TWI370160B - Conductive polymer coating composition, method of preparing coating film using the conductive polymer coating composition, and coating film prepared using the method - Google Patents

Conductive polymer coating composition, method of preparing coating film using the conductive polymer coating composition, and coating film prepared using the method

Info

Publication number
TWI370160B
TWI370160B TW096131477A TW96131477A TWI370160B TW I370160 B TWI370160 B TW I370160B TW 096131477 A TW096131477 A TW 096131477A TW 96131477 A TW96131477 A TW 96131477A TW I370160 B TWI370160 B TW I370160B
Authority
TW
Taiwan
Prior art keywords
conductive polymer
coating film
coating composition
polymer coating
preparing
Prior art date
Application number
TW096131477A
Other languages
English (en)
Chinese (zh)
Other versions
TW200817482A (en
Inventor
Jung Hyun Son
Jong Dai Park
Han Bok Joo
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200817482A publication Critical patent/TW200817482A/zh
Application granted granted Critical
Publication of TWI370160B publication Critical patent/TWI370160B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)
TW096131477A 2006-08-25 2007-08-24 Conductive polymer coating composition, method of preparing coating film using the conductive polymer coating composition, and coating film prepared using the method TWI370160B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060081166A KR101266525B1 (ko) 2006-08-25 2006-08-25 전도성 고분자 코팅 조성물, 그를 이용한 코팅필름의 제조방법 및 그 코팅필름

Publications (2)

Publication Number Publication Date
TW200817482A TW200817482A (en) 2008-04-16
TWI370160B true TWI370160B (en) 2012-08-11

Family

ID=39234938

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096131477A TWI370160B (en) 2006-08-25 2007-08-24 Conductive polymer coating composition, method of preparing coating film using the conductive polymer coating composition, and coating film prepared using the method

Country Status (3)

Country Link
JP (1) JP4874896B2 (ja)
KR (1) KR101266525B1 (ja)
TW (1) TWI370160B (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5092653B2 (ja) * 2007-09-28 2012-12-05 大日本印刷株式会社 ハードディスクドライブ用サスペンション
JP5543695B2 (ja) * 2008-04-04 2014-07-09 株式会社サクラクレパス 水性光輝性インキ組成物
KR100989114B1 (ko) * 2008-08-07 2010-10-20 도레이첨단소재 주식회사 대전방지 폴리에스테르 필름의 제조방법, 그로부터 제조된대전방지 폴리에스테르 필름 및 그 용도
KR101048893B1 (ko) * 2009-02-03 2011-07-13 에스케이씨 주식회사 방오성 대전방지 폴리에스테르 필름
KR101077822B1 (ko) * 2009-02-17 2011-10-31 도레이첨단소재 주식회사 코팅외관 결점이 개선된 대전방지 폴리에스테르 필름 및 그제조방법
US20100270055A1 (en) * 2009-04-27 2010-10-28 Air Products And Chemicals, Inc. Electrically Conductive Films Formed From Dispersions Comprising Conductive Polymers and Polyurethanes
TWI398498B (zh) * 2009-06-09 2013-06-11 Toray Advanced Mat Korea Inc 含有乙炔二醇界面活性劑之抗靜電聚酯膜及其製造方法
JP5542490B2 (ja) * 2010-03-23 2014-07-09 信越ポリマー株式会社 導電性塗料および導電性成形物の製造方法
KR101285853B1 (ko) * 2010-12-23 2013-07-12 도레이첨단소재 주식회사 편광판 보호용 폴리에스테르 필름
KR101122922B1 (ko) * 2011-07-13 2012-03-21 정협화 필름 코팅용 페이스트 및 이를 이용하여 복원 기능을 갖는 보호필름을 제조하는 방법
KR101306039B1 (ko) * 2011-12-30 2013-09-09 도레이첨단소재 주식회사 대전방지 코팅 조성물 및 그를 이용한 대전방지 폴리에스테르 필름
JP2013199052A (ja) * 2012-03-26 2013-10-03 Mitsubishi Plastics Inc 帯電防止フィルム
KR101284017B1 (ko) * 2013-01-08 2013-07-17 박동배 대전방지 처리된 디스플레이용 컨베이어 롤러 샤프트의 제조방법
JP6285769B2 (ja) * 2013-03-26 2018-02-28 積水化学工業株式会社 ポリビニルアセタール系樹脂組成物
KR200482964Y1 (ko) 2016-07-01 2017-03-21 송민아 영유아용 키 측정기구
KR20210131384A (ko) * 2019-03-22 2021-11-02 헨켈 아게 운트 코. 카게아아 전자 부품 방수를 위한 코팅물

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000026817A (ja) * 1998-07-14 2000-01-25 Teijin Ltd 表面保護フィルム
JP3996800B2 (ja) * 2002-05-08 2007-10-24 藤森工業株式会社 表面保護フィルムおよびそれを用いた積層体
KR100508124B1 (ko) 2003-03-05 2005-08-19 서광석 캐리어 테이프용 고분자 필름 및 이의 제조방법
JP2006117906A (ja) * 2004-09-24 2006-05-11 Shin Etsu Polymer Co Ltd 帯電防止塗料、帯電防止膜及び帯電防止フィルム、光学フィルタ、光情報記録媒体
JP4578950B2 (ja) * 2004-11-24 2010-11-10 大日精化工業株式会社 光学用保護フィルム
JP4611868B2 (ja) * 2004-11-24 2011-01-12 大日精化工業株式会社 光学用保護フィルム
JP4684082B2 (ja) 2004-11-24 2011-05-18 大日精化工業株式会社 光学用保護フィルム

Also Published As

Publication number Publication date
TW200817482A (en) 2008-04-16
JP4874896B2 (ja) 2012-02-15
JP2008050609A (ja) 2008-03-06
KR20080018678A (ko) 2008-02-28
KR101266525B1 (ko) 2013-05-27

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