TWI370707B - - Google Patents
Info
- Publication number
- TWI370707B TWI370707B TW093126072A TW93126072A TWI370707B TW I370707 B TWI370707 B TW I370707B TW 093126072 A TW093126072 A TW 093126072A TW 93126072 A TW93126072 A TW 93126072A TW I370707 B TWI370707 B TW I370707B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003314815 | 2003-09-05 | ||
JP2004055565 | 2004-02-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200520632A TW200520632A (en) | 2005-06-16 |
TWI370707B true TWI370707B (en) | 2012-08-11 |
Family
ID=34621854
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101115977A TWI488236B (en) | 2003-09-05 | 2004-08-30 | Focusing ring and plasma processing device |
TW093126072A TW200520632A (en) | 2003-09-05 | 2004-08-30 | Focus ring and plasma processing apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101115977A TWI488236B (en) | 2003-09-05 | 2004-08-30 | Focusing ring and plasma processing device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5313211B2 (en) |
KR (1) | KR100576399B1 (en) |
CN (2) | CN100364064C (en) |
TW (2) | TWI488236B (en) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI234417B (en) * | 2001-07-10 | 2005-06-11 | Tokyo Electron Ltd | Plasma procesor and plasma processing method |
US20070032081A1 (en) | 2005-08-08 | 2007-02-08 | Jeremy Chang | Edge ring assembly with dielectric spacer ring |
US7988814B2 (en) | 2006-03-17 | 2011-08-02 | Tokyo Electron Limited | Plasma processing apparatus, plasma processing method, focus ring, and focus ring component |
JP2007250967A (en) * | 2006-03-17 | 2007-09-27 | Tokyo Electron Ltd | Plasma treating apparatus and method, and focus ring |
CN101447394B (en) * | 2007-11-28 | 2012-01-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for improving back pollution of work piece during manufacturing process of semiconductor |
JP5274918B2 (en) * | 2008-07-07 | 2013-08-28 | 東京エレクトロン株式会社 | Method for controlling temperature of chamber inner member of plasma processing apparatus, chamber inner member and substrate mounting table, and plasma processing apparatus including the same |
US8147648B2 (en) * | 2008-08-15 | 2012-04-03 | Lam Research Corporation | Composite showerhead electrode assembly for a plasma processing apparatus |
US20100101729A1 (en) * | 2008-10-28 | 2010-04-29 | Applied Materials, Inc. | Process kit having reduced erosion sensitivity |
JP2010278166A (en) * | 2009-05-27 | 2010-12-09 | Tokyo Electron Ltd | Annular component for plasma treatment, and plasma treatment device |
JP5563347B2 (en) | 2010-03-30 | 2014-07-30 | 東京エレクトロン株式会社 | Plasma processing apparatus and semiconductor device manufacturing method |
JP5741124B2 (en) * | 2011-03-29 | 2015-07-01 | 東京エレクトロン株式会社 | Plasma processing equipment |
US20130000848A1 (en) * | 2011-07-01 | 2013-01-03 | Novellus Systems Inc. | Pedestal with edge gas deflector for edge profile control |
JP5970268B2 (en) * | 2012-07-06 | 2016-08-17 | 株式会社日立ハイテクノロジーズ | Plasma processing apparatus and processing method |
US20160099162A1 (en) * | 2013-06-26 | 2016-04-07 | Applied Materials, Inc. | Single ring design for high yield, substrate extreme edge defect reduction in icp plasma processing chamber |
JP2015115421A (en) * | 2013-12-10 | 2015-06-22 | 東京エレクトロン株式会社 | Plasma processing apparatus and focus ring |
WO2015116245A1 (en) * | 2014-01-30 | 2015-08-06 | Applied Materials, Inc. | Gas confiner assembly for eliminating shadow frame |
WO2015116244A1 (en) | 2014-01-30 | 2015-08-06 | Applied Materials, Inc. | Corner spoiler for improving profile uniformity |
CN103811247B (en) * | 2014-02-17 | 2016-04-13 | 清华大学 | For plasma etching focusing ring and there is its plasma etching apparatus |
JP5615454B1 (en) * | 2014-02-25 | 2014-10-29 | コバレントマテリアル株式会社 | Focus ring |
CN106920725B (en) * | 2015-12-24 | 2018-10-12 | 中微半导体设备(上海)有限公司 | A kind of temperature adjustment device and method of focusing ring |
KR20180099776A (en) | 2016-01-26 | 2018-09-05 | 어플라이드 머티어리얼스, 인코포레이티드 | Wafer edge ring lifting solution |
JP6888007B2 (en) * | 2016-01-26 | 2021-06-16 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Wafer edge ring lifting solution |
JP6586394B2 (en) * | 2016-03-28 | 2019-10-02 | 東京エレクトロン株式会社 | How to get data representing capacitance |
