1355194 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電子元器件之製程’尤其係關於一種數位相機模組 之製程。 【先前技術】1355194 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a process for manufacturing electronic components, particularly regarding a process of a digital camera module. [Prior Art]
目前，數位相機及整合數位相機模組之行動電話越來越普及，數位相 機模組不可缺少之核心元件影像感測晶片封裝之需求亦隨之與日俱增。同 時’消費者亦希望數位相機模組更加朝小型化、高品質、低價格方向發展。 然’除數位相機模組本身設計對其性能之影響外'數位相機模組之製造亦 對數位相機模組之品質起到至關重要之作用。 請參閲第一圖，一種習知數位相機模組之影像感測晶片封裝方法，如 中國大陸專利申請第03100661.2號所揭示，其包括以下步驟：首先提供複 數個C狀截面之導電片1〇;射出成型部份包覆於各導電片1〇之第一成型體 11，該第一成型體11使導電片10之部份露出；射出成型於第一成型體u 上形成第二成型體12,該第二成型體12與第一成型體1：1共同形成凹槽13; 將5又有複數焊墊14之f彡像感測晶>| μ設置於凹槽13内；藉由複數條引線 16使影像15之料14料1Q電連將透光板17設置於 第二成型體12上，以包覆住影像感測晶片15。 亡述數位相機模組之影像感測晶片封裝方法缺點在於：雖該封裝方法 可大里生産’然僅可單顆製造’導致生纽率降低；另，由於上述影像感 複數引線16皆容置於凹槽13内，且為方便打線器操作，故使 丨Λ 此，封裝後之凹槽13存在鮮粉塵，且於封裝過程及 〜域安裝於鏡軌鏡卿域程巾不可避免之震動均會使凹 彡輸㈣15 i，獅像感測晶片 【發明内容】 之製供—種生産效輪高、影像感測品質好之數位相麵組 一種數位相機模組之製程包括以下步驟： 6 13^5194At present, mobile phones for digital cameras and integrated digital camera modules are becoming more and more popular, and the demand for core component image sensing chip packages, which are indispensable for digital camera modules, is increasing. At the same time, consumers also hope that digital camera modules will be more miniaturized, high quality and low price. However, in addition to the design of the digital camera module itself, the manufacture of the digital camera module plays a vital role in the quality of the digital camera module. Referring to the first figure, an image sensing chip packaging method of a conventional digital camera module, as disclosed in Chinese Patent Application No. 03100661.2, includes the following steps: firstly, a plurality of conductive sheets of C-shaped cross section are provided. The injection molding portion is coated on the first molding body 11 of each of the conductive sheets 1 , the first molding body 11 exposes a portion of the conductive sheet 10 , and is injection molded on the first molding body u to form the second molding body 12 . The second molded body 12 and the first molded body 1:1 form a groove 13; the 5 感 image sensing crystals of the plurality of pads 14 are disposed in the groove 13; The strip lead 16 electrically connects the material 14 of the image 15 to the 1Q electrical connection, and the light transmissive plate 17 is disposed on the second molded body 12 to cover the image sensing wafer 15. The disadvantage of the image sensing chip packaging method of the digital camera module is that although the packaging method can be produced in a large amount, the production rate can be reduced by a single manufacturing process. In the groove 13, and in order to facilitate the operation of the wire cutter, the groove 13 after the package has fresh dust, and the inevitable vibration of the package process and the domain mounted on the mirror rail mirror will be inevitable.彡 彡 ( 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四5194
