TWI372092B - Cmp pad having an overlapping stepped groove arrangement - Google Patents
Cmp pad having an overlapping stepped groove arrangementInfo
- Publication number
- TWI372092B TWI372092B TW094142891A TW94142891A TWI372092B TW I372092 B TWI372092 B TW I372092B TW 094142891 A TW094142891 A TW 094142891A TW 94142891 A TW94142891 A TW 94142891A TW I372092 B TWI372092 B TW I372092B
- Authority
- TW
- Taiwan
- Prior art keywords
- stepped groove
- cmp pad
- groove arrangement
- overlapping stepped
- overlapping
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/012,396 US7059949B1 (en) | 2004-12-14 | 2004-12-14 | CMP pad having an overlapping stepped groove arrangement |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200626294A TW200626294A (en) | 2006-08-01 |
TWI372092B true TWI372092B (en) | 2012-09-11 |
Family
ID=36576370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094142891A TWI372092B (en) | 2004-12-14 | 2005-12-06 | Cmp pad having an overlapping stepped groove arrangement |
Country Status (7)
Country | Link |
---|---|
US (1) | US7059949B1 (ja) |
JP (1) | JP4949677B2 (ja) |
KR (1) | KR101200424B1 (ja) |
CN (1) | CN100419965C (ja) |
DE (1) | DE102005059545A1 (ja) |
FR (1) | FR2879953B1 (ja) |
TW (1) | TWI372092B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7125318B2 (en) * | 2003-11-13 | 2006-10-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a groove arrangement for reducing slurry consumption |
US7520798B2 (en) * | 2007-01-31 | 2009-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to reduce slurry consumption |
US7520796B2 (en) * | 2007-01-31 | 2009-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to reduce slurry consumption |
US7311590B1 (en) | 2007-01-31 | 2007-12-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to retain slurry on the pad texture |
DE102007024954A1 (de) * | 2007-05-30 | 2008-12-04 | Siltronic Ag | Poliertuch für DSP und CMP |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US8062103B2 (en) * | 2008-12-23 | 2011-11-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate groove pattern |
US8057282B2 (en) * | 2008-12-23 | 2011-11-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate polishing method |
CN101817160A (zh) * | 2010-04-13 | 2010-09-01 | 王敬 | 硅锭的抛光方法、系统及抛光板 |
TWI599447B (zh) | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的cmp拋光墊 |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
CN113579992A (zh) | 2014-10-17 | 2021-11-02 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
WO2017074773A1 (en) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | An apparatus and method of forming a polishing article that has a desired zeta potential |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
CN115070606B (zh) * | 2022-06-30 | 2023-11-14 | 西安奕斯伟材料科技股份有限公司 | 一种用于对硅片进行抛光的抛光垫和抛光设备 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5177908A (en) | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
US5650039A (en) | 1994-03-02 | 1997-07-22 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved slurry distribution |
US5645469A (en) | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
JPH11156699A (ja) * | 1997-11-25 | 1999-06-15 | Speedfam Co Ltd | 平面研磨用パッド |
US5990012A (en) | 1998-01-27 | 1999-11-23 | Micron Technology, Inc. | Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads |
JP2000042901A (ja) * | 1998-07-29 | 2000-02-15 | Toshiba Ceramics Co Ltd | 研磨布およびその製造方法 |
GB2345255B (en) | 1998-12-29 | 2000-12-27 | United Microelectronics Corp | Chemical-Mechanical Polishing Pad |
US20020068516A1 (en) | 1999-12-13 | 2002-06-06 | Applied Materials, Inc | Apparatus and method for controlled delivery of slurry to a region of a polishing device |
KR100553834B1 (ko) * | 1999-12-27 | 2006-02-24 | 삼성전자주식회사 | 연마잔류물의 용이한 배출을 위한 구조를 갖는 화학기계적연마 패드 |
US6241596B1 (en) | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
KR20020022198A (ko) * | 2000-09-19 | 2002-03-27 | 윤종용 | 표면에 비 선형 트랙이 형성된 연마 패드를 구비하는화학적 기계적 연마 장치 |
JP2002200555A (ja) * | 2000-12-28 | 2002-07-16 | Ebara Corp | 研磨工具および該研磨工具を具備したポリッシング装置 |
US6783436B1 (en) * | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
US6843711B1 (en) | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Chemical mechanical polishing pad having a process-dependent groove configuration |
JP4563025B2 (ja) * | 2003-12-19 | 2010-10-13 | 東洋ゴム工業株式会社 | Cmp用研磨パッド、及びそれを用いた研磨方法 |
-
2004
- 2004-12-14 US US11/012,396 patent/US7059949B1/en active Active
-
2005
- 2005-11-29 KR KR1020050114711A patent/KR101200424B1/ko active IP Right Grant
- 2005-12-06 TW TW094142891A patent/TWI372092B/zh active
- 2005-12-13 DE DE102005059545A patent/DE102005059545A1/de not_active Ceased
- 2005-12-13 CN CNB200510131652XA patent/CN100419965C/zh not_active Expired - Fee Related
- 2005-12-14 JP JP2005360481A patent/JP4949677B2/ja active Active
- 2005-12-14 FR FR0512655A patent/FR2879953B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200626294A (en) | 2006-08-01 |
US20060128290A1 (en) | 2006-06-15 |
JP2006167908A (ja) | 2006-06-29 |
JP4949677B2 (ja) | 2012-06-13 |
KR20060067140A (ko) | 2006-06-19 |
DE102005059545A1 (de) | 2006-07-13 |
CN100419965C (zh) | 2008-09-17 |
CN1790624A (zh) | 2006-06-21 |
FR2879953A1 (fr) | 2006-06-30 |
KR101200424B1 (ko) | 2012-11-12 |
FR2879953B1 (fr) | 2009-02-13 |
US7059949B1 (en) | 2006-06-13 |
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