TWI369472B - Magnetic annealing tool heat exchange system and processes - Google Patents

Magnetic annealing tool heat exchange system and processes

Info

Publication number
TWI369472B
TWI369472B TW095143222A TW95143222A TWI369472B TW I369472 B TWI369472 B TW I369472B TW 095143222 A TW095143222 A TW 095143222A TW 95143222 A TW95143222 A TW 95143222A TW I369472 B TWI369472 B TW I369472B
Authority
TW
Taiwan
Prior art keywords
processes
heat exchange
exchange system
magnetic annealing
tool heat
Prior art date
Application number
TW095143222A
Other languages
English (en)
Other versions
TW200732613A (en
Inventor
Richard John Jibb
John Fredric Billingham
Original Assignee
Praxair Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praxair Technology Inc filed Critical Praxair Technology Inc
Publication of TW200732613A publication Critical patent/TW200732613A/zh
Application granted granted Critical
Publication of TWI369472B publication Critical patent/TWI369472B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D15/00—Handling or treating discharged material; Supports or receiving chambers therefor
    • F27D15/02—Cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Hall/Mr Elements (AREA)
  • Furnace Details (AREA)
  • Furnace Charging Or Discharging (AREA)
TW095143222A 2005-12-06 2006-11-22 Magnetic annealing tool heat exchange system and processes TWI369472B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/294,477 US7479621B2 (en) 2005-12-06 2005-12-06 Magnetic annealing tool heat exchange system and processes

Publications (2)

Publication Number Publication Date
TW200732613A TW200732613A (en) 2007-09-01
TWI369472B true TWI369472B (en) 2012-08-01

Family

ID=37680664

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143222A TWI369472B (en) 2005-12-06 2006-11-22 Magnetic annealing tool heat exchange system and processes

Country Status (7)

Country Link
US (2) US7479621B2 (zh)
EP (2) EP1964160B1 (zh)
JP (1) JP4960971B2 (zh)
KR (1) KR101328278B1 (zh)
CN (1) CN101371331B (zh)
TW (1) TWI369472B (zh)
WO (2) WO2007067312A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645042B (zh) * 2014-09-03 2018-12-21 日商東京威力科創股份有限公司 磁性退火裝置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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US7479621B2 (en) * 2005-12-06 2009-01-20 Praxair Technology, Inc. Magnetic annealing tool heat exchange system and processes
TWI585298B (zh) * 2008-04-04 2017-06-01 布魯克機械公司 利用錫銻合金的低溫泵及其使用方法
DE202008010550U1 (de) * 2008-08-08 2008-10-30 Ipsen International Gmbh Elektrisch beheizter Retortenofen zur Wärmebehandlung von metallischen Werkstücken
JP5324863B2 (ja) * 2008-08-22 2013-10-23 株式会社神戸製鋼所 真空炉及びこの真空炉を用いた磁場中加熱処理装置
US20120168143A1 (en) * 2010-12-30 2012-07-05 Poole Ventura, Inc. Thermal Diffusion Chamber With Heat Exchanger
JP2014081096A (ja) * 2012-10-15 2014-05-08 Ebara Corp 真空加熱炉
JP6333126B2 (ja) * 2014-08-29 2018-05-30 東京エレクトロン株式会社 磁気アニール装置及び磁気アニール方法
WO2017116686A1 (en) * 2015-12-30 2017-07-06 Mattson Technology, Inc. Fluid leakage detection for a millisecond anneal system
NL2017558B1 (en) * 2016-09-30 2018-04-10 Tempress Ip B V A chemical vapour deposition apparatus and use thereof
US10003018B1 (en) * 2017-05-08 2018-06-19 Tokyo Electron Limited Vertical multi-batch magnetic annealing systems for reduced footprint manufacturing environments
EP3530776B1 (fr) * 2018-02-26 2020-07-08 Cockerill Maintenance & Ingenierie S.A. Installation et procédé de traitement de surface localisé pour pièces industrielles
US20210193488A1 (en) * 2018-07-11 2021-06-24 Hewlett-Packard Development Company, L.P. Annealing devices including thermal heaters
US11515129B2 (en) * 2019-12-03 2022-11-29 Applied Materials, Inc. Radiation shield modification for improving substrate temperature uniformity
CN113380672B (zh) * 2021-06-08 2024-05-17 北京北方华创微电子装备有限公司 半导体热处理设备

