TWI368290B - Vision inspection system for semiconductor devices - Google Patents

Vision inspection system for semiconductor devices

Info

Publication number
TWI368290B
TWI368290B TW097111279A TW97111279A TWI368290B TW I368290 B TWI368290 B TW I368290B TW 097111279 A TW097111279 A TW 097111279A TW 97111279 A TW97111279 A TW 97111279A TW I368290 B TWI368290 B TW I368290B
Authority
TW
Taiwan
Prior art keywords
semiconductor devices
inspection system
vision inspection
vision
semiconductor
Prior art date
Application number
TW097111279A
Other languages
English (en)
Other versions
TW200901349A (en
Inventor
Ssang Gun Lim
Sang Yun Lee
Byeong Gwon Joo
Dong Kyu Son
Original Assignee
Intekplus Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of TW200901349A publication Critical patent/TW200901349A/zh
Application granted granted Critical
Publication of TWI368290B publication Critical patent/TWI368290B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Environmental & Geological Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW097111279A 2007-03-30 2008-03-28 Vision inspection system for semiconductor devices TWI368290B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070031866A KR100833716B1 (ko) 2007-03-30 2007-03-30 반도체 소자 비전 검사 시스템

Publications (2)

Publication Number Publication Date
TW200901349A TW200901349A (en) 2009-01-01
TWI368290B true TWI368290B (en) 2012-07-11

Family

ID=39665698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097111279A TWI368290B (en) 2007-03-30 2008-03-28 Vision inspection system for semiconductor devices

Country Status (3)

Country Link
KR (1) KR100833716B1 (zh)
TW (1) TWI368290B (zh)
WO (1) WO2008120881A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201011849A (en) 2008-09-03 2010-03-16 King Yuan Electronics Co Ltd Bare die dual-face detector
KR100991511B1 (ko) 2008-10-09 2010-11-04 (주) 인텍플러스 5면 비전 검사 시스템
KR101028723B1 (ko) * 2008-12-31 2011-04-14 주식회사 프로텍 반도체 공정용 자재 운반장치 및 자재 운반방법
KR101124691B1 (ko) 2010-01-27 2012-03-20 (주)제이티 소자검사장치 및 검사방법
KR101076741B1 (ko) * 2010-03-04 2011-10-26 (주)에스엠솔루션즈 테스트 핸들러의 반도체 소자 비전검사 시스템 및 그 방법
KR101315892B1 (ko) * 2010-07-05 2013-10-15 한미반도체 주식회사 반도체 패키지 비전 검사방법
TWI570823B (zh) * 2013-08-14 2017-02-11 新川股份有限公司 半導體製造裝置以及半導體裝置的製造方法
KR102594344B1 (ko) * 2016-06-14 2023-10-26 (주)제이티 소자핸들러
CN112934725A (zh) * 2021-02-23 2021-06-11 深圳市智立方自动化设备股份有限公司 一种芯片外观自动检测设备及其控制方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3099183B2 (ja) * 1997-05-14 2000-10-16 株式会社東京精密 ウェーハプロービングマシン
JP4118160B2 (ja) * 2003-02-17 2008-07-16 株式会社日立ハイテクノロジーズ ウェハ外観検査装置
JP2005274243A (ja) 2004-03-23 2005-10-06 Olympus Corp 被検体の検査装置及びその検査方法

Also Published As

Publication number Publication date
WO2008120881A1 (en) 2008-10-09
TW200901349A (en) 2009-01-01
KR100833716B1 (ko) 2008-05-29

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