US10910195B2 (en) * | 2017-01-05 | 2021-02-02 | Lam Research Corporation | Substrate support with improved process uniformity |
KR102205922B1 (en) * | 2017-03-31 | 2021-01-22 | 베이징 이타운 세미컨덕터 테크놀로지 컴퍼니 리미티드 | Prevents material deposition on the workpiece in the process |
JP6278498B1 (en) * | 2017-05-19 | 2018-02-14 | 日本新工芯技株式会社 | Ring-shaped member manufacturing method and ring-shaped member |
US20180334746A1 (en) * | 2017-05-22 | 2018-11-22 | Lam Research Corporation | Wafer Edge Contact Hardware and Methods to Eliminate Deposition at Wafer Backside Edge and Notch |
JP6797079B2 (en) * | 2017-06-06 | 2020-12-09 | 東京エレクトロン株式会社 | Plasma processing equipment, plasma control method, and plasma control program |
JP6974088B2 (en) * | 2017-09-15 | 2021-12-01 | 東京エレクトロン株式会社 | Plasma processing equipment and plasma processing method |
SG11201908445PA (en) * | 2017-10-17 | 2020-05-28 | Ulvac Inc | Object processing apparatus |
US10790123B2 (en) | 2018-05-28 | 2020-09-29 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
JP6846384B2 (en) * | 2018-06-12 | 2021-03-24 | 東京エレクトロン株式会社 | Method of controlling high frequency power supply of plasma processing equipment and plasma processing equipment |
US11935773B2 (en) | 2018-06-14 | 2024-03-19 | Applied Materials, Inc. | Calibration jig and calibration method |
US11289310B2 (en) | 2018-11-21 | 2022-03-29 | Applied Materials, Inc. | Circuits for edge ring control in shaped DC pulsed plasma process device |
KR102214333B1 (en) | 2019-06-27 | 2021-02-10 | 세메스 주식회사 | Apparatus and method for treating substrate |
JP7278160B2 (en) * | 2019-07-01 | 2023-05-19 | 東京エレクトロン株式会社 | Etching method and plasma processing apparatus |
KR102503478B1 (en) * | 2019-12-18 | 2023-02-27 | 주식회사 히타치하이테크 | plasma processing unit |
JP7365912B2 (en) * | 2020-01-10 | 2023-10-20 | 東京エレクトロン株式会社 | Edge ring and substrate processing equipment |
TWI824722B (en) * | 2022-09-16 | 2023-12-01 | 鴻揚半導體股份有限公司 | Focus ring and method for processing semiconductor wafer |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100264445B1 (en) * | 1993-10-04 | 2000-11-01 | 히가시 데쓰로 | Plasma treatment equipment |
US6284093B1 (en) * | 1996-11-29 | 2001-09-04 | Applied Materials, Inc. | Shield or ring surrounding semiconductor workpiece in plasma chamber |
WO1999014788A1 (en) * | 1997-09-16 | 1999-03-25 | Applied Materials, Inc. | Shield or ring surrounding semiconductor workpiece in plasma chamber |
JP3531511B2 (en) * | 1998-12-22 | 2004-05-31 | 株式会社日立製作所 | Plasma processing equipment |
JP2000208492A (en) * | 1999-01-18 | 2000-07-28 | Sony Corp | Method and system for tungsten plasma etching |
US7030335B2 (en) * | 2000-03-17 | 2006-04-18 | Applied Materials, Inc. | Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression |
US6391787B1 (en) * | 2000-10-13 | 2002-05-21 | Lam Research Corporation | Stepped upper electrode for plasma processing uniformity |
US6554954B2 (en) * | 2001-04-03 | 2003-04-29 | Applied Materials Inc. | Conductive collar surrounding semiconductor workpiece in plasma chamber |
TWI234417B (en) * | 2001-07-10 | 2005-06-11 | Tokyo Electron Ltd | Plasma procesor and plasma processing method |
AU2002366921A1 (en) * | 2001-12-13 | 2003-07-09 | Tokyo Electron Limited | Ring mechanism, and plasma processing device using the ring mechanism |
JP2008017090A (en) * | 2006-07-05 | 2008-01-24 | Casio Comput Co Ltd | Imaging apparatus and electronic zoom method |
-
2004
- 2004-08-30 TW TW101115977A patent/TWI488236B/en not_active IP Right Cessation
- 2004-08-30 TW TW093126072A patent/TW200520632A/en not_active IP Right Cessation
- 2004-09-03 KR KR1020040070432A patent/KR100576399B1/en active IP Right Grant
- 2004-09-06 CN CNB2004100784994A patent/CN100364064C/en active Active
- 2004-09-06 CN CN2007101946078A patent/CN101162689B/en not_active Expired - Fee Related
-
2010
- 2010-07-14 JP JP2010159320A patent/JP5313211B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200520632A (en) | 2005-06-16 |
CN1591793A (en) | 2005-03-09 |
TW201243942A (en) | 2012-11-01 |
KR20050025079A (en) | 2005-03-11 |
JP2010232694A (en) | 2010-10-14 |
CN101162689B (en) | 2010-08-18 |
TWI488236B (en) | 2015-06-11 |
KR100576399B1 (en) | 2006-05-03 |
JP5313211B2 (en) | 2013-10-09 |
CN100364064C (en) | 2008-01-23 |
CN101162689A (en) | 2008-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |