KR20090042050A - Connecting member, and ground structure, heater and apparatus for processing a substrate including the connecting member - Google Patents

Abstract

A connecting member and a ground structure, heater and an apparatus for processing a substrate including a connecting member are provided to prevent an occurrence of arcing due to a poor contact of each of the connecting members. A ground terminal is griped from a clamping unit(132). A clamping unit is arranged within an accommodating groove. A fixing unit(134) is arranged in order to contact a ground mount within the accommodating groove. A bending unit(136) connects the clamping unit and the fixing unit. The bending unit is curved, so that the clamping unit griping the ground terminal moves along with the longitudinal direction of the ground terminal according to the thermal expansion of the ground terminal.

Description

CONNECTING MEMBER, AND GROUND STRUCTURE, HEATER AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE CONNECTING MEMBER}

The present invention relates to a connecting member, a ground structure having the same, a heater and a substrate processing apparatus, and a connecting member for connecting the ground terminal and the ground mount, and a ground structure having the same, a heater and a substrate processing apparatus.

In general, a semiconductor device includes a Fab process for forming an electrical circuit on a semiconductor substrate, an electrical die sorting (EDS) process for inspecting electrical characteristics of the semiconductor devices formed in the fab process, and epoxy devices each. It is manufactured through a packaging process for encapsulation and individualization with resins.

The fab process includes a deposition process for forming a film on a semiconductor substrate, a chemical mechanical polishing process for planarizing the film, a photolithography process for forming a photoresist pattern on the film, and an electrical characteristic of the film using the photoresist pattern. An etching process for forming into a pattern having a pattern, an ion implantation process for implanting specific ions into a predetermined region of the semiconductor substrate, a cleaning process for removing impurities on the semiconductor substrate, and drying for drying the cleaned semiconductor substrate And an inspection step for inspecting the defect of the film or pattern.

In recent years, the use of plasma-enhanced chemical vapor deposition (PE-CVD) apparatuses in which a process gas is excited in a plasma state in a fab process to form a film or a pattern on a substrate is rapidly increasing. The PE-CVD apparatus includes a processing chamber having a space for processing a semiconductor substrate, a heater disposed inside the processing chamber and heating the semiconductor substrate, and an electrode for converting a process gas supplied to the processing chamber into a plasma state. Include. The heater includes a heating block, a heating electrode embedded in the heating block, and a ground structure embedded in the heating block. An example of the grounding structure is disclosed in Korean Utility Model Model No. 20-0420693.

1 is a perspective view for explaining the grounding structure 1 according to the prior art, Figure 2 is a perspective view for explaining the clamp 30 and the conductive sheet 40 shown in FIG.

1 and 2, the ground structure 1 may include a clamp 30 clamping the ground rod 20 and a conductive sheet connecting the clamp 30 and the ground base 10 to form a ground path. 40). The clamp 30, the conductive sheet 40, the conductive sheet 40, and the ground base 10 are fixed by fastening screws 50, respectively.

Since the clamp 30, the conductive sheet 40, and the ground base 10 are assembled by the fastening screw 50, between the clamp 30 and the conductive sheet 40 and between the conductive sheet 40 and the conductive sheet 40. Poor contact between the ground base 10 may occur. Thus, arcing may occur between the clamp 30 and the conductive sheet 40 and between the conductive sheet 40 and the ground base 10.

In addition, since the conductive sheet 40 has a 'U' shape, a high frequency power source for converting the process gas into a plasma state is concentrated at the bent portion. Therefore, a phenomenon in which the bent portion of the conductive sheet 40 is broken due to the influence of the high frequency power may occur.

The present invention provides a connecting member for stably connecting a ground terminal and a ground mount.

The present invention provides a grounding structure comprising the connecting member.

The present invention provides a heater including the ground structure.

The present invention provides a substrate processing apparatus including the heater.

The connecting member of the grounding structure according to the present invention includes a clamping part for holding a ground terminal, a fixing part fixed to a ground mount, and a connection between the clamping part and the fixing part, and the clamping part being bent to move along the longitudinal direction of the ground terminal. It includes a bending part.

According to an embodiment of the present invention, the clamping part, the fixing part and the bending part may be integral.

According to another embodiment of the present invention, the clamping part, the fixing part and the bending part may include the same conductive material.

According to another embodiment of the present invention, the clamping portion, the fixing portion and the bending portion may each have an uneven surface.

According to another embodiment of the present invention, the bending part may have a flat plate shape having a plurality of through holes.

