TWI360834B - Connection member, ground structure, heater and ap - Google Patents

Description

26724pif.doc IX. Inventor's Note: This application claims the priority of the Korean Patent Application No. 7_1〇7927, which was filed in 2007, the application for the patent application. The elements are integrated into this specification. TECHNICAL FIELD OF THE INVENTION The present invention relates to a connecting member, a grounding structure including the connecting member, a heat thief, and a substrate processing apparatus. In particular, the present invention relates to a connecting member of =Γ= to a grounding seat, a grounding structure including the connecting member, heating, and a substrate processing apparatus. [Prior Art] The semiconductor component is manufactured by the following process: the circuit process of the semiconductor circuit on the semiconductor substrate (fab (four), the electrical crystal classification of the electrical characteristics of the semiconductor component (electncal dle sortlng, EDS) process A packaging process in which a semiconductor device is immersed in a semiconductor device and a semiconductor substrate is smgulated into a semiconductor wafer. The circuit process may include a deposition process in a semi-conducting plate formation layer, and a photoresist pattern is formed. The lithography (rushing. extinguishing _ ringing) 4. The ion implantation process in the pattern of the layer is formed, the different month washing process on the semiconductor substrate is removed, and the drying process of the dried semiconductor substrate is dried. And a test process for detecting defects in layers or patterns. Now, plasma-enhanced chemical vapor deposition (9) is required to be widely used in circuit systems 1360834 26724pif.doc

The process 'fires the process gas into a plasma state to form a layer or pattern. A conventional PECVD apparatus can include a chamber having a space for processing a semiconductor substrate, a heater located within the chamber to heat the semiconductor substrate, and an electrode to form a plasma gas into the reaction gas introduced into the chamber. The heater may include a heating block, a heating electrode built into the heating block, and a grounding structure built into the heating block. An example of a grounding structure is disclosed in Korean Utility Model Application No.

Fig. 1 is a perspective view of a conventional ground structure, and Fig. 2 is a perspective view of a conductive sheet and a jig in the ground structure of Fig. Referring to Figures 1 and 2, the ground structure includes a clamp for clamping the ground terminal 20 and a conductive sheet 40 connected between the clamp 3 and the ground base 1 to form a ground path. The jig 3 and the conductive sheet 4A and the conductive sheet 4A and the ground base 10 are fixed to each other using screws 50, respectively.

However, since the dislocation 30, the conductive sheet 4〇, and the grounding base 1〇 are combined with each other using the screw 50, contact failure may occur between the dislocation 3Q and the conductive sheet 4Q and the conductive sheet 4〇 and the grounding base 10 (c〇ntact promotion) (4) Thus, arcing occurs between the clamp 3〇 and the conductive sheet 4〇 and the conductive sheet 4. Further, due to the shape of the conductive sheet 40, the processing gas can be converted into a plasma power. The curved portion of the conductive sheet 40. Thus, the concentrated high-frequency power may cut the conductive sheet. [Inventive content] The month of the invention is sufficient to stably connect the ground terminal. The embodiment of the present invention provides a connecting member to the grounding seat. 26724pif.doc 26724pif.doc Embodiments of the present invention also provide a grounding comprising the above-described connecting member. The present invention provides a heating comprising the above connecting member. The embodiment of the present invention further provides a processing device. The substrate of the above-mentioned connecting member is provided with a bow member and a curved portion according to the connection member of the present invention. The holding portion holds the grounding terminal. ^ 1 u疋0卩 and the portion is connected to the miscellaneous portion. The bending terminal is moved in the longitudinal direction. The bending portion is formed along the coupling structure. The bending portion is integrally formed. According to the embodiment, the clamping portion, the positioning portion, and the same example are used to clamp the fixing portion and the bending portion. In the embodiment, the clamping portion, the mosquito portion, and the 'f curved portion have a plurality of holes formed by forming and forming an uneven portion of the surface portion of the curved portion, and the portion may be in the shape of a flat plate. Throughout the plate shape, the thickness of the curved portion is about 1 mm to about 3 ug. In addition, the curved portion has an uneven surface. - The fabric between the fabric and the central portion is stepped from the circular portion. The radius is from about G.5 mm to about 3 rnm. According to another embodiment, the clamping portion may include two flat plates and a receiving plate connected to the flat plate to form a receiving hole for accommodating the grounding terminal. 