TWI364406B - Glass substrate for flat panel display device - Google Patents

Description

Ί364406 " IX. Description of the Invention: [Technical Field] The present invention relates to a flat panel display device, and more particularly to a glass substrate suitable for use in a plasma display device. [Prior Art] - The plasma display device is fabricated in the following manner. First, a transparent electrode made of a ITO film or a transparent conductive film (by a (10) film) or the like is formed on the surface of the front glass substrate, and a dielectric material is applied thereon, and then fired at a temperature of about 500 Å to 600 C. A dielectric layer is formed. Further, the back surface glass substrate on which the electrode composed of Ag, Ni, or the like is formed is coated with a back dielectric material, and then fired at a temperature of about 500 to 60 (rc) to form a dielectric layer, and The partition material is applied to the upper portion thereof, and then fired at a temperature of about 500 to 600 C to form a partition wall, thereby forming an electric circuit. Then, the front glass substrate and the rear glass substrate are opposed to each other to position the electrodes and the like, and then The thickness of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs of the slabs. (social lime) glass (thermal expansion coefficient is about 84 X io'7/°c). In addition, the thermal expansion coefficient of the insulating material, the rib paste, and the surrounding material is also adjusted to match the soda lime glass. 70 to 90x 10_V ° C. However, the limestone glass has a strain point of about 500, so when heat treated at 570 to 600 ° C, it will cause thermal deformation or heat shrinkage. Significant change in size As a result, when the front 317203 5 1364406 surface glass substrate and the rear glass substrate are opposed to each other, it is difficult to achieve the alignment of the electrodes with good precision production, which is particularly difficult to produce in a large-scale high-definition electro-frequency display device. The soda lime glass is at 15 〇. The volume resistivity (1 〇 gp ) of the underarm is 8. 4 Ω · Cm low value, and the alkali component of the glass has a large mobility. Therefore, there is also an alkali component in the glass. It reacts with a thin film electrode such as an IT0 film or a transparent conductive film, and has a problem of changing the resistance value of the electrode material. Because of these cases, it has the same thermal expansion coefficient as the limestone glass and has a higher volume resistance than the soda lime glass. The glass of the rate and the strain point is used as a glass substrate to produce a large-scale high-definition plasma display device. [Patent Document 1] JP-A-H08-290938 [Patent Document 2] Japanese Patent Laid-Open No. 8-29-939 Bulletin [Invention] A water-electric display has a large power consumption compared to other display devices. From the viewpoint of environmental protection and energy saving, it is urgent to reduce the display. In view of the power consumption, it is expected that the glass power for reducing the power consumption of the glass power supply is to provide a glass substrate for a thousand-panel panel display device which can reduce the consumption of the display device. The panel people conducted various reviews and found that the glass base was lowered. The power consumption of the display device can be reduced, so that the glass substrate of the flat panel display of the present invention is 317203 6 1364406% " characterized by a dielectric constant of 7 at 25 ° C and 1 MHz. Since the glass substrate of the present invention has a low dielectric constant and can reduce the power consumption of the display device, it is suitable for use as a flat panel display device, in particular, a glass substrate for an electro-optic display device. [Embodiment]: The plane of the present invention The glass substrate for the panel display device is at 25. (:, the dielectric constant at -1MHz is a low value of 7. 〇 below, so the power consumption of the display device can be reduced. If the dielectric constant of the glass substrate becomes high, it is difficult to reduce the power consumption of the display device. The preferred value of the dielectric constant of the glass substrate is 6.9 or less, preferably 6.8 or less, and more preferably 6.7 or less. Further, the display device can be lowered by lowering the dielectric constant of the glass substrate. The reason for the power consumption is that when the dielectric constant of the glass substrate is low, the amount of current required to cause the unit cell to emit light once is reduced/small. Moreover, in the glass substrate of the present invention, in order to suppress In the heat treatment step in the manufacture of the display device, the thermal deformation or the thermal contraction of the glass substrate is preferably such that the strain point of the glass is 58 (rc or more (more preferably 585 or more, still more preferably 595 Å or more). In addition, when the molten glass is formed into a plate shape, it is easy to form the mold so as not to burden the molding apparatus, and it is preferable to set the temperature of the glass melt corresponding to the viscosity of 丨〇4dpa·s to 12 〇 or less (more preferably Is 118 (rc& More preferably, it is 117 (below TC). In addition, in order to obtain the thermal expansion coefficient of the material encountered with the insulating paste, the barrier wall slurry, and the melt seal, and to obtain heat resistance which is not easily broken even if it is rapidly cooled. Preferably, the glass substrate has a thermal expansion coefficient of 60 to 80 χ 1 『 7 ° C (more preferably 65 to 75 χ 10·7 ° C, still more preferably 67 to 73× 10 ). -7/°C). In order to adjust the dielectric constant of the glass substrate to 7. 〇 or less, it can be adjusted by increasing the content of S1O2 or reducing the content of MgO, CaO, SrO, and BaO. As long as the mass percentage: Si〇2 is 50: to 75%, Ah〇3 is 0 to 20%, B2O3 is 0 to 20%, and MgO is 0 to 15%.

