1364044 100年.12月23日修正_頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子元件，尤其涉及將該電子元件内導 電引線與導電端子連接的結構及其方法。 【先前技術】 [0002] 美國第5, 656, 985號專利揭示了 一種電子元件，該元件 包括一體成型之絕緣殼體、磁珠變壓器及若干導電端子 。絕緣殼體係四個側壁及一個頂壁圍成一面開口的盒狀 。磁珠變壓器通過軟樹脂固定於絕緣殼體内，並且磁珠 變壓器上繞有若干導線。若干導電端子一體成型於絕緣 殼體之一對側壁上，其中各導電端子的一部分延伸出側 壁的底面，並且該部分上開設有缺口。在製造時，磁珠 變壓器之導線需纏繞到導電端子的缺口處，然後經過焊 接以保證導線與導電端子的電性連接。 [0003] 然，以上這種電子元件在製造過程中，由於引線需要纏 繞到端子上，故需要大量手工操作，生產效率不高，製 造成本尚*不能滿足尚效自動化生產的需要。 【發明内容】 [0004] 鑒於上述狀況，本創作之目的在於提供一種結構簡單、 生產效率高、成本低的電子元件及其製造方法。 [0005] 為實現上述目的，本創作之電子元件一種電子元件，包 括一絕緣殼體；複數電子模組，其固定於絕緣殼體内， 並具有複數與外界電子元件電性連接的導電引線；複數 導電端子，其固定於絕緣殼體上，各導電端子分別並具 有一連線部，該連線部形成有一平臺，前述電子模組之 096115265 表單編號A0101 第3頁/共16頁 1003478823-0 1364044 [0006] [0007] [0008] [0009] 096115265 .100年.12月2·3日梭正替換頁 導電引線延伸至前述平臺並焊接於其上。 為實現上述目的，本發明亦可採用如下技術方案：一種 用於與外界電子元件電性連接之電子元件的製造方法， 該方法包括：（1)提供一個絕緣殼體，該絕緣殼體上固定 有複數導電端子，各導電端子包括一成平臺狀之連線部 ;(2)提供複數電子模組，各電子模組分別具有複數導電 引線；（3)將前述電子模組固定於前述絕緣殼體，並將前 述導電引線搭接至所述連線部；（4)將前述導電引線與前 述連線部焊接。 相較於習知技術與現有技術相比，本創作之導電端子之 連線部成平臺狀，可以將所有導電引線與導電端子先進 行搭接，然後直接將兩者進行焊接。而無需針對每一個 導電端子進行繞線，能充分利用自動化設備進行大規模 生產，以降低成本。 ， 【實施方式】 請一併參閱第一圖及第二圖，圖示係為本創作之一較佳 實施例，該實施例電子元件100係一種電磁線圈元件，該 電子元件100包括絕緣殼體1、一體成型於絕緣殼體上的 導電端子2及安裝與絕緣殼體内的電磁線圈模組3。 請一併參閱第一至第三圖，絕緣殼體1包括上壁10、兩對 相對設置之側壁11、12、13、14，該等上壁11及側壁 1卜14圍成單面開口之收容空間15 »側壁11、13自底面 110形成一凹部111，並在凹部111與收容空間15之間的 部分側壁11、13上均勻開設有若干凹槽112，該凹槽112 延伸入收容空間15，側壁12、14設有高出底面110的凸 表單編號Α0101 第4頁/共16頁 1003478823-0 1364044 厂 100‘12月2—3日梭正替#頁 條121。收容空間15内設置有三個隔離壁151從而將收容 空間15分隔為四個小的收容室。 [0010] 請一併參閱第一圖、第二圖及第四圖，導電端子2—體成 型於側壁11、13上，各導電端子2包括固定於側壁11、 13上的固持部21、由固持部21—端延伸的引腳部22及由 固持部21另一端延伸延的連線部23。連線部23比引腳部 22及固持部21要寬’連線部23具有上表面231及下表面 232。固持部21設有與引腳部22共面之豎直段211及自豎 直段211偏斜一定角度延伸的彎折段212。請參閱第二圖 ，導電端子2的引線部23位於側壁11、13底面之凹部111 内’引線部23的下表面232與凹部111相抵靠。引線部23 的高度在凸條121以下並朝與收容空間15相對的方向延伸 ，側壁11、13的凹槽112與引線部23的位置相對應，即 每一個凹槽112之一側均有一個導電端子2的引線部23， 並且引線部23於導電引線321延伸方向A-A之垂直方向上 與引腳部22呈交錯分佈而不再同一平面内，即引線部23 的部分位於相鄰兩個導電端子2的引腳部22之間。 [0011] 請一併參閱第二圖及第五圖，各電磁線圈模組3由磁芯31 及繞在磁芯31上的線圈32組成，各線圈32具有若干導電 引線321。八個線圈模組3分別固定於收容空間15的四個 收容室内，各線圈模組3的導電引線321經側壁11、13凹 槽112延伸至導電端子2的連線部23上表面231。 [0012] 在製造時，首先將金屬料帶衝壓並進行適當彎折以形成 導電端子2 ;然後將導電端子2—體成型至絕緣殼體1 ;再 將製造好的電磁模組3安裝到絕緣殼體1收容空間中，由 096115265 表單编號A0101 第5頁/共16頁 1003478823-0 1364044 [ϊόο年.12月々日修正替換頁 於有隔離壁151的作用，電磁模組3能很好地定位，也可 以將樹脂等填充物質（未圖示）注入到電磁模組3周圍的空 隙中；將導電引線321通過凹槽112搭接至導電端子2的連 線部23的上表面231，凹槽112有助於限定住導電引線 3 21以利於後續焊接，最後將組裝好的電子元件1 〇 〇送到 焊接設備進行焊接以導電引線321與連線部23永久電性連 接。 [0013] 在將電磁線圈模組3安裝到絕緣殼體1時，也可以將安裝 有電磁線圈模組3的絕緣殼體1安裝到特定的制具上（未圖 示），然後將導電引線3 21理順並固定到制具上，此時導 電引線321跨過導電端子2,的接線部並搭接於其上，以便 後續焊接。 [0014] 本創作電子元件100的導電端子2之連線部23提供一焊接 平臺，同時引腳部22偏離焊接導電弓丨線321的連線部23設 置，此種結構能充分利用現有的焊接技術進行自動彳匕生 產。本創作可以採用熱熔焊接進行，它利用放熱反應時 產生超高熱來完成熔接的一種方法。熱炫焊接化學反廣 速度非常快，僅幾秒就可以完成焊接，產生熱量極高可 以有效的傳導至熔接部位，使其熔為一體，形成分子結 合，它無須其他任何熱能。將熱熔焊接應用於電子元件 的製造上，不需要使用焊錫膏’並且焊點的電氣及機械 性能良好，適應於大規模自動化生產，成本低。 【圖式簡單說明】 [0015] 第一圖係本創作之較佳實施例之立體圖； 1003478823-0 [0016] 第二圖係第一圖之另一角度視圖； 096115265 表單编號A0101 第6頁/共16頁 1364044 100年.12月2$日修正替¥頁 [0017] 第三圖係本創作之較佳實施例之絕緣殼體立體圖； [0018] 第四圖係本創作之較佳實施例之導電端子立體圖； [0019] 第五圖係被創作之較佳實施例之電子模組立體圖。 【主要元件符號說明】 [0020] 電子元件：100 [0021] 絕緣殼體：1 [0022] 上壁：10 [0023] 側壁丨Π〜1 4 [0024] 收容空間：15 [0025] 底面：1 1 0 [0026] 凹部：1 11 [0027] 凹槽：1 1 2 [0028] 凸條：1 21 [0029] 隔離壁：151 [0030] 導電端子：2 [0031] 固持部：21 [0032] 引腳部：22 [0033] 豎直段：211 [0034] 彎折段：212 [0035] 連線部：23 096115265 表單編號Α0101 第7頁/共16頁 1003478823-0 1364044 100年.12月23日核正替換頁 [0036] 上表面：231 [0037] 下表面：232 [0038] 電磁線圏模組：3 [0039] 磁芯：31 [0040] 線圈：32 [0041] 導電引線：321 1003478823-0 096115265 表單編號A0101 第8頁/共16頁1364044 100 years. December 23rd revision_Page 6、Invention Description: [Technical Field] [0001] The present invention relates to an electronic component, and more particularly to a structure for connecting a conductive lead and a