KR100963481B1 - Ground structure, and heater and chemical vapor deposition apparatus including the same - Google Patents

Abstract

The ground structure of the heater includes a ground mount, a ground terminal movably inserted into the ground mount, a conductive holder disposed in the ground mount to hold the ground terminal, and a connecting member electrically connecting the conductive holder and the ground mount. Include. Thus, the state in which the elastic holder is in close contact with the ground terminal can be maintained continuously, thereby preventing damage to the ground terminal.

Description

Ground structure, heater and chemical vapor deposition apparatus having the same {GROUND STRUCTURE, AND HEATER AND CHEMICAL VAPOR DEPOSITION APPARATUS INCLUDING THE SAME}

1 is a perspective view showing a grounding structure according to a first embodiment of the present invention.

2 is a front view of FIG. 1.

3 is a plan view of FIG. 1.

4 is a cross-sectional view showing a heater according to a second embodiment of the present invention.

5 is a cross-sectional view showing a chemical vapor deposition apparatus according to a third embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

110: ground mount 120: ground terminal

130: conductive holder 140: connecting member

The present invention relates to a grounding structure, and a heater and a chemical vapor deposition apparatus having the same. More particularly, it relates to a grounding structure of a heater used to heat a semiconductor substrate, a heater having such a grounding structure and a chemical vapor deposition apparatus.

In general, a semiconductor device includes a Fab process for forming an electrical circuit on a semiconductor substrate, an electrical die sorting (EDS) process for inspecting electrical characteristics of the semiconductor devices formed in the fab process, and epoxy devices each. It is manufactured through a packaging process for encapsulation and individualization with resins.

The fab process includes a deposition process for forming a film on a semiconductor substrate, a chemical mechanical polishing process for planarizing the film, a photolithography process for forming a photoresist pattern on the film, and an electrical characteristic of the film using the photoresist pattern. An etching process for forming into a pattern having a pattern, an ion implantation process for implanting specific ions into a predetermined region of the semiconductor substrate, a cleaning process for removing impurities on the semiconductor substrate, and a drying process for drying the cleaned semiconductor substrate And an inspection step for inspecting the defect of the film or pattern.

Recently, the use of a plasma processing apparatus for exciting a process gas into a plasma state in a fab process to form a film or a pattern on a substrate has increased rapidly. An example of the plasma processing apparatus is a plasma-enhanced chemical vapor deposition (PE-CVD) apparatus disclosed in Korean Patent Laid-Open Publication No. 2005-87405.

The conventional PE-CVD apparatus has a processing chamber having a space for processing a semiconductor substrate, a heater disposed inside the processing chamber and heating the semiconductor substrate, and an electrode for forming a reaction gas supplied to the processing chamber with plasma gas. It includes. The heater includes a heating block, a heating electrode embedded in the heating block, and a ground structure embedded in the heating block.

Conventional grounding structures include an electrode embedded in a heating block, a ground terminal connected to the electrode, a ground mount mounted on the heating block and a ground terminal inserted therein, and an elastic holder surrounding the outer circumference of the ground terminal to secure the ground terminal to the ground mount. do. On the other hand, the ground terminal is fixed to the heating block through a brazing process.

However, in the conventional grounding structure, the elastic force of the elastic holder is gradually lowered as the temperature of the heating block rises. For this reason, the elastic holder is not in close contact with the ground terminal, and an oxide film due to arcing is often generated on the outer circumferential surface of the ground terminal. The oxide film increases the contact resistance of the ground terminal, thereby damaging the ground terminal.

In addition, the conventional ground terminal is not movable along the longitudinal direction of the ground terminal. For this reason, when the ground terminal is thermally expanded due to the high temperature, the ground terminal is often disconnected.

The present invention provides a grounding structure of a heater that can suppress damage to the grounding terminal.

The present invention also provides a heater having the grounding structure described above.

In addition, the present invention provides a chemical vapor deposition apparatus having the heater described above.

The grounding structure of the heater according to one aspect of the present invention includes a grounding mount, a grounding terminal movably inserted into the grounding mount, a conductive holder disposed within the grounding mount and holding the grounding terminal, and the conductive holder and the grounding mount. It includes a connecting member for electrically connecting.