26724pif.doc The member that is placed in = can include the above-mentioned grounding structure, such as fixing the grounding terminal according to another aspect of the invention, including the grounding seat = and the connecting member. The grounding terminal can be mechanically inserted into the shaft. The holder (10) (4) is electrically connected to the grounding seat. In one step, the thermal expansion of the grounding terminal is bent along the length of the grounding terminal. The connecting member of the connecting body may include a mosquito (10) for tilting the ground terminal ==/ Na is broken. The material portion is bent to allow for the length direction of the terminal of the terminal, and between the chest and the clamping portion. According to another embodiment, the grounding seat may have a space for accommodating the connecting member. The accommodating space is covered by the insulating cover body. The grounding structure of the other aspect of the invention includes a grounding seat, a grounding end, and an insulating member. The grounding seat has an accommodating space. It is exposed through the accommodating space, and the connecting member electrically connects the sub-it of the sub-unit to the grounding seat. The connecting member includes a holding portion that elastically holds the grounding end, a side portion that is disposed in the accommodating space, and a bent portion that connects the connecting portion and the fixing portion. The clamping portion has a flat shape and penetrates the flat plate shape and has a plurality of holes. The curved 'curved portion is bent to allow the nip portion to be privately moved along the length of the grounding terminal. The insulating member is interposed between the grounding seat and the clamping portion. ° According to the -f compensation, the grounding structure is more covered with a cover. According to another embodiment, the clamping portion, the fixing portion, and the curved portion are integrally formed. 1360834 26724pif.doc Between the curved portion and the _ and the curved portion and the nip portion ADD according to another aspect of the present invention includes a heating block, an urging member, a =, a grounding seat, a grounding terminal, and a connecting member. The heating element is built into the grounding seat and the heating block. Grounding The zizi is movably inserted into the grounding base. Step-by-step, connect to the pole. The secret of connecting the components of the company is connected with the heart. The heat-expanding device that feeds the grounding terminal is bent along the length direction of the grounding terminal, and the substrate processing device of the invention includes a chamber, a twisting member, and an upper electrode. The chamber accommodates the substrate. The substrate is heated. The reaction gas supply member is positioned in the chamber reaction body: the upper electrode is disposed in the chamber to be inserted into the heating block from the lower electrode, and is inserted into the grounding block. The grounding terminal can be grounded. The connecting member electrically connects the conductive clamping member to the grounding seat. The connecting member is connected along the length direction of the grounding terminal (4); ttr is thus connected to the component by an integral structure to electrically contact the grounding terminal, and the material is met. The portion of the joint between the fine portion of the light scale and the joint between the curved portion and the nip portion are not damaged: even if the high-frequency power is concentrated on the joint portion, the bent portion 9 1360834 26724pif.doc [Embodiment] The drawings showing embodiments of the present invention are more fully described as "and" the present invention can be embodied in various forms and not in the embodiments set forth herein. Rather, the scope of the present invention is to be fully described in the light of the present disclosure. In the drawings, the dimensions and relative sizes of the layers and regions are exaggerated. It should be understood that “an” is “coupled to,” another element or layer is referred to as “located,”, “connected to,” or “lighted” to the layer or layer. Or, when an if flying member or layer, or there may be intermediate elements, the anti-coupling is connected to, and is also "directly located", "directly connected to," or "directly in the drawing, on the phase m layer. 'There is no intermediate element or layer. In all terms "and / or,, spoon Lr shows similar elements. As used in this case, all combinations of i-Minaki items are arbitrarily selected as well as '%, though, '" elements, parts, regions r/^, 弟二'', etc. to describe various fields. , layers and / or parts or parts, materials, components, divisions - components ': ^ ^, language restrictions. These terms are only used / or part. Therefore, in layers or parts In addition, the elements, components, and regions of the regions, layers, and regions, the following, the cattle, regions, layers, and/or portions. The bruises may be referred to as the second element::: "Bottom", 'Captain' and similar terms, lower, upper,,, and mid-month are used for convenience of description. Figure 26724pif.doc 2 shows a component or part with another element or part. (4) Two orientations, space relative The terminology is intended to be used in the context of the singularity. For example, if the figure is turned over in the drawings, it is described as being "below," or "below" the other