total scanning time of the selected at least one three-dimensional model;
when the two lasers are adopted to scan the alternative module, the total scanning time of the profile, the upper surface filling and the lower surface filling in the alternative model is calculated, and the laser with the largest time to be allocated in the two lasers is selected to scan the area of the profile, the upper surface filling and the lower surface filling in the alternative model.
And as shown in fig. 2, the three-dimensional model two with the longest scanning time is selected as the candidate model for multi-laser cooperative scanning. According to the principle of proximity, the first three-dimensional model is allocated to the left laser, the scanning time of the left laser is 40 seconds, the third three-dimensional model is allocated to the right laser, the scanning time of the right laser is 30 seconds, the remaining scanning time to be allocated to the left laser is 20 seconds, the remaining scanning time to be allocated to the right laser is 30 seconds, and the scanning time of the alternative model is 50 seconds which are both longer than the remaining scanning time to be allocated to the two lasers, so that the alternative model needs to adopt the two lasers to scan the alternative module. And because the alternative model belongs to the contour, the total scanning time of the upper surface filling and the lower surface filling is 22 seconds, in order to ensure the surface quality of the workpiece to be printed, the contour of the alternative model is scanned by using the left right laser with the distribution time more than 22 seconds, and the upper surface filling area and the lower surface filling area are scanned.
As a preferred aspect of the present invention, the method further comprises:
and judging that the laser selected by the contour area in the current layer section of each three-dimensional model is different from the laser selected by the contour area of the previous layer section, and selecting the laser selected by the contour area of the previous layer section of the three-dimensional model to scan the contour area in the current layer section. This step is performed each time a laser is selected for each three-dimensional model, and is performed further, i.e. at the highest level of laser selection. The surface quality of the workpiece to be printed can be well guaranteed, namely the laser for contour scanning is guaranteed to be unchanged in the forming process, and the laser for filling scanning can be changed. As shown in fig. 3, since the second three-dimensional model is formed, the current cross-sectional layer only has the first model and the third model, the total scanning time is 70 seconds, each laser is allocated to 35 seconds, the third three-dimensional model is allocated to the right laser according to the above steps, the first three-dimensional model is cooperatively scanned by multiple lasers, and since the profile scanning of the first three-dimensional model in the previous layer is the left laser, the profile scanning of the current layer is still the left laser. It should be noted here that when the current layer is the first time, there is no previous layer, and therefore, this preferred step does not apply to the first layer.
In order to further avoid the frequent switching operation of the two lasers, and the different parameters of the different lasers may affect the scanning quality, the present invention also provides another preferable solution, and the method further includes:
when the current layer section of the three-dimensional model is scanned by only one laser, judging whether the laser selected by the current layer section of the three-dimensional model is the same as the laser selected by the previous layer section, and when the laser selected by the previous layer section of the three-dimensional model is different, selecting the laser selected by the previous layer section of the three-dimensional model to scan the current layer section.
Likewise, this preferred step does not apply to the first layer.
The invention also provides a scanning path planning device based on the twin laser, which comprises a memory, a processor and a computer program which is stored on the memory and can run on the processor, and is characterized in that the steps of the scanning path planning method based on the twin laser according to any embodiment are realized when the processor executes the computer program.
The invention further provides three-dimensional object manufacturing equipment, which comprises the scanning path planning device based on the twin laser in any embodiment.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A scanning path planning method based on dual lasers is characterized in that at most one workpiece to be printed in the current layer section of a work package is scanned by two lasers, other workpieces to be printed in the current layer section of the work package are scanned by only one laser, the workpieces to be printed which are scanned by the two lasers belong to contours, and areas filled by the upper surface and the lower surface are scanned by the same laser; wherein the method comprises the steps of:
step one, calculating the scanning time of the current layer section of the three-dimensional model corresponding to a plurality of workpieces to be printed in a work package, and calculating the total scanning time of all the three-dimensional models of the current layer section; dividing the total scanning time by 2 equals the preset scanning time of each laser;
selecting the three-dimensional model with the longest scanning time of the section of the current layer in the work package as an alternative model, and respectively selecting one laser for scanning other three-dimensional models in the work package;
step three, calculating the remaining scanning time to be distributed of the two lasers respectively, and selecting one laser to scan the alternative model when the scanning time of the alternative model is less than the remaining scanning time to be distributed of one laser in the two lasers; otherwise, scanning the alternative module by adopting two lasers;
when the two lasers are adopted to scan the alternative module, the total scanning time of the profile, the upper surface filling and the lower surface filling in the alternative model is calculated, and the laser with the largest time to be allocated in the two lasers is selected to scan the area of the profile, the upper surface filling and the lower surface filling in the alternative model.