According to one embodiment of the invention, the ground mount may have a receiving groove for receiving the conductive holder. In addition, the receiving groove may cover the insulating cover.

According to another embodiment of the present invention, the conductive holder may include an elastic material. The conductive holder made of an elastic material may have a U-shape for accommodating the ground terminal, and both ends of the U-shaped conductive holder may be fixed by a fastening member. In addition, the conductive holder may have a gripping groove for holding the ground terminal by having the same diameter as that of the ground terminal.

According to another embodiment of the present invention, the connection member may include a flexible cable for supporting the conductive holder to be movable along the longitudinal direction of the ground terminal.

According to another embodiment of the present invention, an insulating member may be interposed between the ground mount and the conductive holder. The insulating member is interposed between the bottom surface of the ground mount and the conductive holder and has a hole in which the ground terminal is movably inserted, and a second insulator interposed between the side surface of the ground mount and the conductive holder. It may include.

According to another aspect of the present invention, a heater includes a heating block, a heating element embedded in the heating block, an electrode embedded in the heating block, a ground mount mounted on the heating block, and movably inserted into the ground mount and connected to the electrode. A ground terminal, a conductive holder disposed in the ground mount to hold the ground terminal, and a connection member electrically connecting the conductive holder and the ground mount.

According to another aspect of the present invention, a chemical vapor deposition apparatus includes a chamber into which a substrate is loaded, a heater disposed below the chamber to heat the substrate, and disposed above the chamber to provide a reaction gas onto the substrate. A reaction gas providing member, and an upper electrode disposed in the chamber, for forming a plasma from the reaction gas. The heater may include a heating block, a heating element embedded in the heating block, a lower electrode embedded in the heating block, a ground mount mounted on the heating block, a ground terminal movably inserted into the ground mount, and connected to the lower electrode. A conductive holder disposed in the ground mount to hold the ground terminal, and a connection member electrically connecting the conductive holder and the ground mount.

According to the present invention as described above, since both ends of the elastic holder surrounding the ground terminal is fixed, the state in which the elastic holder is in close contact with the ground terminal can be continuously maintained. Thus, the occurrence of an arc between the elastic holder and the ground terminal is prevented, thereby preventing damage to the ground terminal due to the arc. In addition, the elastic holder connected to the ground mount via the flexible cable can be moved along the length of the ground terminal. Therefore, disconnection of the ground terminal due to thermal expansion can be prevented.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

With respect to the embodiments of the present invention disclosed in the text, specific structural to functional descriptions are merely illustrated for the purpose of describing the embodiments of the present invention, embodiments of the present invention may be implemented in a variety of forms and It should not be construed as limited to the embodiments described in.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between. Other expressions describing the relationship between components, such as "between" and "immediately between," or "neighboring to," and "directly neighboring to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof that is described, and that one or more other features or numbers are present. It should be understood that it does not exclude in advance the possibility of the presence or addition of steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Example 1

1 is a perspective view illustrating a grounding structure of a heater according to a first embodiment of the present invention, FIG. 2 is a front view of FIG. 1, and FIG. 3 is a plan view of FIG. 1.

1 to 3, the grounding structure 100 according to the present embodiment includes a grounding mount 110, a grounding terminal 120, a conductive holder 130, and a connecting member 140.

Ground mount 110 has a substantially cylindrical shape. The hole 114 is formed through the ground mount 110 in the vertical direction. The heating element of the heater (not shown) is accommodated in the hole 114. In addition, the receiving groove 112 is formed on the side of the ground mount 110. In particular, the receiving groove 112 is exposed through the upper surface of the ground mount 110. In this embodiment, the receiving groove 112 has a cross section of approximately 1/4 arc shape. In addition, a hole (not shown) leading to the receiving groove 112 is formed along the direction perpendicular to the ground mount 110. In addition, in consideration of the safety of the operator, the insulating cover 160 may cover the receiving groove 112. Meanwhile, in the present embodiment, the ground mount 110 includes a conductive material such as aluminum.