According to another embodiment of the present invention, the bending portion may have a thickness of 1 to 3 mm.

According to another embodiment of the present invention, the bending part may have irregularities on the surface.

According to another embodiment of the present invention, the connection part of the bending part and the fixing part and the connection part of the bending part and the clamping part may be rounded.

The radius of the rounded connection sites may be 0.5 to 3 mm.

According to another embodiment of the present invention, the clamping portion may have two plates and a curved plate connecting the plates and forming a receiving groove for receiving the ground terminal.

The connection member may further include a fastening screw fastened through the plates to fix the ground terminal accommodated in the receiving groove.

The grounding structure according to the present invention has a grounding mount, a grounding terminal movably inserted into the grounding mount, and a grounding terminal that is electrically connected to the grounding mount, the length of the grounding terminal in accordance with thermal expansion of the grounding terminal. And a connecting member bent in the direction.

According to an embodiment of the present invention, the connecting member may include a clamping part for holding the ground terminal, a fixing part fixed to the ground mount, and a connection between the clamping part and the fixing part, and the clamping part having a length of the ground terminal. It may include a bending portion bent to move along the direction.

The ground structure may further include an insulating member interposed between the ground mount and the clamping portion.

According to another embodiment of the present invention, the ground mount may have a receiving groove for receiving the connection member.

The ground structure may further include an insulating cover covering the receiving groove.

The grounding structure according to the present invention includes a grounding mount having an accommodating groove, a grounding terminal movably inserted into the grounding mount and exposed to the accommodating groove, a clamping portion for elastically holding the grounding terminal, and the accommodating position. A flat plate having a fixing part fixed to the side of the groove and a plurality of through holes and connecting the clamping part and the fixing part, wherein the clamping part includes a bending part that is bent in the longitudinal direction of the ground terminal; And a connecting member electrically connecting the ground mount and an insulating member interposed between the ground mount and the clamping portion.

According to an embodiment of the present invention, the ground structure may further include an insulating cover covering the receiving groove.

According to another embodiment of the present invention, the clamping part, the fixing part and the bending part may be integral.

According to another embodiment of the present invention, the connection part of the bending part and the fixing part and the connection part of the bending part and the clamping part may be rounded.

The heater according to the present invention is inserted into the heating block, the heating element embedded in the heating block, the electrode embedded in the heating block, a ground mount mounted on one side of the heating block, the ground mount, And a grounding member connected to the electrode and a grounding member to be electrically connected to the grounding mount and bent in the longitudinal direction of the grounding terminal according to thermal expansion of the grounding terminal.

A substrate processing apparatus according to the present invention includes a chamber for accommodating a substrate, a heater disposed under the chamber to heat the substrate, and a process gas disposed above the substrate for processing the substrate onto the substrate. A gas supply unit providing an upper electrode and disposed in the chamber to convert the process gas into a plasma state,

The heater may include a heating block, a heating element embedded in the heating block, an electrode embedded in the heating block, a ground mount mounted on one side of the heating block, and movably inserted into the ground mount. And a connected member electrically connected to the ground mount by holding the ground terminal and the ground terminal, and bent in the longitudinal direction of the ground terminal according to thermal expansion of the ground terminal.

The connecting member according to the invention is integrally formed to electrically connect the ground terminal and the ground mount. Therefore, it is possible to prevent the occurrence of arcing due to poor contact of each portion forming the connecting member.

In addition, by rounding the connection part between the bending part and the fixing part and the connection part between the bending part and the clamping part in the connection member, the bending of the bending part may be prevented even if the high frequency power for plasma formation is concentrated on the connection part. .

Hereinafter, a connection member, a ground structure having the same, a heater, and a substrate processing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other It should be understood that it does not exclude in advance the possibility of the presence or addition of features or numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

3 is a perspective view showing a ground structure 100 according to an embodiment of the present invention.

Referring to FIG. 3, the ground structure 100 includes a ground mount 110, a ground terminal 120, a connection member 130, an insulation member 140, and a cover 150.

The ground mount 110 has a substantially cylindrical shape. The ground mount 110 may include a conductive material such as aluminum. The ground mount 110 has a receiving groove 112 and an opening 114.

The receiving groove 112 is formed on the side of the ground mount 110. The receiving groove 112 is exposed through the top surface of the ground mount 110. For example, the receiving groove 112 has a cross section of approximately 1/4 arc shape. In addition, a through hole (not shown) penetrating the ground mount 110 is formed in the bottom surface of the receiving groove 112 in a vertical direction.