elements or parts. Face, language to explain accordingly.) The space used in the application of this book is relative to the technique used in this case. It is only used for the bribe, return, frequency, and m in the case of the === = deposit surface:; row: = - one or more of the two = components, parts, and / or their ethnic groups. ::: Two definitions, all terms used in this application (including; those who are notified of this two definitions. The form of π < is interpreted 'unless explicitly in this case. Figure 34 shows the invention according to the invention - implementation _ Perspective of the grounding structure 1360834 26724pif.doc 照照图 3 'The grounding structure i of the present embodiment includes the grounding base 接地chuan grounding terminal 120, the connecting member 〇 3 〇, the insulating member 14 〇 and the cover body 5 〇 grounding seat 11 In this embodiment, the grounding seat may comprise a conductive material, such as aluminum. The grounding seat 11 has a receiving space and a first hole] 14. The valley space 112 is formed on the side of the grounding seat 11〇. The accommodating space η] ′′ is exposed on the upper surface of the two grounding seats 110. In the embodiment, the accommodating space 112 has a quarter-circular cross section. Further, the second hole connecting the arranging spaces 112 (not shown) can be formed vertically through the grounding base 110. ί - The hole 114 runs vertically The seat 110 formed heater (not shown) FIG does not ^) and the electrode (not shown) for supplying current cable (not not) received in the first hole 114. Insert the ground hole ^ 120 into the second hole. The grounding terminal 120 in the second hole is in the embodiment. The grounding terminal (10) is movable H. The grounding terminal 120 is in the vertical direction. The grounding terminal 12 is 0^1/匕. The ground terminal 120 can include nickel. Further, (not shown). The Tan ()) process is connected to the electrode of the heater to connect the internal connection member 130' to the ground terminal 120. A perspective view of the connecting member of the grounding structure in the 1st. Part 13::^::,=13. The nipple is a screw 138 and a second screw 139. 1360834 26724pif.doc The holding part (3) is positioned in the accommodating space 112. The clamping part is a thin elastic plate. The central portion 132 can be a u-shaped middle curved piece, and the clamping portion 132 includes two vertical plates 1323 and 1325 and a curved plate! 32c. The two vertical plates 132 Μ σ 132b respectively have a _mu m? 32c connected between the sides of the vertical slab and the coffee to make the vertical plates (10) and 132b mutually.岐13

The accommodating side of the terminal 120. Therefore, the diameter of the receiving hole::: the ground terminal 120 is substantially the same. As a result, the nip portion 3 surrounds the outer surface of the ground terminal in the accommodating hole 132d. The mouth-to-job 138 is secured to the two vertical plates 32& and 132b via the first screw holes 132e. Thus, the clamping portion 132 fastens the ground terminal (10). The inner surface of the clamping portion m closely contacts the outer surface of the grounding terminal (4). At this time, since the upper diameter of the grounding terminal 12() is larger than the diameter of the second hole 132d of the clamping portion 132, the first screw 138 is not loosened. In this case, the ground terminal 12A is not released from the clamping portion 132. The port 卩丨 34 is disposed in the valley space 112. The fixing portion 134 is in contact with the socket 110. At this time, since the fixing portion 134 has a vertical flat plate shape, the contact area between the fixing portion 134 and the grounding seat U0 becomes large. Further, the fixing portion 134 has a second screw hole 134a. The second screws 139 are fastened to the fixing portion 134 - , and the seat 110 via the second screw holes 13 . Thus, the fixing portion 134 closely contacts the grounding seat 11A. The temporary curved portion 136 is connected between the clamping portion 132 and the fixed portion 134. In the present embodiment, the bent portion 137 can connect any one of the upper ends of the two vertical plates 13 1360834 26724pif.docs 132a and 132b in the holding portion 132 to the upper end of the fixing portion 134. For example, the curved portion 136 has a flat plate shape, and a plurality of third holes 136a are formed through the flat plate shape. Further, the third hole 136a may have various shapes such as a quadrangle, a circle, a round shape, or the like. At this time, since the curved portion 136 has the second hole 136a, the curved portion 136 can be easily bent. Alternatively, the curved portion 136 may be a non-porous flat plate shape. In the present embodiment, the thickness of the curved portion 136 may be from about 1 mm to about 3 mm. When the high frequency power for converting the reaction gas into the plasma is applied to the bent portion 136, the above thickness of the bent portion 136 can provide the bent portion 136 having durability. The advancement-bending portion 136f is curved to allow the nip portion 132 of the holding ground terminal 120 to move in the longitudinal direction of the ground terminal 120 in accordance with thermal expansion of the ground terminal 12''. Further, as mentioned above, since the nip portion 132 moves in the vertical direction, caused by the high temperature of the