CaO is 0 to 15%, SrO is 0 to 15%, BaO is 〇 to 15%, ZnO is 0 to 5%, Li2〇 is 0 to 5%, Na2〇 is 0 to 15%, and κ2 is 0 to 15 %, φ ZrCh may be appropriately selected within the range of 0 to 10%. In addition, in order to obtain a dielectric constant having a dielectric constant of 7.0 or less, a strain point of 580 ° C or more, a viscosity of a glass solution corresponding to a viscosity of 1 ° 4 dPa · s at 1180 ° C or lower, and 60 to 80 x 1 (T7/t The thermal expansion coefficient of the glass substrate 'in the above composition range' is preferably from mass percentage: Si〇2 is 55 to 74%, Al2〇3 is 0·5 to 4%, and Bz〇3 is 〇 to 20%. MgO is 1 to 15%, CaO is 〇 to 8%, SrO is 1 to 15%, BaO is 0 to 5%, __他〇 is 15 to m, Zn〇 is 〇 to 5%, Ll2〇 is 〇 to 5% 'Na2〇 is 8% to 8%, K2〇 is 2 to 12%, Zr〇2 is in the range of 0 to 7% (composition range A); or mass percentage: 〇2 is 55 to 7掮,

Ah〇3 is 〇 to less than 2.5%, B2O3 is 〇 to 20%, MgO is 1 to 5%, CaO is 0 to 8%, SrO is 1 to 15%, BaO is 0 to 5%, MgO +CaO+SrO+BaO is 15 to 27%, and ZnO is 0 to 5°/. , Li2〇 is 5% to 5%, Na2〇 is 〇 to 8%, K2〇 is 2 to 12%, Zr〇2 is more than 1〇/0 to 7%, and Zr〇2 content > Α12〇3 content It is preferable to appropriately select the glass composition within the range (composition range β). 8 317203 1364406 In particular, when the glass composition is selected from the composition range B, it is easier to obtain a dielectric constant of 5.9 or less, 595. (: the above strain point, a glass substrate having a viscosity equivalent to a viscosity of 104 dPa·s at 1170 ° C or less, and a glass substrate having a thermal expansion coefficient of 67 to 73 x 1 〇 -7 / ° C. Among the glass substrates for display devices, the reason why the composition of the glass is limited as shown in the range A is as follows.

Si〇2 is a component that lowers the dielectric constant of the glass or forms a network forming agent for the glass. The content is 55 to 74%', preferably 56 to 70%, more preferably 58 to 70%. If the content of Si〇2 is increased, the dielectric constant of the glass can be lowered, but the viscosity of the glass will become higher, so that melting, forming becomes difficult, or the coefficient of thermal expansion becomes too small, so that it is difficult to obtain and the periphery. The integration of materials. On the other hand, if the content is small, the dielectric constant of the glass becomes south, so that it is difficult to lower the power consumption of the display device. Moreover, the coefficient of thermal expansion becomes so large that the thermal shock resistance of the glass is lowered, or the point of the glass is lowered, and during the heat treatment step in manufacturing the display device,

It is easy to crack or cause thermal deformation or heat shrinkage on the glass substrate.

