CN100573755C - Electronic component and manufacture method thereof - Google Patents
Electronic component and manufacture method thereof Download PDFInfo
- Publication number
- CN100573755C CN100573755C CNB2006100880844A CN200610088084A CN100573755C CN 100573755 C CN100573755 C CN 100573755C CN B2006100880844 A CNB2006100880844 A CN B2006100880844A CN 200610088084 A CN200610088084 A CN 200610088084A CN 100573755 C CN100573755 C CN 100573755C
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- China
- Prior art keywords
- insulating body
- sidewall
- building brick
- pin terminals
- electronic component
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Abstract
A kind of electronic component that is used on the circuit board, comprise insulating body, be contained in the some electronic building bricks in the insulating body and be fixed in number of pins terminal on the insulating body, the lead-in wire sweat soldering of each electronic building brick is on pin terminals, and this structure can effectively reduce production costs and enhance productivity.
Description
[technical field]
The present invention relates to a kind of electronic component, relate in particular to a kind of Small electronic component and manufacture method thereof that is installed on the circuit board.
[technical background]
During modern electronic equipment was made, the mass-produced demand of circuit board high efficiency had fully been satisfied in the utilization of surface mounting technology (Surface Mount Technology), and made and the high density electronic component can be installed on the circuit board.In the surface mount production process, a large amount of packaged electronic components are placed to predefined position on the circuit board automatically, and contact with pad on the circuit board, then circuit board is sent into infrared ray together with electronic component on it or wave-soldering unit welds, make that corresponding conductive path is set up permanent electric connection on the pin of electronic component and the circuit board.
For satisfying the development trend of above-mentioned manufacturing mode, the encapsulating structure that in the past was usually used in integrated circuit (IC) chip is applied in the non-integrated circuit, as electric capacity, inductance, common mode choke etc.The U.S. the 6th, 593, No. 840 patent has disclosed a kind of electronic component, and it comprises an insulating body, and this insulating body is provided with two sidewalls, electronic building brick receiving space and is positioned at pin groove on the sidewall.The pin groove is provided with holding unit, and this holding unit comprises that at least one projection is in order to reduce the cross-sectional area of terminal containing slot.This electronic component also comprises the electronic building brick that is arranged in the insulating body receiving space, and electronic building brick comprises some lead-in wires respectively, and wherein each lead-in wire extends in the corresponding pin groove.Each pin groove is accommodated a pin terminals respectively, and wherein pin terminals comprises the U-shaped clamping part, and this structure is arranged so that clamping part tightly is fixed on pin terminals in each terminal groove and forms with lead-in wire and electrically connects.
The complex structure of this kind electronic component, relative cost is higher in manufacture process, and production efficiency is low, and because the lead-in wire of each electronic building brick is very tiny, is connected with the pin terminals interference when it is assembled, so be easy to generate fracture, can not guarantee product quality.
In addition, in the aforementioned U.S. the 6th, 593, also disclosed a kind of electronic component of similar in the background technology of No. 840 patents (shown in Fig. 3,4 of this patent), this electronic component comprises the body that is surrounded a receiving space by sidewall and roof, the number of pins terminal is injected and molded on the two side respectively, the electronic building brick that is installed on receiving space has some lead-in wires, each lead-in wire is wound in respectively on the corresponding pin terminals of extending the sidewall bottom surface, welds through wicking then so that the lead-in wire formation of pin terminals and electronic building brick electrically connects.
More than this electronic component in manufacture process because lead-in wire needs wicking to be welded on the pin terminals, corresponding increase manufacturing cost, and when a large amount of production, can not guarantee product quality, the production acceptance rate is low.Therefore, be necessary to design a kind of electronic component and overcome above shortcoming.
[summary of the invention]
The technical problem to be solved in the present invention is to provide a kind of low cost of manufacture, production efficiency height, production acceptance rate good electron element and manufacture method thereof.