heater, the thermal expansion of the ground terminal 120 is not limited. As a result, the ground terminal 120 hard soldered to the heater is not cut. At this time, when the thickness of the bent portion 136 is less than about 1 mm, the bent portion 136 may be cracked due to high frequency power. On the other hand, when the thickness of the bent portion exceeds about 3 mm, the bent portion 136 is not easily bent. Further, the connecting portion between the curved portion 136 and the fixed portion 134 and the curved portion 136 of the curved portion 136 may be circular. At this time, the high frequency power = is in the connection portion. Thus, the thickness of the circular joint is thick to allow the joint to withstand high frequency power. In this embodiment, the radius R of the circular joint may be from about 0.5 mm to about 3 mm. At this time, when the radius R is lower than about 〇.5_B, the connection may be split by the high frequency power of 14 1360834 26724pif.doc. Conversely, when the radius R exceeds about 3, the connection is too thick, bent. The portion 136 is not easily bent. In the present embodiment, the grip portion 132, the fixing portion 134, and the curved portion 136 may have an uneven surface. The uneven surface of the holding portion 132, the fixing portion 134, and the curved portion 1 can be used to increase the surface area of the connecting member η. The frequency power is transmitted through the surface of the connecting member 130. The transmission path of the high-frequency power is increased in proportion to the increase in the surface area of the connecting member 13A. Therefore, the same-frequency power can be dispersedly transmitted, so that the connecting member 13 is not damaged, thereby prolonging the life of the connecting member 130. The uneven surface of the connecting member 130 is formed by a bead (10) process such as a g) process, a sand blasting process, a chemical etching process, or the high frequency power is transmitted through the bent portion 136. The portion is formed only on the surface of the curved portion 136. As a result, the high-frequency power can be dispersedly conveyed 'so that the bent portion 136 is not damaged' thereby extending the life of the connecting member 13A. Further, the holding portion 132 and the fixing portion The 134 and the curved portion 136 can be integrally formed. Therefore, no contact failure occurs between the nip portion 132 and the curved portion 136 and between the fixed portion 134 and the curved portion 136, and arc discharge does not occur. In the present embodiment, 'clamping The portion 132, the fixing portion, and the curved portion 136 may include substantially the same conductive material. Examples of the conductive material may include beryllium (Be), copper (Cupper, Cu), alloys thereof, etc. FIG. 5 to FIG. A perspective view of a connecting member according to other embodiments of the present invention. 15 1360834 26724pif.doc The connecting member 130 in FIGS. 5 to 7 includes elements that are different from the connecting portion 130 in FIG. 3 except for the bent portion. The same reference numerals are used for the same elements, and further descriptions for the same elements are omitted for the sake of brevity. Referring to Figure 5, the curved portion 136 will be the two plates n2a and 132b in the clamping portion 132. The lower end is connected to the lower end of the fixing portion 134. Referring to Fig. 6, the curved portion 136 connects any one of the front ends of the two plates 132a and 132b in the holding portion 132 to the front end of the fixing portion 134. Referring to Fig. 7, the bending portion 136 connects any one of the second plates 132 & 132b and 132b in the clamping portion 132 to the middle end of the fixing portion 134. Referring again to Figures 3 and 4, the insulating member 14 is interposed between the grounding seat 11 and the connecting member 130. The clamping portion 132 is electrically insulated from the clamping portion 132. The insulating member 14 includes a first insulator 142 and a second insulator 144. The flange body 142 is disposed on the grounding seat π〇 The side surface and the clamping portion 132 are located on the side of the valley space 112. The second insulator 144 is disposed between the bottom surface of the grounding seat 110 and the clamping portion 132, that is, on the bottom surface of the receiving space 112. 150 covers the accommodating space 112. The cover 150 prevents The ground terminal 120 and the connecting member 130 are exposed to the outside. In the embodiment, the cover 15 〇 may include an insulating material. Therefore, between the ground terminal 12 〇 and the cover 15 以及 and between the connecting member 130 and the cover 150 According to the present embodiment, the first screw 138 fixes the clamping portion 132 such that the clamping portion 132 closely contacts the ground terminal 12A. Thus, at the ground terminal 16 1360834 26724pif.doc = 〇S connection member 13〇 No arcing will occur between them. The advancement 134 and the curved portion 136 are integrally formed, and arcing due to poor contact between the sandwiching portion 132_(4) 136(4) and the solid material: 13: does not occur. . In the presence of the bent portion 136, the nip portion is easily moved in the vertical direction so that the thermal expansion of the ground terminal is not restricted. Therefore, the ground terminal 12A is not cut.

