TWI370097B - Vacuum suction apparatus - Google Patents
Vacuum suction apparatusInfo
- Publication number
- TWI370097B TWI370097B TW098109734A TW98109734A TWI370097B TW I370097 B TWI370097 B TW I370097B TW 098109734 A TW098109734 A TW 098109734A TW 98109734 A TW98109734 A TW 98109734A TW I370097 B TWI370097 B TW I370097B
- Authority
- TW
- Taiwan
- Prior art keywords
- vacuum suction
- suction apparatus
- vacuum
- suction
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098109734A TWI370097B (en) | 2009-03-25 | 2009-03-25 | Vacuum suction apparatus |
JP2009126936A JP4994423B2 (ja) | 2009-03-25 | 2009-05-26 | 真空吸引装置 |
KR1020090051127A KR101068192B1 (ko) | 2009-03-25 | 2009-06-09 | 진공 흡착 장치 |
JP2011154116A JP5215437B2 (ja) | 2009-03-25 | 2011-07-12 | 真空吸引装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098109734A TWI370097B (en) | 2009-03-25 | 2009-03-25 | Vacuum suction apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201034927A TW201034927A (en) | 2010-10-01 |
TWI370097B true TWI370097B (en) | 2012-08-11 |
Family
ID=43045096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098109734A TWI370097B (en) | 2009-03-25 | 2009-03-25 | Vacuum suction apparatus |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP4994423B2 (zh) |
KR (1) | KR101068192B1 (zh) |
TW (1) | TWI370097B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105277868A (zh) * | 2014-07-11 | 2016-01-27 | 致茂电子(苏州)有限公司 | 测试装置 |
TWI613449B (zh) * | 2016-12-30 | 2018-02-01 | 致茂電子股份有限公司 | 吸附式測試裝置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013240870A (ja) * | 2012-05-22 | 2013-12-05 | Kansai Univ | 把持装置 |
JP6181799B1 (ja) * | 2016-04-01 | 2017-08-16 | ソウ テクノロジー カンパニー、リミテッド | 半導体ストリップグラインダー |
TWI670784B (zh) * | 2016-10-05 | 2019-09-01 | 啟端光電股份有限公司 | 真空吸取裝置 |
US10978332B2 (en) * | 2016-10-05 | 2021-04-13 | Prilit Optronics, Inc. | Vacuum suction apparatus |
CN107263410A (zh) * | 2017-06-19 | 2017-10-20 | 杨煜海 | 一种汽车配件加工用支撑台 |
CN108705690B (zh) * | 2018-05-29 | 2020-08-25 | 新昌县皇骐电子科技有限公司 | 一种半导体晶圆划片机 |
CN109256351B (zh) * | 2018-09-20 | 2021-06-08 | 南方科技大学 | 微型芯片的批量转移装置以及转移方法 |
CN112850149A (zh) * | 2021-01-13 | 2021-05-28 | 深圳市明信测试设备股份有限公司 | 一种简易传送机构装置 |
CN113305601A (zh) * | 2021-06-16 | 2021-08-27 | 嘉兴职业技术学院 | 一种数控机床自适应定位装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03232640A (ja) * | 1990-02-05 | 1991-10-16 | Mitsubishi Electric Corp | 吸着装置 |
JPH05305592A (ja) * | 1992-04-28 | 1993-11-19 | Sony Corp | 真空チャック |
JPH06238589A (ja) * | 1993-02-12 | 1994-08-30 | Natl House Ind Co Ltd | ワーク吸着装置 |
JPH06270087A (ja) * | 1993-03-22 | 1994-09-27 | Ebara Corp | 真空吸着装置 |
JPH1034580A (ja) * | 1996-07-22 | 1998-02-10 | Sekisui Chem Co Ltd | 水硬性無機質成形体の移送装置及び脱型装置 |
JP2001267271A (ja) | 2000-03-22 | 2001-09-28 | Yoshioka Seiko:Kk | 吸着装置 |
JP2006319182A (ja) * | 2005-05-13 | 2006-11-24 | Toyota Motor Corp | 吸着保持装置 |
JP2007322806A (ja) | 2006-06-01 | 2007-12-13 | Nsk Ltd | 露光装置の基板保持機構 |
-
2009
- 2009-03-25 TW TW098109734A patent/TWI370097B/zh active
- 2009-05-26 JP JP2009126936A patent/JP4994423B2/ja active Active
- 2009-06-09 KR KR1020090051127A patent/KR101068192B1/ko active IP Right Grant
-
2011
- 2011-07-12 JP JP2011154116A patent/JP5215437B2/ja active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105277868A (zh) * | 2014-07-11 | 2016-01-27 | 致茂电子(苏州)有限公司 | 测试装置 |
CN105277868B (zh) * | 2014-07-11 | 2018-06-26 | 致茂电子(苏州)有限公司 | 测试装置 |
TWI613449B (zh) * | 2016-12-30 | 2018-02-01 | 致茂電子股份有限公司 | 吸附式測試裝置 |
Also Published As
Publication number | Publication date |
---|---|
JP2010228909A (ja) | 2010-10-14 |
JP5215437B2 (ja) | 2013-06-19 |
JP2011238954A (ja) | 2011-11-24 |
JP4994423B2 (ja) | 2012-08-08 |
KR101068192B1 (ko) | 2011-09-28 |
KR20100107368A (ko) | 2010-10-05 |
TW201034927A (en) | 2010-10-01 |
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