提供厂影像感測晶片封裝’該影像感測晶片封褒製程包括如下步驟. 提供一支架，該支架包括二間隔料帶、複數連接二料帶之橫 數形成於橫樑上之導電片； ”” 將支架之一部份放入一模具之型腔内，並於型腔内注入塑膠材料， 冷卻後成型出複數包覆該支架之導電片之基體，導電片二端暴露 於基體一表面，導電片另一端暴露於基體另一表面，每一基體包 括一容室； 土 提供複數影像感測晶片，每一影像感測晶片包括一感測區及複數晶 片焊墊，將一影像感測晶片固定於一基體之容室内；Providing a factory image sensing chip package 'The image sensing chip sealing process comprises the following steps. Providing a bracket comprising two spacer strips, a plurality of conductive strips of a plurality of strips formed on the beam; ” One part of the bracket is placed in a cavity of a mold, and a plastic material is injected into the cavity, and after cooling, a base body of a plurality of conductive sheets covering the bracket is formed, and the two ends of the conductive sheet are exposed to a surface of the substrate to conduct electricity. The other end of the sheet is exposed to the other surface of the substrate, each substrate includes a chamber; the soil provides a plurality of image sensing wafers, each image sensing wafer includes a sensing region and a plurality of wafer pads to fix an image sensing wafer In a room of a matrix;
設，複數弓丨線，使每一引線電連接影像感娜晶片之晶片焊墊與導電 將複數基體分割，形成單個裝載有影像感測晶片之基體； 將導電片包覆； 提供一蓋體，該蓋體具有一凸緣，該凸緣與該蓋體内壁形成一台階； 將蓋體套設於裝載有影像感測晶片之基體外，蓋體凸緣與基體側面 相對固連，蓋體台階與基體頂面相對固連；及 提供一鏡頭模塊，將該鏡頭模塊裝於影像感測晶片之上。 相較習知技術，所述數位相機模組製程之影像感測晶片之導電片被基 體包覆其中，可降低濕氣等之影響進而提高產品可靠度；該製程可同時生 産夕個影像感測晶片之封裝，極大地提高了數位相機模組生產效率。該數 位相機模組因影像感測區被包覆，可避免鏡頭模塊調焦時，所產生之粉塵 對影像感測晶片之影響，提高了數位相機模組之成像質量。 【實施方式】 請一併參閱第二圖、第三圖和第八圖，本發明數位相機模組之一較佳 實施方式包括一鏡頭模塊及一影像感測晶片封裝，鏡頭模塊組裝於影像感 測晶片封裝上方。 影像感測晶片封裝包括一承載體(圖未標）、—影像感測晶片3〇、複數 引線40及一蓋體50。該承載體包括一基體21及一嵌設於基體21内之導體 架23。 該基體21大致呈矩形框體，其包括一底部21〇及一由底部21〇 一頂面 外圍向上凸起之側壁212’該底部210之頂面與側壁212之内壁共同圍成一 1355194 谷室214。兩相對之側壁212之頂面設置有一長條形卡槽2i7。 於體^ 23包括一散熱片231及複數導電片233。該散熱片231設置 二土體底部2:0之中部，且其下表面露出於底部21〇之底面。該散熱片 你ϋ以增強該影像感測晶片封裝之散熱性能。該複數導電片233間隔嵌設 ;土體21之未設置卡槽217之相對兩侧壁212及底部21〇中。每一導 括第一板部235、一第二板部236及一連接第一板部235與第二板 部f7 ’其中’第—板部235與第二板部236相互平行且間隔 9開疋距雜，連接部237相對第—板部235及第二被部236傾斜一定角 又。第-板部235之上表面露出於側壁212之頂面，第二板部说之下表 面露出於底部210之底面。 該影像感測晶片30之頂面具有一感測區3〇1，該感測區3〇1與嵌設有 Ϊ 233之側，212對應側之外周緣佈設有複數晶片焊墊3〇2。該影像感 U 30位於容置部214之内，其藉由娜固定於基體21之底部21〇上。 每-引線40 -端岐電連接至影像感測晶片％之晶片焊塾3〇2上， 其另一，固定電連接至承載體之一導電片233之第一板部235。 該，體5〇套設於承載體上，用於與承載體配合將影像感測晶片3〇封 j。該盍體50呈半賴筒狀，其包括—半封_與-開口端，該半封閉端 由-透明板50!封閉。該蓋體5〇係罩設於設有影像感測晶片％之承載體 該透明板501對應影像感測晶片3〇之感測區3〇1，影像感測晶片兕之 感測區301透過該透明板501接收光訊號β該蓋體5〇開口端設有一凸緣5工 台階52，該凸緣51由該台階52之外側延伸而出。該凸緣51之内壁輪 廓略大於承載體之輪廓，其套設於基體21之側壁212之外。該台階兄之 内壁輪廓小於承載體之輪麼，其具有—台階面521，該台_ 521固設於承 載體側壁212之頂面。該台階η與側壁加之具導電片说之頂面相對應 ，兩台階面521之靠近蓋體50内壁處向蓋體5〇之具透明板5〇1端凹陷形 成一凹部523,該凹部523用於容置焊線4〇。該台階力之另兩台階面521 均凸設有一卡條524，該卡條524與側壁212頂面之卡槽217卡合。 鏡頭模塊包括一鏡座74，一鏡筒70、複數鏡片71及一蓋板0^。鏡座 74為中空圓筒狀，其内圓週設置有一内螺紋741。賴兀為中空圓筒狀， 其内容置有複數划，其外®顺置-外觀π，斜敎π斑鏡座 ^之内螺紋741她合，使鏡筒7〇容置於鏡座74内並可相對鏡座％旋轉。 盍板73為-平板㈣’其設於韻％頂端，細可使祕親，亦可阻 8 1355194 擋灰塵等雜質進入鏡筒70而污染鏡片71 β 本發明數位相機模組製程之較佳實施方式包括以下步驟： 請參閲第四圖及第五圖，提供-支架6〇。支架6〇包括二相 〜 設置之料帶62、連接二料帶62之複數橫樑& '複數形成於橫樑6 = 電片233及複數形成於橫樑64間之散熱片231。複數橫樑私均 料帶62之間並垂直於料帶62，每一導電片233均平行於料帶62刀且 橫標64上設有均句分佈之複數導電片233，除兩端之二_ &僅―= 導電片233外，其餘橫樑64兩側均設有導電片233。導電片233勹二 橫樑64相連之第一板部235、一位於導電片233端部之第二板部二 連接第一板部235與第二板部236之連接部237”第一板部235與第二 236相互平行且間隔錯開一定距離，連接部237相對第—板部及二 部236傾斜-定角度。每-散熱片23Η立於相鄰兩橫襟μ之間且: 料帶62。該散熱片231與導電片233之第二板部23Μ立於同一平^，里通 過設於其四個端角處之連接臂66與二料帶62相連。