The opening 114 is formed through the ground mount 110 in a vertical direction. The opening 114 accommodates a heating element for supplying power to the heating element and the electrode of the heater (not shown), respectively.

The ground terminal 120 is inserted into the through hole and protrudes into the receiving groove 112. The diameter of the ground terminal 120 is smaller than the diameter of the through hole. Accordingly, the ground terminal 120 may move in the vertical direction through the through hole. Nickel may be used as a material of the ground terminal 120. On the other hand, the ground terminal 120 is connected to the electrode of the heater through a brazing process.

The connecting member 130 is disposed in the receiving groove 112. The connection member 130 electrically connects the ground mount 110 and the ground terminal 120.

4 is a perspective view illustrating the connection member 130 illustrated in FIG. 3.

3 and 4, the connection member 130 includes a clamping part 132, a fixing part 134, a bending part 136, a first fastening screw 138, and a second fastening screw 139. Include.

The clamping part 132 is disposed in the receiving groove 112. The clamping part 132 is an elastic plate having a thin thickness. The clamping part 132 has an approximately U-shaped shape having a middle bent. In detail, the clamping part 132 includes two vertical plates 132a and 132b and a curved plate 132c. The two vertical plates 132a and 132b each have a first screw hole 132e. The curved plate 132c is connected to one side of the flat plates 132a and 132b, respectively, to connect the flat plates 132a and 132b. The curved plate 132c forms a receiving groove 132d for receiving the ground terminal 120. The diameter of the receiving groove 132d is substantially the same as the diameter of the ground terminal 120. The ground terminal 120 is accommodated in the accommodation groove 132d, and the clamping part 132 surrounds the outer circumferential surface of the ground terminal 120.

The first fastening screw 138 penetrates the first screw hole 132e to fasten the two vertical plates 132a and 132b. Therefore, the clamping part 132 fixes the ground terminal 120, and the inner surface of the clamping part 132 and the outer surface of the ground terminal 120 are in close contact with each other.

Particularly, since the upper diameter of the ground terminal 120 is larger than the diameter of the receiving groove 132d of the clamping part 132, the ground terminal 120 does not loosen the first fastening screw 138. There is no deviation from the clamping portion 132 toward the bottom.

The fixing part 134 is disposed to contact the ground mount 110 in the receiving groove 112. Since the fixing part 134 has a vertical flat plate shape, a contact area with the ground mount 110 is wide. The fixing part 134 has a second screw hole 134a.

The second fastening screw 139 passes through the second screw hole 134a to fix the fixing part 134 and the ground mount 110. Thus, the fixing part 134 is in close contact with the ground mount 110.

The bending part 136 connects the clamping part 132 and the fixing part 134. Specifically, the bending part 136 connects the upper end of any one of the two flat plates 132a and 132b of the clamping part 132 with the upper end of the fixing part 134. For example, the bending part 136 may have a flat plate shape having a plurality of through holes 136a. The through holes 136a may have various shapes such as a rectangle, a circle, and an oval. The bending part 136 may be easily bent by the bending part 136 having the through holes 136a. As another example, the bending part 136 may simply have a flat plate shape.

The thickness t of the bending part 136 may be about 1 to 3 mm. Accordingly, the bending part 136 withstands the high frequency power source applied to convert the process gas into the plasma state. In addition, the bending part 136 is bent such that the clamping part 132 holding the ground terminal 120 moves along the length direction of the ground terminal 120 according to thermal expansion of the ground terminal 120. Since the clamping part 132 may move in the vertical direction, thermal expansion of the ground terminal 120 due to the high temperature of the heater is not disturbed. Therefore, disconnection of the ground terminal 120 can be prevented.

When the thickness t of the bending part 136 is less than about 1 mm, the bending part 136 may not be able to withstand the high frequency power and may be damaged. When the thickness t of the bending portion 136 exceeds about 3 mm, the bending portion 136 is too thick to bend.

In addition, the connection part of the bending part 136 and the fixing part 134 and the connection part of the bending part 136 and the clamping part 132 are rounded. Since the high frequency power is concentrated in the connection parts, the thickness of the connection parts is increased through the rounding process. The radius R of the rounded connection sites is preferably about 0.5 to 3 mm.

When the radius R is less than about 0.5 mm, the connection parts may not be tolerated by the high frequency power supply and may be broken. When the radius R exceeds about 3 mm, the connecting portions are too thick to bend the bending part 136.