AhO3 is a component that increases the strain point of the glass. The content is 〇5% to 4%, preferably 1% to 4%, more preferably 至3·5ρ. If the content of Ah 〇3 is the parent's temperature, the viscosity of the glass will become higher, so that the smelting is formed. It becomes difficult, or the coefficient of thermal expansion becomes small, so that it is difficult to obtain integration with peripheral materials. On the other hand, if the content is small, the coefficient of thermal expansion becomes so large that the thermal shock resistance of the glass is lowered, or the strain point of the glass is lowered, and in the heat treatment step in the case of the display device, the glass substrate is liable to be broken or Causes thermal deformation or heat shrinkage. 317203 9 1364406 ML is a component that lowers the dielectric constant. The content is from 〇 to 2% by weight, preferably from 0 to 10%, more preferably from 0 to 5%. If the content of 杲β2〇3 is increased, the strain point of the glass is lowered, and the heat treatment step at the time of manufacturing the display device is likely to cause cracking or thermal deformation or thermal contraction on the glass substrate.

The MgO 降低 reduces the high-temperature viscosity of the glass to improve the smelting and formability. The content is from i to 15%, preferably from 2 to 13%, more preferably from 3 to 12%. If the content of Mg 变 is increased, the dielectric constant of the glass becomes high, and it is difficult to reduce the power consumption of the display device. Moreover, the glass becomes easy to devitrify and is not easily formed. On the other hand, if the content is small, the high-temperature viscosity of the glass rises, so that melting and forming become difficult.

Similarly to MgO, CaO is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. The content is from 〇 to 8%, preferably from 8% to 8%, more preferably from 1 to 7%. If the content of Ca0 changes, the dielectric constant of the glass becomes high, so that it is difficult to reduce the power consumption of the display device. Moreover, 'the glass becomes easy to devitrify and is not easy to form. S r 0 is a component which lowers the high-temperature viscosity of the glass and improves the smelting property and the formability. The content is from 1 to 15%, preferably from 3 to 15%, more preferably from 4 to 13%. If SrO's saplings a,,., S Rivin, the dielectric constant of the glass will become significantly higher, so that it is not easy to reduce the power consumption of the display. On the other hand, if the content is small, the height of the glass is increased, and the height of the glass is increased by 4 degrees, so that melting and forming become difficult.

BaO is a component that makes the glass high-temperature Beijing sore--the calf is low and k-direction meltability and formability. The content is 〇 to 5 〇 /, 卜 & η ^ main W, preferably 0 to 4% 'more preferably 〇 to 3%. If the content of BaO is 辔炙曰β a, then the glass (four); the 丨 electric constant will become significantly higher 317203 1364406 - so that it is not easy to reduce the power consumption of the display device. Moreover, the glass becomes easily devitrified and is not easily formed. In addition, in order to reduce the high-temperature viscosity of the glass, the smelting property and the formability are improved without enhancing the devitrification of the glass, the total enthalpy of Mg 〇, Ca 〇 ' Sr 〇 and Ba 罝杈 is preferably 15 to 27% (Comparative) Good is 16 8 to 27%, more preferably 18 or more to 27%). If the total amount of these components does not increase, the glass will become easily devitrified. If the total amount of these components is small, the high-temperature viscosity of the glass rises, so that it becomes difficult to melt and form. • Zn〇 is a component that lowers the high-temperature viscosity of glass and improves meltability and formability. It contains I from 〇 to 5%, preferably 〇 to, more preferably from 〇 to 1%. If the content of ZnO is increased, the dielectric constant of the glass becomes high, so that it is difficult to reduce the power consumption of the display device.

