TWI372185B - - Google Patents

Info

Publication number
TWI372185B
TWI372185B TW100118453A TW100118453A TWI372185B TW I372185 B TWI372185 B TW I372185B TW 100118453 A TW100118453 A TW 100118453A TW 100118453 A TW100118453 A TW 100118453A TW I372185 B TWI372185 B TW I372185B
Authority
TW
Taiwan
Application number
TW100118453A
Other languages
Chinese (zh)
Other versions
TW201211284A (en
Inventor
Yousuke Endo
Takamasa Maekawa
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201211284A publication Critical patent/TW201211284A/en
Application granted granted Critical
Publication of TWI372185B publication Critical patent/TWI372185B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW100118453A 2010-09-01 2011-05-26 Indium target and method for manufacturing same TW201211284A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010196213A JP4948634B2 (en) 2010-09-01 2010-09-01 Indium target and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201211284A TW201211284A (en) 2012-03-16
TWI372185B true TWI372185B (en) 2012-09-11

Family

ID=45772476

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100118453A TW201211284A (en) 2010-09-01 2011-05-26 Indium target and method for manufacturing same

Country Status (7)

Country Link
US (1) US9490108B2 (en)
EP (1) EP2612953A4 (en)
JP (1) JP4948634B2 (en)
KR (1) KR101202232B1 (en)
CN (1) CN102656291B (en)
TW (1) TW201211284A (en)
WO (1) WO2012029363A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5254290B2 (en) * 2010-09-01 2013-08-07 Ｊｘ日鉱日石金属株式会社 Indium target and manufacturing method thereof
JP4948634B2 (en) 2010-09-01 2012-06-06 Ｊｘ日鉱日石金属株式会社 Indium target and manufacturing method thereof
DE102011012034A1 (en) 2011-02-22 2012-08-23 Heraeus Materials Technology Gmbh & Co. Kg Tubular sputtering target
JP5140169B2 (en) 2011-03-01 2013-02-06 Ｊｘ日鉱日石金属株式会社 Indium target and manufacturing method thereof
JP5026611B1 (en) 2011-09-21 2012-09-12 Ｊｘ日鉱日石金属株式会社 Laminated structure and manufacturing method thereof
JP5074628B1 (en) 2012-01-05 2012-11-14 Ｊｘ日鉱日石金属株式会社 Indium sputtering target and method for manufacturing the same
US9761421B2 (en) 2012-08-22 2017-09-12 Jx Nippon Mining & Metals Corporation Indium cylindrical sputtering target and manufacturing method thereof
CN103789729A (en) * 2012-10-31 2014-05-14 光洋应用材料科技股份有限公司 Indium target material with tetragonal crystal structure
JP5968808B2 (en) * 2013-03-07 2016-08-10 Ｊｘ金属株式会社 Indium cylindrical target member and method of manufacturing cylindrical target member
JP5882248B2 (en) * 2013-03-21 2016-03-09 Ｊｘ金属株式会社 Cu-Ga alloy sputtering target, casting product for the sputtering target, and production method thereof
JP5746252B2 (en) * 2013-03-28 2015-07-08 光洋應用材料科技股▲分▼有限公司 Indium target with tetragonal crystal structure
CN104919080B (en) 2013-07-08 2018-10-16 Jx日矿日石金属株式会社 Sputtering target and its manufacturing method
US9136423B1 (en) * 2014-03-15 2015-09-15 Jehad A. Abushama Method and apparatus for depositing copper—indiumgalliumselenide (CuInGaSe2-CIGS) thin films and other materials on a substrate
JP6665428B2 (en) * 2014-07-08 2020-03-13 三菱マテリアル株式会社 Cu-Ga alloy sputtering target and manufacturing method thereof
JP6583019B2 (en) 2015-03-30 2019-10-02 三菱マテリアル株式会社 Cu-Ga alloy sputtering target and method for producing Cu-Ga alloy sputtering target
CN105910866B (en) * 2016-04-20 2017-06-16 中国科学院地质与地球物理研究所 Preparation method for preparing ion probe indium target assembly and ion probe indium target
CN108165936A (en) * 2017-12-21 2018-06-15 清远先导材料有限公司 The method for preparing indium target
JP6896966B1 (en) * 2020-10-01 2021-06-30 松田産業株式会社 Gold vapor deposition material

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JP4948634B2 (en) 2010-09-01 2012-06-06 Ｊｘ日鉱日石金属株式会社 Indium target and manufacturing method thereof
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DE102011012034A1 (en) 2011-02-22 2012-08-23 Heraeus Materials Technology Gmbh & Co. Kg Tubular sputtering target
JP5140169B2 (en) 2011-03-01 2013-02-06 Ｊｘ日鉱日石金属株式会社 Indium target and manufacturing method thereof
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JP4884561B1 (en) 2011-04-19 2012-02-29 Ｊｘ日鉱日石金属株式会社 Indium target and manufacturing method thereof
JP5026611B1 (en) 2011-09-21 2012-09-12 Ｊｘ日鉱日石金属株式会社 Laminated structure and manufacturing method thereof
JP5074628B1 (en) 2012-01-05 2012-11-14 Ｊｘ日鉱日石金属株式会社 Indium sputtering target and method for manufacturing the same
US9761421B2 (en) 2012-08-22 2017-09-12 Jx Nippon Mining & Metals Corporation Indium cylindrical sputtering target and manufacturing method thereof
CN104919080B (en) 2013-07-08 2018-10-16 Jx日矿日石金属株式会社 Sputtering target and its manufacturing method

Also Published As

Publication number Publication date
EP2612953A4 (en) 2014-01-22
TW201211284A (en) 2012-03-16
KR101202232B1 (en) 2012-11-16
WO2012029363A1 (en) 2012-03-08
CN102656291B (en) 2013-11-06
US20130153414A1 (en) 2013-06-20
EP2612953A1 (en) 2013-07-10
JP2012052193A (en) 2012-03-15
KR20120079149A (en) 2012-07-11
JP4948634B2 (en) 2012-06-06
CN102656291A (en) 2012-09-05
US9490108B2 (en) 2016-11-08

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