Further, the connecting portion between the grip portion 132 and the curved portion 136 and the fixed portion 134 disc curved portion 36 may be circular. Therefore, although the high frequency power may collect the towel at the joint portion ±, the bent portion 136 is not cut. Heater Port Figure 8 is a cross-sectional view of a heater in accordance with an embodiment of the present invention. Referring to Fig. 8, the heater 200 of the present embodiment includes a heating block 210, a heating element 220, an electrode 230, and a ground structure 1A.

The heating block 210 includes a circular plate on which the semiconductor substrate is placed and a vertical axis connecting the lower central portion of the circular plate. In the present embodiment, the heating block 21A may include ceramic. Examples of the ceramic may include Α12〇3, γ2〇3, Αΐ2〇3/γ2〇3, ZrQ2, A1C, ΤιΝ, AIN, TiC, Mg〇, CaO, Ce02, Ti02, BxCy, BN, Si〇2, SiC, YAG, mullite, A1F3, etc. These materials can be used individually or in combination. The heating element 220 is built into the heating block 210. In the present embodiment, the heating elements 220 are disposed in a concentric pattern in the circular plate of the heating block 21A. The heating block 220 generates heat to heat the semiconductor substrate. The heating block 220 can comprise a metal. Examples of the metal may include tungsten (W), molybdenum (Mo), button (Ta), titanium (Ti), 17 1360834 _ 26724pif.doc alloy of the above metals, iron chromium (Fe-Cr) alloy, nickel chromium (10) core) The human power is built on the heating block to connect to the high frequency power supply. Therefore, the electrode 23 can sense the plasma to treat the semiconductor substrate. Alternatively, electrode 23G can be keyed to a direct current (ic) power source. Therefore, the electrode 23A can generate an electrostatic force that holds the semiconductor substrate. The ground structure 100 includes a grounding seat, a grounding terminal, a connecting member, and a cover. At this time, the ground structure 1 is the same as the ground structure in FIG. 3 to FIG. Therefore, a further explanation about the ground structure is omitted for the sake of brevity. The grounding seat of the grounding structure 100 is mounted on the lower end of the vertical axis of the heating block 21〇. The ground terminal of the grounding structure 10 is electrically connected to the electrode 230. Substrate Processing Fig. 9 is a cross-sectional view of a substrate processing apparatus in accordance with an embodiment of the present invention. Referring to Fig. 9, the apparatus 3 of the present embodiment includes a chamber 310, a gas supply member 320, a head squeezing head 33, an upper electrode 340, and a heater 2''. The chamber 310 has a space for loading and processing a semiconductor substrate. The gas supply member 320 is coupled to the upper surface of the chamber 310. The gas supply member 320 supplies the reaction gas for processing the semiconductor substrate into the chamber 31. The showerhead 330 is disposed in the upper space of the chamber 310. The head 330 uniformly supplies the reaction gas to the semiconductor substrate. • The upper electrode 340 is connected to the shower head 330. The upper electrode 340 applies a high pressure to the reaction gas to convert the reaction gas into a plasma. 18 1360834 26724pif.doc Heater 200 includes a heating block, a heating element, and a lower electrode. At this time, the heater 200 and the heater port of Fig. 8 omits the step of the heater for the cleaning. The heating 200 is placed in the chamber 3 〇 v placed on the pure addition of the heating H. Cut substrate

Lu Ba, °" asks the head level to apply to the electric 榀 门 率 rate changes. When not less than 3, ' _ 'work, time 敕 2: to the electrode 'while the thickness of the ridge is 〇. 5mm, bend to it further, when not less than 2,5 _ high frequency power When the position is inflated, the curved portion will not bend, so that the heart is connected; § Not less than 19 1360834 26724pif.doc A high-frequency power level of 1,500 W is applied to the electrode, and when the thickness of the bent portion is 4.0 mm, the bent portion and the ground terminal are damaged. As a result, it can be noted that it is advantageous that the thickness of the bent portion is between about iiM and about 3 mm. The bent portion having the above thickness does not conform to the high frequency power (4). In the advance step, the bent portion can be easily bent so that the ground terminal is not damaged. According to the circular connection of the semi-finished connection, the radius of the connection is high frequency power (w) (mm) 200 500 1,000 1,500 2,000 2,500 3 000 0 by passing the failure of 0.5 by passing through --- Passing through 1.0 through through through through through through 1.5 through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through through Sub-4.0 is applied