LnO疋 reduces the high-temperature viscosity of the glass to improve the meltability and formability of the component. It is also a component that adjusts the thermal expansion coefficient of the glass. Its content is 0 to 5 ° /. Preferably, it is from 3% to 3%, more preferably from 〇 to 1%. If the content of Li2〇 is increased, the strain point of the glass is remarkably lowered, so that heat deformation or heat shrinkage is likely to occur during the heat treatment step in manufacturing the display device. Moreover, the coefficient of thermal % expansion becomes too large, so that the thermal shock resistance of the glass is lowered or it is difficult to integrate with the coefficient of thermal expansion of the peripheral material.

Na2 is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. It is also a component that adjusts the thermal expansion coefficient of the glass. The content is from 0 to 8%, preferably from 〇 to 6%', more preferably from 5 to 5%. If the f content of Na2〇 is increased, the strain point of the glass is lowered, so that heat deformation or heat shrinkage is easily caused in the heat treatment step in manufacturing the display device. On the other hand, 11 317203 ^04406, the coefficient of thermal expansion becomes too large, so that the thermal shock resistance of the glass is lowered, or it is difficult to integrate with the thermal expansion coefficient of the peripheral material. K2〇 and Na2〇 are components which lower the high temperature of the glass crucible and improve the smelting property and formability. It is also a component that adjusts the coefficient of thermal expansion of the glass. The content is 2 to 12%, preferably 2 to 11%, more preferably 2 to 1% by weight. If the content of Κβ is increased, the strain point of the glass is lowered, so that heat deformation or heat entanglement is liable to occur during the heat treatment step in the manufacture of the display device. Moreover, the coefficient of thermal expansion may become too large, so that the heat shock resistance of the glass is lowered or it is not easily integrated with the coefficient of thermal expansion of the peripheral material. On the other hand, if the content is small, the high-temperature viscosity of the glass rises, so that melting and forming become difficult. Moreover, the coefficient of thermal expansion becomes too small to be easily integrated with the coefficient of thermal expansion of the peripheral material.

Zr〇2 is the composition of the strain point of the Tyrann glass. The content is from 〇 to 7%, preferably from 0 to 3%, more preferably from 〇 to 1%. If the content of Zr 〇 2 is increased, the number of 丨 4 4 will become south, so that it is difficult to reduce the power consumption of the display device.

low. Moreover, a devitrified substance is generated so that forming becomes difficult. In addition, in the composition system containing more than 1% of A12〇3, if the package is large, Ζι*〇2', then the valley is susceptible to devitrification caused by Zi*〇2, so it is better to use Zr〇2. The content is limited to less than 1%. Further, the reason why the composition of the glass is limited to the composition range B in the glass substrate for a flat panel display device of the present invention is as follows.

Si 〇 2 is a component that lowers the dielectric constant of the glass or forms a network forming agent for the glass. The content is from 55 to 74%, preferably from 56 to 70%, more preferably from 58 to 70%. If the content of Si〇2 is increased, the dielectric constant of the glass can be lowered, but 317203 J364406 can increase the high-temperature viscosity of the glass, so that the melting, forming becomes difficult, or the coefficient of thermal expansion becomes too small to be easily obtained. Integration with the surrounding materials. On the other hand, if the content becomes small, the dielectric constant of the glass becomes high, so that it is difficult to lower the power consumption of the display device. Further, the coefficient of thermal expansion becomes so large that the thermal shock resistance of the glass is lowered, or the strain point of the glass is lowered, and during the heat treatment step in manufacturing the display device, it is easy to cause cracking or thermal deformation or thermal contraction on the glass substrate. A 12〇3 is a component that increases the strain point of the glass. The content is from 〇 to less than 5%, preferably from 0 to 1. δ%, more preferably from 0 to less than 1%. If the content of Ah is increased, the high-temperature viscosity of the glass becomes so high that melting, forming becomes difficult, or the coefficient of thermal expansion becomes small so that integration with peripheral materials is not easily obtained. IM) 3疋 reduces the composition of the dielectric constant. The content is 〇, preferably 〇 to 10%, more preferably 〇 to 5%. If the content of B2〇3 is increased, the strain point of the glass 2 is lowered, and when the heat treatment step is performed in the manufacture of the display device, it is easy to cause cracking or (four) deformation or shrinkage of the glass substrate. The high-temperature viscosity of the glass is lowered to improve the meltability and formability, and the knives are set to 1 to (10), preferably 6.5 to 11%, more preferably "11%". If the content of *Mg0 is increased, the amount of the glass is so small that it is not easy. #Jg _τ· 口 口 士 士 曰 曰 变得 变得 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Moreover, the glass-bright temperature viscosity will rise, making it difficult to melt and form. Sex and the second ==::: = degree decreases and increases the melting" 3 to 0 to 8%, preferably 〇 to 5%, more 317203 13 J364406 preferably 1 to 3. 5%. If the content of ca〇 changes In many cases, the dielectric constant of the glass becomes high, so that it is difficult to make the power consuming glass of the display device easily devitrified, so that forming becomes difficult.