For achieving the above object, the present invention adopts following technical scheme: a kind of electronic component, comprise insulating body, at least one electronic building brick and number of pins terminal, this insulating body comprises an at least one sidewall and a receiving space, sidewall has a bottom surface, electronic building brick is contained in the described insulating body receiving space, and each electronic building brick has some lead-in wires respectively, and pin terminals is individually fixed on the described sidewall.Each pin terminals comprises and is positioned at the outer weld part of insulating body, is fixed in the holding parts on the insulating body sidewall and extends the connecting portion of sidewall by holding parts, and wherein connecting portion is parallel with the bottom surface of sidewall and link to each other with the electronic building brick lead-in wire
For achieving the above object, the present invention also can adopt following technical scheme: a kind of manufacture method of electronic component, comprise an insulating body is provided, it comprises at least one sidewall and a receiving space, sidewall has a bottom surface, the number of pins terminal is shaped on the described sidewall, and this pin terminals comprises that the weld part that is positioned at outside the described insulating body, the holding parts that is fixed in described sidewall reach the connecting portion that is extended sidewall by holding parts, and this connecting portion is parallel with described sidewall bottom surface; Electronic building brick is provided, and it comprises some lead-in wires, described electronic building brick is installed in the described insulating body receiving space, and each lead-in wire is overlapped with respective pins terminal connecting portion respectively; The lead-in wire and the described pin terminals of described electronic building brick are carried out sweat soldering.。
Compared with prior art, the present invention has following beneficial effect: the connecting portion in pin terminals is parallel with the bottom surface of insulating body sidewall, can increase the contact area of lead-in wire and pin terminals, thereby can adopt the sweat soldering mode to make the lead-in wire of electronic building brick and pin terminals set up electric connection, and do not need soldering, can significantly reduce production costs, and enhance productivity and the production acceptance rate.
[description of drawings]
Fig. 1 is the stereogram of electronic component of the present invention;
Fig. 2 is another stereogram of electronic component of the present invention;
Fig. 3 is the pin terminals amplification stereogram of electronic component of the present invention;
Fig. 4 is electronic component assembling plane graph of the present invention.
Fig. 5 is another execution mode of electronic building brick of the present invention, twines and is welded on the pin terminals for the lead-in wire that succinctly only illustrates an electronic building brick among the figure.
[embodiment]
See also Figure 1 and Figure 2, electronic component 100 of the present invention is a kind of small-sized sheet common mode choke modules, certain this structure also can be applied in other electronic components, and this electronic component 100 comprises that number of pins terminal 2 is individually fixed on the insulating body 1 length direction two lateral walls 11; Insulating body 1 comprises the relative two side of Width 12, a roof 13 and the accepting groove 14 that surrounds with sidewall 11 thereof; Some electronic building bricks 3 (seeing also shown in Figure 4) are installed in the accepting groove 14 of insulating body 1, and each electronic building brick 3 has a circular magnetic core 31 and is wound in coil 32 on the magnetic core.
See also Fig. 2 and shown in Figure 3, pin terminals 2 is provided with the square weld part 21 that is used for the circuit board electric connection, adopt one-body molded or other modes to be fixed in the holding parts 22 of insulating body 1 sidewall 11 and the connecting portion 23 that electrically connects with electronic building brick 3 coils 32, this connecting portion 23 and holding parts 22 are vertical and extend outside the bottom surface 110 of sidewall 11 and parallel with it, holding parts 22 can be close to (as shown in Figure 2) with bottom surface 110, certainly, holding parts 22 also can continue to extend a segment distance makes connecting portion 23 and bottom surface 110 form the space (as shown in Figure 5) of certain distance, thereby the space is provided for lead-in wire 320 coiling on pin terminals 2 of electronic building brick 3.Connecting portion 23 has the main part identical with weld part 21, holding parts 22 width 231 and by the vertically extending welding bench 232 of main part 231 1 sides.When pin terminals 2 is fixed on the insulating body 1, each pin terminals 2 welding bench 232 is positioned at the position, space of this pin terminals 2 and 2 formation of adjacent leads terminal, certainly, this welding bench 232 can also continue to extend as long as it does not contact with the connecting portion 23 of terminals of adjacent 2, and some lead-in wires 320 of electronic building brick 3 coils 32 can overlap with each pin terminals very easily thus.
See also shown in Figure 4ly, in manufacture process, at first will be shaped on the insulating body 1 by injection mo(u)lding or other molding modes from the stamping forming pin terminals 2 of strip; To make good electronic building brick then and be installed in the groove 14 of insulating body 1, also fixed substances such as viscose glue (not shown) can be filled into this moment in the space around the electronic building brick 3 so that electronic building brick 3 is fixing; Simultaneously, the institute leaded 320 of each coil 32 is placed in the corresponding pin terminals space, make the lead-in wire 320 and the connecting portion 23 of pin terminals 2 overlap, also can be earlier with lead-in wire 320 after holding parts 22 carries out coiling with connecting portion 23 overlap joints (as shown in Figure 5), also can will go between by means of viscose glue and 320 accurately locate this moment; The electronic component 100 that at last this is assembled is delivered to welding equipment and is carried out sweat soldering, and lead-in wire 320 sweat solderings of electronic building brick 3 are to the welding bench 232 of pin terminals 2.