For example, the clamping part 132, the fixing part 134, and the bending part 136 may have irregularities on a surface thereof. Since the clamping part 132, the fixing part 134, and the bending part 136 have irregularities, the surface area of the connection member 130 is increased.

The high frequency power is transmitted through the surface of the connection member 130. As the surface area of the connection member 130 increases, a path through which the high frequency power is transmitted is widened. Therefore, since the high frequency power is distributed and transmitted, the breakage of the connection member 130 may be prevented to extend the life of the connection member 130. As a method for forming irregularities on the surface of the connection member 130, a bead blast, sand blast, chemical etching, and the like may be used.

As another example, only the surface of the bending part 136 may have irregularities. This is because the path through which the high frequency power is transmitted is the bending unit 136. Therefore, since the high frequency power is distributed and transmitted, the bending part 136 may be prevented from being damaged to extend the life of the connection member 130.

The clamping part 132, the fixing part 134, and the bending part 136 are integrally formed. Thus, arcing may be prevented due to poor contact between the clamping part 132 and the bending part 136 and between the fixing part 134 and the bending part 136.

In addition, the clamping part 132, the fixing part 134, and the bending part 136 include the same conductive material. Examples of the conductive material may include belium, copper, or an alloy thereof (Be-Cu).

5 to 7 are perspective views for explaining another example of the connecting member 130.

5 to 7, the description of the connection member 130 except for the connection position of the bending part 136 is substantially the same as the description of the connection member with reference to FIGS. 1 and 2. .

Referring to FIG. 5, the bending part 136 connects the lower end of one of the two plates 132a and 132b of the clamping part 132 with the lower end of the fixing part 134.

Referring to FIG. 6, the bending part 136 connects the front end of any one of the two plates 132a and 132b of the clamping part 132 with the front end of the fixing part 134.

Referring to FIG. 7, the bending part 136 connects the stop of any one of the two plates 132a and 132b of the clamping part 132 with the stop of the fixing part 134.

3 and 4, the insulating member 140 is interposed between the ground mount 110 and the clamping part 132 of the connection member 130, and the ground mount 110 and the clamping. Electrically insulate the portion 132. The insulating member 140 includes a first insulator 142 and a second insulator 144.

The first insulator 142 is disposed between the side surface of the ground mount 110 and the clamping portion 132, that is, the side surface of the receiving groove 112. The second insulator 144 is disposed between the bottom surface of the ground mount 110 and the clamping portion 132, that is, the bottom surface of the receiving groove 112.

The cover 150 covers the receiving groove 112. The cover 150 prevents the ground terminal 120 and the connection member 130 from being exposed to the outside. The material of the cover 150 includes an insulating material. Therefore, arcing between the ground terminal 120 and the connection member 130 and the cover 150 may be prevented.

In the ground structure 100, since the first fastening screw 138 fixes the clamping part 132, the clamping part 132 is in close contact with the ground terminal 120. Therefore, arc generation may be prevented between the ground terminal 120 and the connection member 130. In addition, since the clamping part 132, the fixing part 134, and the bending part 136 are integrally formed, the clamping part 132, the fixing part 134, and the bending part 136 may be disposed between the clamping part 132, the fixing part 134, and the bending part 136. Arcing caused by poor contact can be prevented.

In addition, since the clamping part 132 may be moved along the vertical direction by the bending part 136, thermal expansion of the ground terminal 120 may be freely performed. Therefore, disconnection of the ground terminal 120 can be prevented.

In addition, a high frequency power source for plasma formation is formed by rounding a connection part between the bending part 136 and the fixing part 134 and a connection part between the bending part 136 and the clamping part 132 in the connection member 130. Even if concentrated at the connection site, the bending of the bending part 136 may be prevented.

8 is a cross-sectional view showing a heater 200 according to an embodiment of the present invention.

Referring to FIG. 8, the heater 200 includes a heating block 210, a heating element 220, an electrode 230, and a ground structure 100.

The heating block 210 includes a disc on which the semiconductor substrate is placed and a vertical axis connected to the bottom center of the disc. The material of the heating block 210 may be a ceramic. Examples of ceramics include Al 2 O 3, Y 2 O 3, Al 2 O 3 / Y 2 O 3, ZrO 2, AlC, TiN, AlN, TiC, MgO, CaO, CeO 2, TiO 2, BxCy, BN, SiO 2, SiC, YAG, Mullite, AlF 3, and the like. These may be used alone or in combination.