SrO is a component which lowers the high-temperature viscosity of glass and improves (tetra) and formability. The content is from 1 to i 5%, preferably from 7 to (3%, more preferably from 7.5 to 13%. If the content of SirG is increased, the dielectric constant of the surface is significantly 'high, so that the display is not easily made The power consumption of the device is lowered. On the other hand, if the content is small, the high-temperature viscosity of the glass bottle will rise, so that melting and forming a shape become difficult.

BaO is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. The content is from 0 to 5%, preferably from 〇 to 4%, more preferably from 〇 to 2.5%. If the content of BaO is increased, the dielectric constant of the glass is remarkably high, so that it is difficult to reduce the power consumption of the display device. Moreover, the glass becomes easily devitrified so that forming becomes difficult. In addition, in order to lower the high-temperature viscosity of the glass, the meltability and formability are improved without increasing the devitrification of the glass. The total amount of Mg〇, ca〇, SrO and BaO is preferably 15 to 27% (more preferably 16). 8 to 27%, more preferably 18 or 27%). If the total amount of these ingredients is increased, the glass becomes devitrified. Further, if the total amount of these components is small, the high-temperature viscosity of the glass rises, so that melting and molding become difficult.

ZnO is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. The content is from 〇 to 5%, preferably from 〇 to 3%, more preferably from 〇 to 1%. If the content of ZnO is increased, the dielectric constant of the glass becomes high, so that it is difficult to reduce the power consumption of the display device. 14 317203 ^364406

LizO is a component which lowers the high-temperature viscosity of glass and improves the meltability and formability. It is also a component that adjusts the thermal expansion coefficient of the glass. The content is from 0 to 5%, preferably from 〇 to 3%, more preferably from 〇 to 1%. If the s content of Ll2〇 is increased, the strain point of the glass is remarkably lowered, so that heat deformation or heat shrinkage is likely to occur during the heat treatment step in manufacturing the display device. Moreover, the coefficient of thermal expansion may become too large, so that the thermal shock resistance of the glass is lowered or it is not easily integrated with the coefficient of thermal expansion of the peripheral material.

NazO is a component that lowers the high-temperature viscosity of glass and improves the meltability and formability. It is also a component that adjusts the thermal expansion coefficient of the glass. The content is from 0 to 8%, preferably from 1 to 5%, more preferably from 1 to 3%. If the ribs of the ribs 2〇 are large, the strain point of the glass is lowered, so that heat deformation or heat shrinkage is likely to occur during the heat treatment step in manufacturing the display device. Moreover, the coefficient of thermal % expansion becomes too large, so that the thermal shock resistance of the glass is lowered or it is difficult to integrate with the coefficient of thermal expansion of the peripheral material.

