TWI360614B - Valve door with ball coupling - Google Patents

Valve door with ball coupling Download PDF

Info

Publication number
TWI360614B
TWI360614B TW096123367A TW96123367A TWI360614B TW I360614 B TWI360614 B TW I360614B TW 096123367 A TW096123367 A TW 096123367A TW 96123367 A TW96123367 A TW 96123367A TW I360614 B TWI360614 B TW I360614B
Authority
TW
Taiwan
Prior art keywords
ball
valve member
cavity
sealing surface
valve
Prior art date
Application number
TW096123367A
Other languages
English (en)
Chinese (zh)
Other versions
TW200809123A (en
Inventor
Hyungsam Sam Kim
Jae-Chull Lee
William N Sterling
Paul Brown
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200809123A publication Critical patent/TW200809123A/zh
Application granted granted Critical
Publication of TWI360614B publication Critical patent/TWI360614B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Details Of Valves (AREA)
TW096123367A 2006-06-28 2007-06-27 Valve door with ball coupling TWI360614B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80606606P 2006-06-28 2006-06-28

Publications (2)

Publication Number Publication Date
TW200809123A TW200809123A (en) 2008-02-16
TWI360614B true TWI360614B (en) 2012-03-21

Family

ID=39035470

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123367A TWI360614B (en) 2006-06-28 2007-06-27 Valve door with ball coupling

Country Status (4)

Country Link
JP (1) JP5519099B2 (cg-RX-API-DMAC10.html)
KR (2) KR100929718B1 (cg-RX-API-DMAC10.html)
CN (1) CN101101066B (cg-RX-API-DMAC10.html)
TW (1) TWI360614B (cg-RX-API-DMAC10.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007711B1 (ko) * 2008-05-19 2011-01-13 주식회사 에스에프에이 플라즈마 처리장치
JP5490435B2 (ja) * 2009-03-31 2014-05-14 東京エレクトロン株式会社 ゲートバルブ装置
KR101105671B1 (ko) 2010-03-12 2012-01-18 (주)동광 방폭 도어용 로커 핀의 가이드구조
TWM476362U (en) * 2012-09-07 2014-04-11 Applied Materials Inc Load lock chamber with slit valve doors
KR101327251B1 (ko) * 2012-11-15 2013-11-13 주식회사 선익시스템 회전형 챔버도어
USD755153S1 (en) * 2014-06-20 2016-05-03 Zuna Designz, Llc Cell phone case with resilient suspension hook
US11530751B2 (en) * 2017-09-29 2022-12-20 Applied Materials, Inc. Closure mechanism vacuum chamber isolation device and sub-system
CN108531871A (zh) * 2018-07-09 2018-09-14 山东三齐能源有限公司 一种连续镀膜溅镀系统
KR200498912Y1 (ko) * 2022-06-27 2025-03-12 김영수 믹서트럭 수거통의 개폐장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU74745A1 (cg-RX-API-DMAC10.html) * 1976-04-12 1976-11-11
DE3047295A1 (de) * 1980-12-16 1982-07-29 Basf Ag, 6700 Ludwigshafen Verfahren zur kontinuierlichen herstellung alterungsbestaendiger aes-polymerisate
US5259881A (en) * 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US4785962A (en) * 1987-04-20 1988-11-22 Applied Materials, Inc. Vacuum chamber slit valve
KR930009811A (ko) * 1991-11-08 1993-06-21 원본미기재 볼조인트(ball joint) 조립체와 만드는 방법
US7575220B2 (en) * 2004-06-14 2009-08-18 Applied Materials, Inc. Curved slit valve door
CN2709730Y (zh) * 2004-06-16 2005-07-13 锦州电炉有限责任公司 高真空转阀
US8061920B2 (en) 2006-11-29 2011-11-22 Wimberley, Inc. Pivoting ball mount having four equally spaced contact points

Also Published As

Publication number Publication date
CN101101066A (zh) 2008-01-09
KR100929718B1 (ko) 2009-12-03
KR101274963B1 (ko) 2013-06-13
CN101101066B (zh) 2010-06-02
KR20090077030A (ko) 2009-07-14
JP2008006437A (ja) 2008-01-17
TW200809123A (en) 2008-02-16
KR20080001649A (ko) 2008-01-03
JP5519099B2 (ja) 2014-06-11

Similar Documents

Publication Publication Date Title
JP4298680B2 (ja) 湾曲したスリットバルブドア
TW200809123A (en) Valve door with ball coupling
TWI286362B (en) Substrate support lift mechanism
JP5221879B2 (ja) 柔軟性のある結合要素を備えた湾曲したスリットバルブドア
KR100636491B1 (ko) 기판 지지체
US7651315B2 (en) Large area substrate transferring method for aligning with horizontal actuation of lever arm
CN100446211C (zh) 用来支撑基材的末端受动器组件
TWI258516B (en) Thin-film deposition system
US7282097B2 (en) Slit valve door seal
US8631759B2 (en) System and method for depositing thin layers on non-planar substrates by stamping
US8505991B2 (en) Conveying device and vacuum apparatus
CN1241051C (zh) 制造液晶显示器的设备和方法,使用该设备的方法,用该方法生产的器件
US20080001113A1 (en) Valve door with ball coupling
US9732881B2 (en) Gate valve and substrate processing system
CN1574206A (zh) 一种用于半导体装置的设备
TW202031914A (zh) 沈積設備、用以遮蔽一基板之遮罩配置及其使用、及用以遮蔽一基板的方法
CN110767806A (zh) 一种有机薄膜晶体管及其制备方法和显示器件
JP3162223B2 (ja) 薄膜形成装置
TWM662873U (zh) 晶圓傳遞裝置
KR102682462B1 (ko) 스로틀밸브 및 그를 가지는 기판처리장치
CN102101373A (zh) 制造平板显示器的装置和方法
WO2024010591A1 (en) Alignment mechanism, vacuum chamber with an alignment mechanism and method of aligning a substrate in a vacuum chamber
KR20060000637A (ko) 스퍼터의 로드부
WO2019101318A1 (en) Lock valve for vacuum sealing, vacuum chamber and vacuum processing system

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees