TWI364115B - Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same - Google Patents
Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same Download PDFInfo
- Publication number
- TWI364115B TWI364115B TW094105634A TW94105634A TWI364115B TW I364115 B TWI364115 B TW I364115B TW 094105634 A TW094105634 A TW 094105634A TW 94105634 A TW94105634 A TW 94105634A TW I364115 B TWI364115 B TW I364115B
- Authority
- TW
- Taiwan
- Prior art keywords
- encapsulation layer
- light
- matrix material
- layer
- physical property
- Prior art date
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 102
- 239000002105 nanoparticle Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 38
- 230000000704 physical effect Effects 0.000 claims abstract description 22
- 239000000499 gel Substances 0.000 claims description 28
- 230000003287 optical effect Effects 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 16
- 238000005299 abrasion Methods 0.000 claims description 15
- 239000000945 filler Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 13
- 239000004964 aerogel Substances 0.000 claims description 13
- 229910052707 ruthenium Inorganic materials 0.000 claims description 13
- 239000010432 diamond Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 6
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000004575 stone Substances 0.000 claims description 4
- 235000007164 Oryza sativa Nutrition 0.000 claims description 3
- 235000009566 rice Nutrition 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 150000001622 bismuth compounds Chemical class 0.000 claims 1
- 210000003127 knee Anatomy 0.000 claims 1
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 claims 1
- 239000008279 sol Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005266 casting Methods 0.000 description 4
- 150000002908 osmium compounds Chemical class 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 210000004508 polar body Anatomy 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/818,912 US7868343B2 (en) | 2004-04-06 | 2004-04-06 | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200537714A TW200537714A (en) | 2005-11-16 |
| TWI364115B true TWI364115B (en) | 2012-05-11 |
Family
ID=34965375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094105634A TWI364115B (en) | 2004-04-06 | 2005-02-24 | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7868343B2 (enExample) |
| EP (1) | EP1741315B1 (enExample) |
| JP (2) | JP5376801B2 (enExample) |
| KR (2) | KR101138540B1 (enExample) |
| AT (1) | ATE415072T1 (enExample) |
| DE (1) | DE602005011119D1 (enExample) |
| TW (1) | TWI364115B (enExample) |
| WO (1) | WO2005101909A1 (enExample) |
Families Citing this family (115)
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- 2005-04-05 WO PCT/US2005/011592 patent/WO2005101909A1/en not_active Ceased
- 2005-04-05 AT AT05734066T patent/ATE415072T1/de not_active IP Right Cessation
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- 2005-04-05 KR KR1020117020217A patent/KR101225252B1/ko not_active Expired - Fee Related
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|---|---|
| JP5376801B2 (ja) | 2013-12-25 |
| JP2012089864A (ja) | 2012-05-10 |
| TW200537714A (en) | 2005-11-16 |
| US7868343B2 (en) | 2011-01-11 |
| DE602005011119D1 (de) | 2009-01-02 |
| KR20070004023A (ko) | 2007-01-05 |
| EP1741315A1 (en) | 2007-01-10 |
| ATE415072T1 (de) | 2008-12-15 |
| KR20110112450A (ko) | 2011-10-12 |
| KR101138540B1 (ko) | 2012-04-25 |
| WO2005101909A1 (en) | 2005-10-27 |
| EP1741315B1 (en) | 2008-11-19 |
| US8946755B2 (en) | 2015-02-03 |
| JP2007533140A (ja) | 2007-11-15 |
| KR101225252B1 (ko) | 2013-01-22 |
| US20050224829A1 (en) | 2005-10-13 |
| US20110068362A1 (en) | 2011-03-24 |
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