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US2762892A (en) * 1951-05-04 1956-09-11 Peterson Gerald H Electrical induction welding method and apparatus
US3311732A (en) * 1961-10-27 1967-03-28 North American Aviation Inc Induction heating means
BE744908A (fr) * 1969-02-01 1970-07-01 Euratom Appareil pour l'etude de l'evolution de la structure de carbured'uranium soumis a un gradient thermique radial
US4563558A (en) * 1983-12-27 1986-01-07 United Technologies Corporation Directional recrystallization furnace providing convex isotherm temperature distribution
JPH0621012A (ja) * 1992-07-02 1994-01-28 Fujitsu Ltd 半導体製造方法及び製造装置
US5525780A (en) * 1993-08-31 1996-06-11 Texas Instruments Incorporated Method and apparatus for uniform semiconductor material processing using induction heating with a chuck member
JP2723815B2 (ja) * 1995-02-28 1998-03-09 東北日本電気株式会社 電磁軟鉄部品の熱処理方法
JP3100376B1 (ja) 1999-06-23 2000-10-16 助川電気工業株式会社 縦型加熱装置
US6496648B1 (en) 1999-08-19 2002-12-17 Prodeo Technologies, Inc. Apparatus and method for rapid thermal processing
US6303908B1 (en) 1999-08-26 2001-10-16 Nichiyo Engineering Corporation Heat treatment apparatus
JP2001135543A (ja) * 1999-08-26 2001-05-18 Nikko Consulting & Engineering Co Ltd 熱処理装置
JP3263383B2 (ja) 1999-09-29 2002-03-04 助川電気工業株式会社 縦型加熱装置
US6350299B1 (en) * 2000-02-28 2002-02-26 Dekker Vacuun Technologies, Inc. Multi-chambered air/oil separator
JP2001263957A (ja) * 2000-03-22 2001-09-26 Toho Gas Co Ltd 真空炉
JP3404023B2 (ja) 2001-02-13 2003-05-06 株式会社半導体先端テクノロジーズ ウエハ熱処理装置及びウエハ熱処理方法
FR2821925B1 (fr) * 2001-03-06 2003-05-16 Celes Enceinte d'etancheite au gaz et au vide d'isolation thermique destinee a un dispositif de chauffage par induction
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US7479621B2 (en) * 2005-12-06 2009-01-20 Praxair Technology, Inc. Magnetic annealing tool heat exchange system and processes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645042B (zh) * 2014-09-03 2018-12-21 日商東京威力科創股份有限公司 磁性退火裝置

Also Published As

Publication number Publication date
KR20080080165A (ko) 2008-09-02
JP2009518617A (ja) 2009-05-07
US8198570B2 (en) 2012-06-12
US20070125767A1 (en) 2007-06-07
EP1961034B1 (en) 2019-06-12
KR101328278B1 (ko) 2013-11-14
US7479621B2 (en) 2009-01-20
TW200732613A (en) 2007-09-01
JP4960971B2 (ja) 2012-06-27
WO2007066314A1 (en) 2007-06-14
US20090095737A1 (en) 2009-04-16
US20080121634A2 (en) 2008-05-29
CN101371331B (zh) 2010-12-22
EP1961034A1 (en) 2008-08-27
EP1964160A1 (en) 2008-09-03
CN101371331A (zh) 2009-02-18
EP1964160B1 (en) 2020-05-27
WO2007067312A1 (en) 2007-06-14

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