The ground terminal 120 is inserted into the hole and protrudes into the receiving groove 112. In particular, since the diameter of the hole is longer than the diameter of the ground terminal 120, the ground terminal 120 is movable in the vertical direction through the hole. In this embodiment, the material of the ground terminal 120 may include nickel. Meanwhile, the ground terminal 120 is connected to the electrode of the heater through a brazing process.

The conductive holder 130 is disposed in the receiving groove 112. The conductive holder 130 is an elastic plate having a thin thickness. The conductive holder 130 has an approximately U-shaped shape in which an intermediate portion is bent. Both ends of the conductive holder 130 are fastened by a fastening member 150 such as a bolt. The ground terminal 120 is received in the bent conductive holder 130. In particular, a holding groove 132 having a diameter equal to the diameter of the ground terminal 120 is formed at a bent portion of the conductive holder 130, so that the ground terminal 120 is accommodated in the holding groove 132 so that the conductive holder ( It is in close contact with the inner circumferential surface of 130). That is, the conductive holder 130 is in close contact with the entire outer circumferential surface of the ground terminal 120 while elastically holding the ground terminal 120. In particular, the upper end of the ground terminal 120 has a diameter longer than the inner space width of the conductive holder 130, so that the ground terminal 120 faces downward from the conductive holder 130 unless the fastening member 150 is released. It does not go away. In the present embodiment, the material of the conductive holder 130 may be belium, copper or alloys thereof (Be-Cu).

The connection member 140 electrically connects the conductive holder 130 to the ground mount 110. That is, the connection member 140 has one end fixed to the conductive holder 130 and the other end fixed to the ground mount 110. In particular, in order to enable the conductive holder 130 to move in the vertical direction, a flexible cable may be used as the connecting member 140. Therefore, since the conductive holder 130 is movable in the vertical direction, thermal expansion of the ground terminal 120 due to the high temperature of the heater is not disturbed. As a result, an accident that the end of the ground terminal 120 brazed to the heater is disconnected is prevented.

In addition, an insulating member 170 is interposed between the ground mount 110 and the conductive holder 130 to electrically insulate the ground mount 110 and the conductive holder 130. The insulating member 170 may include a first insulator 171 disposed between the side of the ground mount 110 and the conductive holder 130, that is, the side of the receiving groove 112, and the bottom of the ground mount 110 and the conductive holder. A second insulator 172 is disposed between the 130, that is, the bottom surface of the receiving groove 112.

According to this embodiment, since both ends of the conductive holder are fastened by bolts, the conductive holder is kept in close contact with the ground terminal unless the bolt is loosened. Therefore, the phenomenon in which an arc generate | occur | produces in a ground terminal is prevented, and damage to a ground terminal can be suppressed. In addition, since the conductive cable can be moved along the vertical direction by the flexible cable, thermal expansion of the ground terminal is also free. As a result, the break of the brazed portion of the ground terminal is prevented.

Example 2

4 is a cross-sectional view showing a heater according to a second embodiment of the present invention.

Referring to FIG. 4, the heater 200 according to the present exemplary embodiment includes a heating block 210, a heating element 220, an electrode 230, and a ground structure 100. Here, since the grounding structure 100 has been described in detail in Embodiment 1, repeated description thereof will be omitted.

The heating block 210 includes a disc on which the semiconductor substrate is placed, and a vertical axis connected to the bottom center of the disc. The ground mount 110 of the ground structure 100 is mounted at the bottom of the vertical axis. In this embodiment, the material of the heating block 210 may be a ceramic.

The electrode 230 is embedded in the heating block 210. The heating element 220 is built in the vertical axis of the heating block 210. The heating element 220 may be arranged in a predetermined pattern in a disc of the heating block 210. The ground terminal 120 of the ground structure 100 is electrically connected to the electrode 230.

Example 3

5 is a cross-sectional view showing a chemical vapor deposition apparatus according to a third embodiment of the present invention.

Referring to FIG. 5, the chemical vapor deposition apparatus 300 according to the present embodiment includes a chamber 310 into which a semiconductor substrate is loaded, an upper electrode 320, a reaction gas providing member 330, a gas line 340, and a heater. 200. In this embodiment, the chemical vapor deposition apparatus 300 is a PE-CVD apparatus. Here, since the heater 200 has been described in detail in the second embodiment, repeated description thereof will be omitted.