製造支架6〇時，^ -由銅或_合金料電性能佳之材料製成之導電板，藉由衝壓成型法或 者姓刻法將導電板形成所述之支架6〇結構。 一 請參閲m⑽人成魏（1•細·mGk丨ing)—體成财式射出成型 複數所述基體21於支架60上，即將支架60放入一模具之型腔内，向型腔 内注入熔融狀態之塑膠材料，如PPO㈣yphenylene 〇xide，聚苯喊)或 PPS(P〇lyPhenylene sulfide ’聚苯硫醚)等工程塑膠材料 體，其結構請一併參閲第七圖。基體21形成於支架60之周緣载 其為矩形框體。導電>；233之第-板部235部份針於基體21之側壁212 内’且其上表面暴露於側壁212之頂面；冑電片233之第二板部挪完全 嵌卡於基體21之底部21〇内，且其下表面暴露於底部2κ)之底面·導電片 233之連接部237完全喪卡於基體21之側壁212内。未包覆導電片说之 側壁212之頂面各形成一長條形卡槽217。散熱片231嵌卡於基體21之底 部210内其下表面暴露於底部21〇底面。支架6〇之料帶及橫標均 位於基體21外。 、 明參閲第七圖，提供複數影像感測晶片30。於每一基體21之底部2ΐ〇 之散熱片231上方塗布黏膠’將影像感測晶片％放置於黏膠上並固化黏 膠，從而使影像感測晶片30固定於基體21之容室214内。 9 1355194 30之曰·*!· 母弓I線 之一端電連接於影像感測晶片 史德焊塾302 ’另一端電連接於導電# 233之第-板部235上，以使 30之訊號得以傳遞至承載體之導電片233。弓丨線4Q之材料為 育金#導電性較好之金屬。 所ιϊϊ她基體21沿其邊肋割’使支架6G之料帶62被_，同時使 電片233之第一板部235及散熱片231之連接臂66被割斷，同一橫 '、 側之導電片233分別位於兩個影像感測晶片封裝内，此時，導電片 第^板部235之一端部露出於基體21而暴露於空氣中。通常情況下， 與基體21收縮率不同，複數基體21被切開後，該導電片233 會缩進基體21内。 閱帛八@，提供—雜赫(如超聲雜接' _雜、熱熔 接寺)爆接該基體21之側壁212外邊緣，將導電片233 端部^於基體21内，㈣將其與空魏絕。 " :復參閱第二圖、第三圖及第人圖，提供複數蓋體5()，於每—蓋體如 ίί於521及卡條524上均塗佈歸，然後將一蓋體50 Λ )丨3G之承載體上，其中，透明板5gi對應影像 感測：：片30之感測區301，蓋體50之卡條524與基體21之卡槽217相卡 分容置於蓋體％之凹部523巾，且該蓋體5G之凸緣51 3間ίίίΞΓ2之外表面、該蓋體50之台階面521與承載體侧壁212 ，復參閱5八圖，提供一鏡頭模塊，將該鏡頭觀之鏡座74與影像感 丫阳封裝之蓋體50焊接在一起。至此，該數位相機模組之製程&成。^ =理解’該影像_晶>{封裝之蓋體5G可以與鏡職塊之鏡座％ 一體成 該，體50之卡條汹與該承載體側壁212頂面之卡槽217 體體^之結合’減小蓋體5G從承載體上脫^之可能性。 了以理解’該盍體5〇之卡條524與該承載體側壁加頂面之卡槽加可省 略，此時，該蓋體50_承藉由黏軸結固定。 = 目機;；之製程可同時生産多個影像感測晶片封裝，極大地提 旦Ί ί曰Η二系處於一開放之空間，可供打線器自由活動，因此該 衫像感測4域之承載體之面積可儘量縮小至與鄉像制⑼％面積 1355194 幾近相同’因而’其可減少容置部214内之粉塵以提高品質，且可大幅減 小該影像感測晶片封裝之體積，進而減小數位相機模組之體積。 綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以 上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在、援依 本案創作精神所作之等效修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 第一圖係一習知影像感測晶片封裝示意圖； 第二圖係本發明數位相機模組之製程之較佳實施方式之影像感測晶片 封裝之剖視圖； 第三圖係本發明數位相機模組之製程之較佳、實施方式之影像感測晶片 封裝另一角度之剖視圖； 第四圖係本發明數位相機模組之製程之較佳實施方式之支架之示意 Γ5Π · 園， 第五圖係第四圖沿V-V向之剖視圖； 第六圖係本發明數位相機模組之製程之較佳實施方式之支架與基體成 型示意圖； 第七圖係本發明數位相機模組之製程之較佳實施方式之影像感測晶片 裝載於承載體之示意圖； 第八圖係本發明數位相機模組之製程之較佳實施方式之蓋體及鏡頭模 塊未組裝於裝載有影像感測晶片之承載體上之示意圖。 【主要元件符號說明】 基體 21 底部 210 側壁 212 容室 214 卡槽 217 導體架 23 散熱片 231 導電片 233 第一板部 235 第二板部 236 連接部 237 影像感測晶片 30 感測區 301 晶片焊塾 302 引線 40 蓋體 50 透明板 501 凸緣 51 1355194 台階 52 台階面 521 凹部 523 卡條 524 支架 60 料帶 62 橫樑 64 連接臂 66 鏡筒 70 鏡片 71 外螺紋 72 蓋板 73 鏡座 74 内螺紋 741 « 12a plurality of bowing wires, wherein each of the leads is electrically connected to the wafer pad of the image sensor and the conductive substrate divides the plurality of substrates to form a single substrate loaded with the image sensing chip; the conductive sheet is coated; and a cover is provided. The cover has a flange, and the flange forms a step with the inner wall of the cover; the cover is sleeved on the outer surface of the base on which the image sensing chip is mounted, and the cover flange is fixedly connected to the side of the base body, and the cover step is Attached to the top surface of the substrate; and a lens module mounted on the image sensing wafer. Compared with the prior art, the conductive sheet of the image sensing chip of the digital camera module process is covered by the substrate, which can reduce the influence of moisture