conductive terminal in the electronic component method. [Prior Art] [0002] U.S. Patent No. 5,656,985 discloses an electronic component comprising an integrally formed insulative housing, a bead transformer and a plurality of electrically conductive terminals. The insulating housing has four side walls and a top wall that encloses a box-like opening. The magnetic bead transformer is fixed in the insulative housing by a soft resin, and a plurality of wires are wound around the bead transformer. A plurality of conductive terminals are integrally formed on one of the pair of insulating housings, wherein a portion of each of the conductive terminals extends out of a bottom surface of the side wall, and a notch is formed in the portion. At the time of manufacture, the conductor of the bead transformer is wound around the notch of the conductive terminal and then soldered to ensure electrical connection of the conductor to the conductive terminal. [0003] However, in the manufacturing process of the above electronic component, since the lead wire needs to be wound around the terminal, a large amount of manual operation is required, and the production efficiency is not high, and the system is not able to meet the needs of the automated production. SUMMARY OF THE INVENTION [0004] In view of the above circumstances, the object of the present invention is to provide an electronic component having a simple structure, high production efficiency, and low cost, and a method of manufacturing the same. [0005] In order to achieve the above object, an electronic component of the present invention includes an insulative housing; a plurality of electronic modules fixed in the insulative housing and having a plurality of electrically conductive leads electrically connected to the external electronic components; The plurality of conductive terminals are fixed on the insulative housing, and each of the conductive terminals has a connecting portion, the connecting portion is formed with a platform, the electronic module is 096115265, the form number A0101, the third page, the total 16 pages, 1003478823-0 1364044 [0006] [0007] [0009] [0009] 096115265 .100. December 2-3. The shuttle is replacing the page conductive leads extending to the aforementioned platform and soldered thereto. In order to achieve the above object, the present invention may also adopt the following technical solution: a method for manufacturing an electronic component for electrically connecting with an external electronic component, the method comprising: (1) providing an insulating housing, the insulating housing is fixed a plurality of conductive terminals, each of the conductive terminals includes a platform-like connecting portion; (2) providing a plurality of electronic modules, each of which has a plurality of conductive leads; (3) fixing the electronic module to the insulating shell And bonding the conductive lead to the connecting portion; and (4) soldering the conductive lead to the connecting portion. Compared with the prior art, the connecting portion of the conductive terminal of the present invention is in the form of a platform, and all the conductive leads and the conductive terminals can be advancedly overlapped, and then the two are directly welded. There is no need to wind for each of the conductive terminals, and it is possible to make full use of automated equipment for mass production to reduce costs. [Embodiment] Please refer to the first figure and the second figure together. The drawing is a preferred embodiment of the present invention. The electronic component 100 of the embodiment is an electromagnetic coil component, and the electronic component 100 includes an insulating shell. 