Like NazO, K2 is a component that lowers the high-temperature viscosity of glass and improves the meltability and formability. Further, the knives for adjusting the thermal expansion coefficient of the glass are 2 to 12%, preferably 3 to 10%, and preferably 4 to 7%. If the content of κα is increased, the strain point of the glass is lowered, so that heat deformation or heat shrinkage is liable to occur during the heat treatment step in the manufacture of the display device. Moreover, the coefficient of thermal expansion may become too large, so that the heat resistance of the glass is lowered or it is not easily integrated with the coefficient of thermal expansion of the peripheral material. On the other hand, if the content is small, the high-temperature viscosity of the glass rises, so that melting and molding become difficult. Moreover, the number of thermal expansion systems becomes too small to be easily integrated with the thermal expansion coefficient of the peripheral material. 317203 1364406

Zr〇2 does not mention the south temperature viscosity of the south glass and significantly increases the composition of the strain point of the glass. The content is more than 1% to 7%, preferably more than 1% to (4), more preferably more than 1% to 3%. If the content of 杲Zr〇2 is increased, the dielectric constant becomes high, so that it is difficult to reduce the power consumption of the display device. Moreover, a devitrified substance is generated so that forming becomes difficult. On the other hand, if the content is small, it is difficult to obtain an effect of improving the strain point of the glass. Further, in order to significantly increase the strain point of the glass without significantly increasing the high-temperature viscosity of the glass, the content of Zr〇2 may be made larger than the content of Al2〇3. Furthermore, in order to reduce the high-temperature viscosity of the glass, it is easy to form. In the composition of A12〇3 containing less than 1% of yttrium, in order to increase the strain point of the glass, it is preferable to make the content of Zr〇2 more than 1%. . Further, in the present invention, in addition to the components described in the above-mentioned composition range and B, for example, τ 丨〇 2 may be added to 5% in order to prevent ultraviolet ray coloring, and pa 5 may be added to 4% in order to improve crack resistance. In order to lower the liquidus temperature, 'LI, La』3, Nb2〇3 are added to the reference 3%, and the coloring agent can be Fe2〇3, C〇0, NiO, 〇2〇. 3 'age 〇3 each added to 2%, for clarifying agents, As2〇3, Sb2〇3, Sn〇2, s〇3, F,

The total amount of Cl or the like was added to 1%. However, in the case of forming by the floating method, AszO3 and Sbz〇3 are reduced in a float bath to become a metal foreign matter, so introduction should be avoided. Next, a method of manufacturing a glass substrate for a flat panel display device of the present invention will be described. First, the glass raw materials are blended to form the above glass composition range. Next, the tempered glass raw material is put into a continuous melting furnace and heated and melted. 317203 1364406 j. After melting and defoaming, it is supplied to a molding apparatus to form a plate shape, and the glass substrate can be obtained by being cooled. In addition, the glass substrate is formed by a float method, a slot downdraw method, an overflow lower bow (〇vern〇w plus scratching (four)) method, and a redraw method. Various molding methods are preferred, but it is preferable to form the sheet shape by the floating method. The reason is because it is easy to obtain a large glass substrate at a relatively low price. Description of preferred pipe examples