2. The twin-laser based scan path planning method according to claim 1, wherein in step two, one laser is selected for scanning with respect to other three-dimensional models in the work package according to a principle of proximity.
3. The twin-laser based scan path planning method of claim 2, wherein the step of selecting one laser for scanning according to the proximity principle for each of the other three-dimensional models in the work package comprises:
step 21, selecting a laser, calculating the Euclidean distance from the laser to the section of the current layer of each three-dimensional model, and sequentially selecting the three-dimensional models from near to far;
and 22, accumulating and calculating the sum of the scanning time of the selected three-dimensional model until the sum of the scanning time exceeds the preset scanning time of the laser, selecting another laser, calculating the Euclidean distance from the laser to the current section of the rest three-dimensional model, and sequentially selecting the three-dimensional models from near to far.
4. The twin laser based scan path planning method according to any of claims 1 to 3, further comprising:
and judging that the laser selected by the contour area in the current layer section of each three-dimensional model is different from the laser selected by the contour area of the previous layer section, and selecting the laser selected by the contour area of the previous layer section of the three-dimensional model to scan the contour area in the current layer section.
5. The twin laser based scan path planning method of claim 4, further comprising:
when the current layer section of the three-dimensional model is scanned by only one laser, judging whether the laser selected by the current layer section of the three-dimensional model is the same as the laser selected by the previous layer section, and when the laser selected by the previous layer section of the three-dimensional model is different, selecting the laser selected by the previous layer section of the three-dimensional model to scan the current layer section.
6. The twin laser based scan path planning method of claim 5, wherein the scan time to be allocated is equal to the preset scan time of the laser minus the total scan time of the selected at least one three-dimensional model.
7. A twin-laser based scan path planning apparatus comprising a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the twin-laser based scan path planning method according to any of claims 1-6 when executing the computer program.
8. A three-dimensional object manufacturing apparatus comprising the twin laser based scan path planning apparatus of claim 7.
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| CN111097906B (en) * | 2019-12-20 | 2022-03-29 | 湖南华曙高科技股份有限公司 | Scanning distribution method and device based on multiple lasers and three-dimensional object manufacturing equipment |
| CN112417646B (en) * | 2020-10-20 | 2023-11-17 | 湖南华曙高科技股份有限公司 | Scanning path planning method and device based on odd number multiple lasers and three-dimensional object manufacturing equipment |
| CN117656481A (en) * | 2024-01-30 | 2024-03-08 | 湖南华曙高科技股份有限公司 | Scanning control method and device of additive manufacturing equipment and additive manufacturing equipment |
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| US11278988B2 (en) * | 2015-12-17 | 2022-03-22 | Eos Of North America, Inc. | Additive manufacturing method using large and small beam sizes |
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| CN106041083A (en) * | 2016-07-28 | 2016-10-26 | 湖南华曙高科技有限责任公司 | Scanning system and method for manufacturing three-dimensional object and three-dimensional object manufacturing equipment |
| CN109278288A (en) * | 2017-07-21 | 2019-01-29 | Cl产权管理有限公司 | For adding type manufacture the equipment of three-dimension object |
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| CN107498052A (en) * | 2017-09-22 | 2017-12-22 | 华中科技大学 | A kind of load balancing for more laser SLM building mortions scans manufacturing process |
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