1. The conductive terminal 2 integrally formed on the insulating case and the electromagnetic coil module 3 mounted in the insulating case. Referring to the first to third figures together, the insulating housing 1 includes an upper wall 10 and two pairs of oppositely disposed side walls 11, 12, 13, and 14. The upper wall 11 and the side walls 1 are surrounded by a single opening. The receiving space 15 » the side walls 11 , 13 form a recess 111 from the bottom surface 110 , and a plurality of recesses 112 are defined in the side walls 11 , 13 between the recess 111 and the receiving space 15 , and the recess 112 extends into the receiving space 15 . The side walls 12, 14 are provided with a convex form number higher than the bottom surface 110 Α 0101 4th page / a total of 16 pages 1003478823-0 1364044 Factory 100' December 2-3 days shuttle is the #页条121. Three partition walls 151 are provided in the accommodating space 15 to partition the accommodating space 15 into four small accommodating chambers. [0010] Please refer to the first, second and fourth figures together, the conductive terminals 2 are integrally formed on the side walls 11, 13, and each of the conductive terminals 2 includes a holding portion 21 fixed on the side walls 11, 13, The holding portion 21 has a pin portion 22 extending at the end and a connecting portion 23 extending from the other end of the holding portion 21. The wiring portion 23 is wider than the lead portion 22 and the holding portion 21. The connecting portion 23 has an upper surface 231 and a lower surface 232. The retaining portion 21 is provided with a vertical section 211 that is coplanar with the lead portion 22 and a bent section 212 that extends at an angle from the vertical section 211. Referring to the second figure, the lead portion 23 of the conductive terminal 2 is located in the recess 111 of the bottom surface of the side walls 11, 13, and the lower surface 232 of the lead portion 23 abuts against the recess 111. The height of the lead portion 23 is below the rib 121 and extends in a direction opposite to the accommodating space 15, and the groove 112 of the side walls 11, 13 corresponds to the position of the lead portion 23, that is, one side of each of the grooves 112 The lead portion 23 of the conductive terminal 2, and the lead portion 23 is staggered with the lead portion 22 in the vertical direction of the extending direction AA of the conductive lead 321 and is no longer in the same plane, that is, the portion of the lead portion 23 is located adjacent to the two conductive portions. Between the pin portions 22 of the terminal 2. [0011] Referring to the second and fifth figures, each of the electromagnetic coil modules 3 is composed of a magnetic core 31 and a coil 32 wound around the magnetic core 31. Each coil 32 has a plurality of conductive leads 321 . The eight coil modules 3 are respectively fixed in the four receiving chambers of the accommodating space 15, and the conductive leads 321 of the coil modules 3 extend through the recesses 112 of the side walls 11, 13 to the upper surface 231 of the connecting portion 23 of the conductive terminal 2. [0012] At the time of manufacture, the metal strip is first stamped and appropriately bent to form the conductive terminal 2; then the conductive terminal 2 is integrally molded to the insulating housing 1; and the fabricated electromagnetic module 3 is mounted to the insulating In the housing 1 housing space, by the 096115265 form number A0101 