to the electrode by pass-through failure as shown in Table 2, 200W, 500W, 1, 〇〇〇W, 1,500w, 2, 〇〇^ 2,500W, and 3,000W of high-frequency power level At the same time, the radius of the circular connection changes. At this time, the thickness of the bent portion was 2.5 mm. When a high-frequency power level of not less than 1,500 W is applied to the connection portion of the connection portion that is half-controlled to Omm, that is, when the connection portion is not rounded, 20 26724pif.doc high-frequency power is concentrated on the connection portion, (10) The high-frequency power level of (10) is not less than about :::: meaning: ^:, about ~ large, rate and damage the bend. In the step-by-step, the defender will not be damaged due to the high grounding terminal. The car 2 is easily bent so that, according to the present invention, arcing does not occur on the connecting member, so that the connection of the grounding seat, the heater, and the connection including the ^ ^ are bad, and have a long life. The device in mind will not be based on this =; the example is written, but it is worth noting that the root of the theory (4) L domain technology can be repaired # and change. Therefore, the appended claims are subject to change in the specific embodiments of the invention, which are within the scope and scope of the invention as defined by the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0009] The above and other features and advantages of the present invention will become more apparent from the detailed description and the appended claims. . 512 is a perspective view of the clamp and conductive sheet of the ground structure of FIG. 3 is a perspective view of a ground structure in accordance with an embodiment of the present invention. Figure 4 is a perspective view of the connecting member of the grounding structure of Figure 3. 815 to 'FIG. 7 are perspective views of a 1360834 26724 pif.doc of a connecting member in accordance with other embodiments of the present invention. Figure 8 is a cross-sectional view of a heater in accordance with an embodiment of the present invention. Figure 9 is a cross-sectional view of an apparatus for processing a substrate in accordance with an embodiment of the present invention. [Main component symbol description] 1: Grounding structure 10: Grounding base 20: Grounding terminal 30: Fixture 40: Conductive sheet 50: Screw 100: Grounding structure 110: Grounding seat 112: accommodating space 114: First hole 120: Grounding terminal 130: connecting member 132: clamping portion 132a: vertical plate 132b: vertical plate 132c: curved plate 132d: receiving hole 132e: first screw hole 134: fixing portion 134a: second screw hole 22 1360834 26724pif.doc

136 Bending portion 136a: third hole 138 first screw 139 second screw 140 insulating member 142 first insulator 144 second insulator 150 cover 200 heater 210 heating block 220 heating element 230 electrode 300 substrate processing device 310 chamber 320 gas Providing member 330 nozzle 340 upper electrode

Claims (1)

1360834 26724pifl Revision date: July 12, 100 is the number of Chinese patents No. 96148448. There is no slash correction. The tenth application patent scope: 1. A grounding structure connecting member, comprising: a clamping portion for maintaining the grounding a grounding terminal of the structure, the grounding structure being connected to an electrode of a processing device having the grounding structure; a fixing portion fixed to the grounding seat of the grounding structure; and an e-bending portion connected to the clamping portion and Between the fixing portions, the curved portion is curved to allow the Wei clamping portion to move along the length direction of the position of the position. 2. The connecting member of the grounding structure according to claim i, wherein the clamping portion, the fixing portion and the bent portion are integrally formed. The connecting member of the grounding junction wheel according to the above aspect of the invention, wherein the missing portion, the fixing portion and the curved portion comprise substantially the same conductive material. 4. The connecting member of the grounding structure as described in claim 1, wherein the holding portion, the fixing portion and the bent portion each have an uneven surface. 5. The connecting member of the grounding structure as described in claim 1, wherein the bent portion is in the shape of a flat plate, and a plurality of holes penetrating the flat plate are formed. 6. The connecting member of the grounding structure according to claim 1, wherein the back curvature has a thickness of about 1 mm to about 3 mm. 7. The connecting structure of the grounding structure according to claim 1, wherein the bent portion has an uneven surface. 