In the following, a glass substrate for a flat panel display device of the present invention will be described in detail based on an embodiment. ～7F Tables 1 to 4 show examples of the present invention (samples N〇.丄 to 2〇) and comparative examples (sample Mo.21). Sample No. 21 was used for a commercially available electro-concentration display device and the strain point was broken. 317203 17 , 1364406 Table 1 Example No. 1 No. 2 No. 3 No. 4 No. 5 No. 6 Composition (% by mass) Si〇2 65. 2 67. 5 67. 4 66. 5 68. 5 67 . 7 A 1 2〇3 3. 3 1.5 2. 2 3. 0 1. 0 1.0 MgO 7.0 7. 0 6. 5 7. 0 6. 9 6. 9 CaO 3. 3 3. 0 2. 8 3. 0 3. 1 3.1 SrO 12. 5 12. 5 12. 5 12. 4 12. 4 12. 4 BaO _ — — — 0. 2 Na2〇3. 5 3. 5 2. 5 2. 0 2. 0 1.0 K2〇5· 0 5. 0 6.0 6. 0 6.0 7.5 Zr〇2 0.2 _ 0. 1 _ — _ S〇3 — — — 0.1 0. 1 0.2 P2O5 — — — — _ — Dielectric constant 6. 8 6 7 6. 8 6. 7 6. 6 6. 8 Strain point (°C) 585 580 590 595 590 605 104 (°C) 1140 1140 1145 1160 1165 1180 Thermal expansion coefficient [30 to > 380 °C] (x 10"7/°C) 74. 0 75. 0 70. 0 71.0 71.0 71. 0 317203 1364406 Table 2 Example No. 7 No. 8 No. 9 No. 10 No. 11 No. 12 Composition (% by mass) Si〇2 66. 9 68. 8 64. 7 67. 4 67. 4 67. 4 A 1 2〇3 1· 0 1.0 4. 6 — — 0. 5 MgO 6. 9 8. 0 6.6 8. 2 8 . 2 8. 2 CaO 5. 6 2. 8 2. 5 2. 8 2. 8 2. 8 SrO 10. 0 12. 4 7. 7 9. 3 11.3 10. 8 BaO 0.1 — 0. 1 2. 2 0. 2 0. 7 Na2〇0. 3 4. 0 4. 0 2. 1 2.1 2.1 K2〇9.0 2. 8 5. 9 5. 8 5. 8 5. 8 Zr.〇2 — _ 3.7 2. 0 2. 0 1' 5 S〇3 0· 2 0. 2 0.2 0. 2 0. 2 0· 2 P2O5 — — — — — — Dielectric constant 6. 9 6. 5 7. 0 6. 7 6. 7 6. 7 Strain point (°C) 620 580 600 600 600 600 i〇Vc ) 1170 1150 1190 1165 1160 1160 Thermal expansion coefficient [30 to >380〇C] (x 10'7/°C) 73. 0 70. 0 73. 0 69 0 69. 0 69. 0 19 317203 P64406 Table 3 Example No. 13 No. 14 No. 15 No. 16 No. 16 No. 18 No. 14 No. 14 No. 16 No. 16 No. 67. 4 66. 5 65. 5 A 1 2〇3 — — — A 0. 9 0. 9 MgO 8. 2 8. 2 8. 2 10. 2 8. 2 8. 2 CaO 4. 8 4. 8 4. 8 2. 8 4.8 4. 8 SrO 9. 3 9. 3 9. 3 9. 3 9. 3 9. 3 BaO 0. 2 0· 2 0. 2 0. 2 0. 2 0. 2 Na2〇 2. 1 2.1 2· 1 2. 1 2. 1 2.1 K2〇5. 8 5. 8 5. 8 5. 8 5. 8 5. 8 Zr〇2 2. 0 3. 0 4. 0 2. 0 2.0 3. 0 S〇3 0. 2 0. 2 0· 2 0· 2 0. 2 0. 2 P2O5 — — — _ — — Dielectric constant 6.8 6. 9 6. 9 6.7 6. 8 6. 9 Strain point (°C) 605 610 615 610 605 615 104(°C) 1150 1150 1150 1 160 1155 1150 Coefficient of thermal expansion [30 to 70. 0 70. 0 69.0 67. 0 70. 0 70. 0 ► 380〇C ](xlO'7/°C) 20 317203 .1364406 Λ Table