A gas line 340 for providing a reactant gas into the chamber 310 is connected to the top of the chamber 310. The upper electrode 320 is disposed above the chamber 310 to generate a plasma by applying a high voltage to the reaction gas. The reaction gas providing member 330 is disposed under the electrode 320 to uniformly inject the plasma toward the semiconductor substrate. In this embodiment, an example of the reaction gas providing member 330 may be a shower head.

The heater 200 is disposed on the bottom of the chamber 310. The semiconductor substrate is placed on the heating block 210 of the heater 200.

According to the present invention as described above, since both ends of the elastic holder surrounding the ground terminal is fixed, the state in which the elastic holder is in close contact with the ground terminal can be continuously maintained. Thus, the occurrence of an arc between the elastic holder and the ground terminal is prevented, thereby preventing damage to the ground terminal due to the arc.

In addition, the elastic holder connected to the ground mount via the flexible cable can be moved along the length of the ground terminal. Therefore, disconnection of the ground terminal due to thermal expansion can be prevented.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (19)

In the grounding structure of the heater used in the chemical vapor deposition apparatus, A ground mount having a receiving groove; A ground terminal movably inserted into the ground mount and exposed to the receiving groove; A conductive holder disposed in the receiving groove and holding the ground terminal to be in close contact with the outer circumferential surface of the ground terminal; And And a cable electrically connecting the conductive holder and the ground mount such that the conductive holder is movable in the longitudinal direction of the ground terminal by thermal expansion of the ground terminal. delete The grounding structure of a heater according to claim 1, further comprising an insulating cover covering the receiving groove. 2. The grounding structure of a heater as recited in claim 1 wherein said ground mount comprises aluminum. The grounding structure of a heater according to claim 1, wherein said grounding terminal comprises nickel. The grounding structure of a heater according to claim 1, wherein the conductive holder comprises an elastic material. The grounding structure of a heater according to claim 6, wherein the conductive holder has a U-shape for accommodating the ground terminal, and both ends of the U-shaped conductive holder are fixed by a fastening member. 8. The grounding structure of a heater according to claim 7, wherein the conductive holder has a gripping groove having a diameter equal to that of the grounding terminal to hold the grounding terminal. The grounding structure of a heater according to claim 1, wherein the conductive holder comprises belium, copper or an alloy thereof. The grounding structure of a heater according to claim 1, wherein said cable has elasticity. The grounding structure of a heater according to claim 1, further comprising an insulation member interposed between the ground mount and the conductive holder. The method of claim 11, wherein the insulating member A first insulator interposed between a side of the ground mount and the conductive holder; And And a second insulator interposed between the bottom surface of the ground mount and the conductive holder and having a hole in which the ground terminal is movably inserted. delete delete delete delete In the heater used in the chemical vapor deposition apparatus, Heating block; A heating electrode embedded in the heating block; An electrode embedded in the heating block; A ground mount mounted to the heating block and having a receiving groove; A ground terminal movably inserted into the ground mount and exposed to the receiving groove; A conductive holder disposed in the receiving groove and holding the ground terminal to be in close contact with the outer circumferential surface of the ground terminal; And And a cable electrically connecting the conductive holder and the ground mount such that the conductive holder is movable in the longitudinal direction of the ground terminal by thermal expansion of the ground terminal. 18. The heater of claim 17, wherein the heating block comprises a ceramic. A chamber into which the substrate is loaded; A heater disposed below the chamber to heat the substrate; A reaction gas providing member disposed above the chamber to provide a reaction gas onto the substrate; And An upper electrode disposed in the chamber, for forming a plasma from the reaction gas, The heater Heating block; A heating electrode embedded in the heating block; A lower electrode embedded in the heating block; A ground mount mounted to the heating block and having a receiving groove; A ground terminal movably inserted into the ground mount and exposed to the receiving groove; A conductive holder disposed in the receiving groove and holding the ground terminal to be in close contact with the outer circumferential surface of the ground terminal; And And a cable electrically connecting the conductive holder and the ground mount to allow the conductive holder to move in the longitudinal direction of the ground terminal by thermal expansion of the ground terminal.

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