The heating element 220 is embedded in the heating block 210. The heating element 220 may be arranged in a predetermined pattern in the disc of the heating block 210. The heating element 220 generates heat for heating the substrate. The heating element 220 includes a metal material. Examples of the metal include tungsten (W), molybdenum (Mo), tantalum (Ta), titanium (Ti) or alloys thereof, iron-chromium (Fe-Cr) alloys, nickel-chromium (Ni-Cr) alloys, and the like. Can be mentioned.

The electrode 230 is embedded in the heating block 210. For example, the electrode 230 may be connected to a high frequency power source. Therefore, the electrode 230 may induce a plasma for processing the substrate to the semiconductor substrate. As another example, the electrode 230 may be connected to a DC power source. Thus, the electrode 230 may generate an electrostatic force for adsorbing the semiconductor substrate.

The ground structure 100 includes a ground mount, a ground terminal, a connection member, an insulation member, and a cover.

A detailed description of the ground structure 100 is the same as the description of the ground structure 100 with reference to FIGS. 3 to 7.

The ground mount of the ground structure 100 is mounted at the lower end of the vertical axis of the heating block 210. The ground terminal of the ground structure 100 is electrically connected to the electrode 230.

9 is a cross-sectional view illustrating a substrate processing apparatus 300 according to an embodiment of the present invention.

Referring to FIG. 9, the substrate processing apparatus 300 according to the present exemplary embodiment may include a chamber 310, a gas supply part 320, a shower head 330, an upper electrode 340, and a heater 200.

The chamber 310 accommodates a substrate and provides a space for processing the substrate.

The gas supply part 320 is connected to the upper surface of the chamber 310, and supplies a process gas for processing the substrate into the chamber 310.

The shower head 330 is provided on an inner upper portion of the chamber 310 and uniformly provides the process gas to the substrate.

The upper electrode 340 is connected to the shower head 330 and converts the process gas into a plasma state by applying a high voltage to the process gas.

The heater 200 includes a heating block, a heating element, an electrode, and a ground structure.

A detailed description of the heater 200 is the same as that of the heater 200 with reference to FIG. 8.

The heater 200 is provided at an inner lower portion of the chamber 310. The substrate is placed on the heating block 210 of the heater 200.

Of connecting member Bending part  According to thickness Experimental Example

Table 1

While changing the thickness of the bending section to 0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm, 3.5mm, 4.0mm, the high-frequency power of 200W, 500W, 1000W, 1500W, 2000W, 2500W, 3000W is applied to the electrode, respectively. Authorized. When the bending part has a thickness of 0.5 mm and a high frequency power of 3000 W or more is applied to the electrode, the bending part breaks. When the bending part has a thickness of 3.5 mm and a high frequency power of 2500 W or more is applied to the electrode, the ground terminal is thermally expanded and the bending part is not bent, so the ground terminal is bent. When the bending part had a thickness of 4.0 mm and a high frequency power of 1500 W or more was applied to the electrode, the junction between the ground terminal and the electrode was damaged.

Therefore, the thickness of the bending part is preferably about 1 to 3mm. Therefore, it is possible to prevent breakage of the bending part by the high frequency power supply, and to prevent damage to the ground terminal caused by the bending of the bending part.

Depending on the radius of the rounded connection Experimental Example

TABLE 2

Change the radius of the rounded connection to 0mm, 0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm, 3.5mm, 4.0mm, and 200W, 500W, 1000W, 1500W, 2000W, 2500W, A high frequency power source of 3000 W was applied respectively. At this time, the bending part has a thickness of 2.0 to 2.5mm. When the radius of the rounded connection part is 0 mm, that is, when the rounding process is not performed on the connection part, high frequency power is concentrated on the connection part of the bending part and the fixing part and the connection part of the bending part and the clamping part. When the high frequency power of 1500W or more is applied, the bending part is broken. When the radius of the rounded connection part is 3.5 mm or 4.0 mm, when a high frequency power of 3000 W or more is applied to the electrode, the ground terminal is thermally expanded and the bending part is not bent, so the ground terminal is bent.

Therefore, the radius of the rounded connection part is preferably about 0.5 to 3mm. Therefore, it is possible to prevent breakage of the connection portions by the high frequency power supply, and to prevent damage to the ground terminal caused by bending of the bending portion due to the thickness of the connection portions.

According to embodiments of the present invention, it is possible to prevent the occurrence of arcing of the connecting member connecting the ground terminal and the ground mount, and to prevent damage to the connecting member. Therefore, damage to the ground structure, the heater, and the substrate processing apparatus including the connection member can be prevented to extend the life.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

1 is a perspective view for explaining a grounding structure according to the prior art.