page 5 / a total of 16 pages 1003478823-0 1364044 [ϊό 年 .. December 修正 修正 替换 替换 替换 于 于 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁 电磁For positioning, a filling material (not shown) such as a resin may be injected into a space around the electromagnetic module 3; the conductive lead 321 is overlapped by the groove 112 to the upper surface 231 of the connecting portion 23 of the conductive terminal 2, concave The slot 112 helps to define the conductive leads 3 21 for subsequent soldering, and finally the assembled electronic component 1 is transferred to a soldering apparatus for soldering to electrically connect the conductive leads 321 to the wiring portion 23 permanently. [0013] When the electromagnetic coil module 3 is mounted to the insulating housing 1, the insulating housing 1 on which the electromagnetic coil module 3 is mounted may be mounted on a specific tool (not shown), and then the conductive leads are 3 21 is straightened and fixed to the fixture, at which time the conductive lead 321 straddles the wiring portion of the conductive terminal 2 and is lapped thereon for subsequent soldering. [0014] The wiring portion 23 of the conductive terminal 2 of the present electronic component 100 provides a soldering platform, and the lead portion 22 is disposed away from the wiring portion 23 of the soldering conductive bow line 321, which can make full use of the existing soldering. The technology performs automatic production. This creation can be carried out by means of hot-melt welding, which utilizes an exothermic reaction to produce ultra-high heat to complete the fusion. The heat welding is very fast, and the welding is very fast. The welding can be completed in only a few seconds. The heat is extremely high and can be effectively transmitted to the welding site to melt it into one, forming a molecular bond without any other heat. The application of hot-melt welding to the manufacture of electronic components does not require the use of solder paste' and the electrical and mechanical properties of the solder joints are good, which is suitable for large-scale automated production and low in cost. BRIEF DESCRIPTION OF THE DRAWINGS [0015] The first drawing is a perspective view of a preferred embodiment of the present invention; 1003478823-0 [0016] The second drawing is another angle view of the first figure; 096115265 Form No. A0101 Page 6 / 16 pages 1364041 100 years. December 2$ day correction for ¥ page [0017] The third figure is a perspective view of the insulating case of the preferred embodiment of the present invention; [0018] The fourth figure is a preferred implementation of the present creation A perspective view of a conductive terminal of the example; [0019] The fifth drawing is a perspective view of the electronic module of the preferred embodiment. [Main component symbol description] [0020] Electronic component: 100 [0021] Insulating housing: 1 [0022] Upper wall: 10 [0023] Side wall 丨Π ~ 1 4 [0024] Containing space: 15 [0025] Bottom surface: 1 1 0 [0026] Recess: 1 11 [0027] Groove: 1 1 2 [0028] Rib: 1 21 [0029] Isolation wall: 151 [0030] Conductive terminal: 2 [0031] Holding portion: 21 [0032] Pin section: 22 [0033] Vertical section: 211 [0034] Bending section: 212 [0035] Wiring section: 23 096115265 Form number Α 0101 Page 7 / Total 16 pages 1003478823-0 1364044 100 years. December 23 Japanese nuclear replacement page [0036] Upper surface: 231 [0037] Lower surface: 232 [0038] Electromagnetic coil module: 3 [0039] Core: 31 [0040] Coil: 32 [0041] Conductive lead: 321 1003478823 -0 096115265 Form Number A0101 Page 8 of 16