Each sample in the table was produced in the following manner. First, the glass raw materials were blended to form a composition as shown in the table, using a white gold pot at 1450 to 16 Torr. (: Four hours of melting was carried out. Then, the molten glass was poured out onto the graphite plate to form a plate shape, and after cooling, the surface was double-grinded to form a thickness of 2·8 mm, and then the obtained plate glass was cut. The sample glass was prepared to have a size of 20 mm square. The dielectric constant and strain point of each sample obtained as described above, and the temperature and thermal expansion coefficient of the glass melt corresponding to a viscosity of 104 dPa·s were measured for 317203 21 1364406 Λ. The results are shown in the table. It can be understood from the table that the dielectric constants of the samples No. 1 to 20 of the examples are 7. The lower values below , can reduce the consumption power of the display device. The strain point is 580 ° C, which can suppress the thermal deformation or heat shrinkage of the glass substrate in the heat treatment step. Further, the coefficient of thermal expansion is 67. 0 to 75. 0 • x 1 0 " ° C, thermal shock resistance Good, and has a coefficient of thermal expansion which is well integrated with the surrounding materials. In addition, for each sample of samples N〇. 1 to 18, • the temperature of the glass melt corresponding to the viscosity of l〇4clPa·s is lower than that of 丨丨(10) , Formability is also good. For this, the dielectric constant of No. 21 of the comparative example is a high value of 7.5. Further, the dielectric constant is a value measured at 25 ° C and 1 MHz in accordance with ASTM D1 50-87. The strain point is according to ASTM C336- In addition, the higher the temperature, the more the thermal deformation or thermal contraction of the glass substrate in the heat treatment step in manufacturing the display device can be suppressed. Moreover, the viscosity of the glass is equivalent to the temperature of the glass melt of 104 dPa·s. It is measured by a platinum ball pulling method. The temperature is an index when the glass is formed into a plate shape, and the lower the temperature, the better the formability. The coefficient of thermal expansion is a cylindrical sample having a diameter of 5.0 mm and a length of 2 〇. The average thermal expansion coefficient at 30 to 380X is measured by a dilatometer. The glass substrate for a flat panel display device of the present invention is not limited to the use of a plasma display device, and can be used, for example, in an electric field emission type display or an electroluminescent display. °° 317203 22

Claims (1)

1364406 Β 3 3 3 3 3 3 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 55 to 74%, Al2〇3 is 0.5 to 4%, B2〇3 is 〇 to 20%, MgO is 1 to 15%, CaO is 0 to 8%, SrO is 1 to 15%, and BaO is 0. To 5%, MgO+CaO+SrO+BaO is 15 to 27%, ZnO is 〇 to 5%, Li2〇 is 0 to 5%, Na2〇 is 0 to 8%, K2〇 is 2 to 12%, and Zr 〇2 is 〇 to 70/〇. 2. A glass substrate for a flat panel display device, expressed in mass percent, with Si〇2 being 55 to 74%, Al2〇3 being 0 to less than 2.5%, β2〇3 being 0 to 20%, MgO It is 1 to 15%, CaO is 0 to 8%, SrO is 1 to 15%, BaO is 0 to 5%, MgO+CaO+SrO+BaO is 15 to 27%, and ZnO is 〇 to 5°/. LizO is 5% to 5%, Na2〇 is 0 to 8%, K2〇 is 2 to 12%, Zr〇2 is more than 1% to 7%, and Zr〇2 content is ΑΙ2Ο3. 3. A glass substrate for a flat panel display device as claimed in claim 1 or 2, wherein, at 25. (The dielectric constant of the flat panel display device according to the first or second aspect of the patent application, wherein the strain point is 58 〇 or more. 5. For the glass substrate for flat panel display devices of the first or second aspect of the patent application, the temperature of the glass melt corresponding to the viscosity of 1〇4dPa·s is 120 (TC or less. 6) The glass substrate for the flat panel display device of item i or item 2, wherein the thermal expansion coefficient at 30 to 38 为 is 6〇317203 (revision) 23 136.4406 The glass substrate for a flat panel display device according to claim 1 or 2, wherein the glass substrate is used as a glass for a plasma display writing device. Substrate. The glass substrate for a flat panel display device according to claim 3, wherein the glass substrate is used as a glass substrate for a plasma display device. 9. The glass substrate for a flat panel display device according to the fourth aspect of the invention, wherein the glass substrate is used as a glass substrate for an electric device. The glass substrate for a flat panel display device according to claim 5, wherein the glass substrate is a glass substrate for a plasma display device. For example, the glass substrate for a flat panel display device of claim 6 is a glass substrate which is a glass substrate for an electro-concentration display device. 317203 (revision) 24