FIG. 2 is a perspective view illustrating the clamp and the conductive sheet illustrated in FIG. 1.

3 is a perspective view showing a grounding structure according to an embodiment of the present invention.

4 is a perspective view illustrating the connection member illustrated in FIG. 3.

5 to 7 are perspective views for explaining another example of the connecting member.

8 is a cross-sectional view showing a heater according to an embodiment of the present invention.

9 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: ground structure 110: ground mount

120: ground terminal 130: connection member

132: clamping portion 134: fixed portion

136: bending portion 138: first fastening screw

139: second fastening screw 140: insulating member

150: cover

Claims (22)

A clamping part for holding a ground terminal; A fixing part fixed to the ground mount; And And a bending part connecting the clamping part and the fixing part to be bent such that the clamping part moves along the longitudinal direction of the ground terminal. The connecting member of claim 1, wherein the clamping part, the fixing part, and the bending part are integral. The connecting member of claim 1, wherein the clamping part, the fixing part, and the bending part comprise the same conductive material. The connection member of claim 1, wherein the clamping part, the fixing part, and the bending part have irregularities on a surface thereof. The connecting member of claim 1, wherein the bending part has a flat plate shape having a plurality of through holes. The connecting member of the grounding structure according to claim 1, wherein the bending part has a thickness of 1 to 3 mm. The connecting member of the grounding structure according to claim 1, wherein the bending part has irregularities on a surface thereof. The connecting member of claim 1, wherein the connection part of the bending part and the fixing part and the connection part of the bending part and the clamping part are rounded. The connecting member of the grounding structure according to claim 8, wherein the radius of the rounded connection parts is 0.5 to 3 mm. 2. The connecting member of claim 1, wherein the clamping portion has a flat plate that connects the two plates and the plates and forms a receiving groove for receiving the ground terminal. The connection member of claim 10, further comprising a fastening screw fastened through the plates to fix the ground terminal received in the receiving groove. Ground mount; A ground terminal movably inserted into the ground mount; And And a connection member that grips the ground terminal to electrically connect the ground mount and bends in a longitudinal direction of the ground terminal according to thermal expansion of the ground terminal. The method of claim 12, wherein the connecting member, A clamping part for holding the ground terminal; A fixing part fixed to the ground mount; And And a bending part connecting the clamping part and the fixing part to bend such that the clamping part moves along a length direction of the ground terminal. 14. The ground structure of claim 13, further comprising an insulating member interposed between the ground mount and the clamping portion. 13. The grounding structure of claim 12, wherein the ground mount has a receiving groove for receiving the connection member. 16. The ground structure of claim 15, further comprising an insulating cover covering the receiving groove. A ground mount having a receiving groove; A ground terminal movably inserted into the ground mount and exposed to the receiving groove; A clamping part for elastically holding the ground terminal, a flat part having a fixing part fixed to a side of the receiving groove and a plurality of through holes, connecting the clamping part and the fixing part, and the clamping part being connected to the ground A connection member including a bending portion bent in the longitudinal direction of the terminal and electrically connecting the ground terminal and the ground mount; And And an insulating member interposed between the ground mount and the clamping portion. 18. The ground structure of claim 17, further comprising an insulating cover covering the receiving groove. 18. The ground structure of claim 17, wherein the clamping portion, the fixing portion, and the bending portion are integral. 18. The ground structure of claim 17, wherein a connection portion of the bending portion and the fixing portion and a connection portion of the bending portion and the clamping portion are rounded. Heating block; A heating element embedded in the heating block; An electrode embedded in the heating block; A ground mount mounted at one side of the heating block; A ground terminal movably inserted into the ground mount and connected to the electrode; And And a connection member holding the ground terminal to electrically connect the ground mount and bent in the longitudinal direction of the ground terminal according to thermal expansion of the ground terminal. A chamber containing a substrate; A heater disposed below the chamber to heat the substrate; A gas supply unit disposed above the chamber to provide a process gas for processing the substrate onto the substrate; And An upper electrode disposed in the chamber and configured to convert the process gas into a plasma state, The heater, Heating block; A heating element embedded in the heating block; An electrode embedded in the heating block; A ground mount mounted at one side of the heating block; A ground terminal movably inserted into the ground mount and connected to the electrode; And And a connecting member which grips the ground terminal and electrically connects with the ground mount, and is bent in the longitudinal direction of the ground terminal according to thermal expansion of the ground terminal.

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