The sweat soldering of Cai Yonging in the present invention is a kind of of heat release welding, produces a kind of method that excessive heat is finished welding when it utilizes exothermic reaction.The sweat soldering reaction speed is very fast, and moment just can be finished welding, produces that heat is high can effectively to conduct to the welding position, and it is fused into one, and forms the molecule combination, and it need not other any heat energy.Sweat soldering is applied to does not need to use solder(ing) paste in the manufacturing of electronic component, and the electric and satisfactory mechanical property of solder joint, is adapted to mass automatic production, and cost is low.
Claims (10)
1. electronic component, comprise insulating body, at least one electronic building brick and number of pins terminal, this insulating body comprises an at least one sidewall and a receiving space, sidewall has a bottom surface, described electronic building brick is contained in the described insulating body receiving space, each electronic building brick has some lead-in wires respectively, described pin terminals is individually fixed on the described insulating body sidewall, it is characterized in that: described pin terminals comprises the weld part that is positioned at outside the described insulating body, be fixed in the holding parts on the described insulating body sidewall and extend the connecting portion of described sidewall by holding parts, described connecting portion is parallel with the bottom surface of described sidewall and link to each other with described electronic building brick lead-in wire.
2. electronic component as claimed in claim 1 is characterized in that: the connecting portion of described pin terminals is provided with a welding bench to adjacent side pin terminals extension.
3. electronic component as claimed in claim 2 is characterized in that: described welding bench is positioned at the gap that adjacent two pins terminal forms.
4. electronic component as claimed in claim 2 is characterized in that: the lead-in wire overlap joint of described electronic building brick and sweat soldering are to the welding bench of described pin terminals.
5. electronic component as claimed in claim 1 is characterized in that: the connecting portion of described pin terminals is vertical mutually with holding parts.
6. the manufacture method of an electronic component, it is characterized in that: this method comprises provides an insulating body, it comprises at least one sidewall and a receiving space, sidewall has a bottom surface, the number of pins terminal is shaped on the described sidewall, this pin terminals comprises that the weld part that is positioned at outside the described insulating body, the holding parts that is fixed in described sidewall reach the connecting portion that is extended sidewall by holding parts, and this connecting portion is parallel with described sidewall bottom surface; Electronic building brick is provided, and it comprises some lead-in wires, described electronic building brick is installed in the described insulating body receiving space, and each lead-in wire is overlapped with respective pins terminal connecting portion respectively; The lead-in wire and the described pin terminals of described electronic building brick are carried out sweat soldering.
7. the manufacture method of electronic component as claimed in claim 6 is characterized in that: the connecting portion of described pin terminals is provided with a welding bench that extends to adjacent side pin terminals.
8. the manufacture method of electronic component as claimed in claim 7, it is characterized in that: the lead-in wire of described electronic building brick is overlapped in respectively on the welding bench of described connecting portion.
The manufacture method of 9 electronic components as claimed in claim 6 is characterized in that: with viscose glue described electronic building brick lead-in wire is fixed on the described insulating body so that sweat soldering.
10. the manufacture method of electronic component as claimed in claim 6 is characterized in that: fill the receiving space of described insulating body with viscose glue, so that described electronic building brick is fixed on the insulating body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100880844A CN100573755C (en) | 2006-06-23 | 2006-06-23 | Electronic component and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100880844A CN100573755C (en) | 2006-06-23 | 2006-06-23 | Electronic component and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101093747A CN101093747A (en) | 2007-12-26 |
| CN100573755C true CN100573755C (en) | 2009-12-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100880844A Expired - Fee Related CN100573755C (en) | 2006-06-23 | 2006-06-23 | Electronic component and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100573755C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106683827B (en) * | 2017-02-24 | 2018-12-18 | 广东美信科技股份有限公司 | A kind of filter construction and welding fixture and production method |
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2006
- 2006-06-23 CN CNB2006100880844A patent/CN100573755C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101093747A (en) | 2007-12-26 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091223 Termination date: 20160623 |