24 1360834 26724pifl • The Chinese patent scope of No. 96148448 is not underlined. This is a connection member of the grounding structure described in claim 1, wherein the bending is performed. The connecting portion and the connecting portion between the bent portion and the fixed portion are circular. 9. The connecting member of the grounding structure according to claim 8, wherein the radius of the circular connecting portion is about 〇5 mm to about 3 mm 〇10. The grounding structure according to claim 1 The connecting member' wherein the clamping portion comprises: two flat plates; and a curved plate 'connected between the flat plates to form a receiving hole for receiving the grounding terminal. The connecting member of the grounding structure as described in claim 10, wherein the clamping portion further comprises a screw inserted into the flat plate to fix the grounding terminal. 12. A grounding structure for connecting to an electrode of a processing device, the grounding structure comprising: a grounding ground; a grounding terminal movably inserted into the grounding seat; and a connecting member for maintaining the grounding The terminal electrically connects the ground terminal to the grounding seat, and the connecting member is bent along a length direction of the grounding terminal according to thermal expansion of the grounding terminal. 13. The grounding structure according to claim 12, wherein the connecting member comprises: a clamping portion 'to hold the grounding terminal; 25 1360834 26724pifl Revision period: July 12, 100 is No. 96148448 The Chinese patent range has no scribe line correction fixed portion, is fixed to the grounding seat; and a test portion 'connected between the clamping portion and the fixed portion, the curved portion is curved to allow the clamping portion Moving along the length of the ground terminal. 14. The grounding structure of claim 13, wherein the connecting member further comprises an insulating member interposed between the grounding seat and the clamping portion. . 15. The grounding structure of claim 12, wherein the grounding seat has a receiving space for receiving the connecting member. 〃 16. The grounding structure of claim 15 further comprising an insulating cover covering the accommodating space. 17. A grounding structure for connecting to a grounding structure of a processing device, comprising: a grounding seat having an accommodating space; and a ground terminal for inserting the grounding seat and interspersing the accommodating space The connecting member is electrically connected to the grounding terminal and the grounding member, and includes a member for elastically holding the grounding terminal and a solid portion (four) fixed to a side of the receiving space. And the fixing portion curved portion 'the bending=bending holding: moving along the length direction of the grounding terminal; and the rim member, interposed between the grounding seat and the clamping portion ❹ The grounding described in item 17 covers the insulating cover of the accommodating space. Further, 26 1360834 26724pifl. For the Chinese patent scope of No. 9614 «448, there is no slash correction. The date of this amendment is: July 12, 19, 19. The grounding structure described in claim 17 of the patent application, wherein The missing portion, the fixing portion, and the bent portion are integrally formed. 20. The grounding structure according to claim 17, wherein the bent portion and the connecting portion and the connecting portion between the bent portion and the fixed portion are circular. ' 21. A heater comprising: a heating block; a φ heating element built into the heating block; an electrode built into the heating block; a grounding seat mounted on the heating block; a grounding terminal a movably inserted into the grounding seat and connected to the electrode; and a connecting member for holding the grounding terminal to connect the grounding terminal to the grounding seat, the connecting member along with the grounding terminal The thermal expansion is curved along the length of the ground terminal. 22. A substrate processing apparatus comprising: a chamber for accommodating the substrate; a heater disposed in a lower space of the chamber to heat the substrate; a gas supply member disposed in the chamber An upper space to supply a reaction gas to the base plate; and an upper electrode provided in the chamber to form a plasma from the reaction gas, wherein the heater includes a heating block built in the heating The heating element in the block, the electrode built in the heating block, is mounted on the heating 27 1360834 26724pifl • The Chinese patent scope of No. 96148448 is not underlined. This correction date is on the block of July 12, 100. a grounding seat, a grounding terminal movably inserted into the grounding seat and connected to the electric ground, and a connecting member for holding the grounding terminal to connect the connecting member of the grounding seat with the ☆ The grounding terminal is bent in the longitudinal direction. 28