TWI361451B - Method for cleaning a substrate - Google Patents

Method for cleaning a substrate Download PDF

Info

Publication number
TWI361451B
TWI361451B TW096141461A TW96141461A TWI361451B TW I361451 B TWI361451 B TW I361451B TW 096141461 A TW096141461 A TW 096141461A TW 96141461 A TW96141461 A TW 96141461A TW I361451 B TWI361451 B TW I361451B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning
surface tension
liquid
water
Prior art date
Application number
TW096141461A
Other languages
English (en)
Chinese (zh)
Other versions
TW200822195A (en
Inventor
Dae Hee Gimm
Original Assignee
Mujin Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mujin Electronics Co Ltd filed Critical Mujin Electronics Co Ltd
Publication of TW200822195A publication Critical patent/TW200822195A/zh
Application granted granted Critical
Publication of TWI361451B publication Critical patent/TWI361451B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5031—Azeotropic mixtures of non-halogenated solvents

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW096141461A 2006-11-14 2007-11-02 Method for cleaning a substrate TWI361451B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060112014A KR100862911B1 (ko) 2006-11-14 2006-11-14 기판 세정 방법

Publications (2)

Publication Number Publication Date
TW200822195A TW200822195A (en) 2008-05-16
TWI361451B true TWI361451B (en) 2012-04-01

Family

ID=39401843

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096141461A TWI361451B (en) 2006-11-14 2007-11-02 Method for cleaning a substrate

Country Status (4)

Country Link
KR (1) KR100862911B1 (ko)
CN (1) CN101536158B (ko)
TW (1) TWI361451B (ko)
WO (1) WO2008060069A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113539900B (zh) * 2021-07-16 2023-09-19 长江存储科技有限责任公司 用于干燥晶圆的方法和装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7021319B2 (en) 2000-06-26 2006-04-04 Applied Materials Inc. Assisted rinsing in a single wafer cleaning process
TW200303581A (en) * 2002-02-28 2003-09-01 Tech Ltd A Method and apparatus for cleaning and drying semiconductor wafer
KR100413030B1 (en) * 2002-10-01 2003-12-31 Tech Ltd A Semiconductor wafer cleaning and drying apparatus
JP4333866B2 (ja) 2002-09-26 2009-09-16 大日本スクリーン製造株式会社 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
KR100862911B1 (ko) 2008-10-13
TW200822195A (en) 2008-05-16
KR20080043444A (ko) 2008-05-19
CN101536158A (zh) 2009-09-16
WO2008060069A1 (en) 2008-05-22
CN101536158B (zh) 2012-01-11

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