and the like, thereby improving the reliability of the product; the process can simultaneously produce the image sensing at the same time. The package of the chip greatly improves the production efficiency of the digital camera module. The digital camera module is covered by the image sensing area, which can avoid the influence of the generated dust on the image sensing chip when the lens module is adjusted, and improve the imaging quality of the digital camera module. [Embodiment] Referring to FIG. 2, FIG. 3 and FIG. 8 together, a preferred embodiment of the digital camera module of the present invention comprises a lens module and an image sensing chip package, and the lens module is assembled in the image sense. Test the top of the chip package. The image sensing chip package includes a carrier (not shown), an image sensing wafer 3, a plurality of leads 40, and a cover 50. The carrier includes a base 21 and a conductor frame 23 embedded in the base 21. The base body 21 is substantially a rectangular frame body, and includes a bottom portion 21 〇 and a side wall 212 ′ which is protruded upward from the bottom surface of the bottom portion 21 该 a top surface. The top surface of the bottom portion 210 and the inner wall of the side wall 212 together define a 1355194 valley chamber. 214. An elongated strip slot 2i7 is disposed on the top surface of the opposite side walls 212. The body 23 includes a heat sink 231 and a plurality of conductive sheets 233. The heat sink 231 is provided with an intermediate portion of the bottom portion 2:0 of the two soil bodies, and the lower surface thereof is exposed on the bottom surface of the bottom portion 21〇. The heat sink is designed to enhance the thermal performance of the image sensing chip package. The plurality of conductive sheets 233 are spaced apart from each other; the opposite side walls 212 and the bottom portion 21 of the soil body 21 are not provided with the card slots 217. Each of the first plate portion 235, the second plate portion 236, and a connecting first plate portion 235 and the second plate portion f7 'where the first plate portion 235 and the second plate portion 236 are parallel to each other and spaced apart by 9 The connecting portion 237 is inclined at a certain angle with respect to the first plate portion 235 and the second portion 236. The upper surface of the first plate portion 235 is exposed on the top surface of the side wall 212, and the surface of the second plate portion is exposed to the bottom surface of the bottom portion 210. The top surface of the image sensing wafer 30 has a sensing area 3〇1, and the sensing area 3〇1 and the side on which the Ϊ 233 is embedded, and the outer periphery of the corresponding side of the 212 are provided with a plurality of wafer pads 3〇2. The image sensing U 30 is located inside the accommodating portion 214, and is fixed to the bottom portion 21 of the base body 21 by Na. Each of the leads 40 - is electrically connected to the wafer pad 3 〇 2 of the image sensing wafer, and the other is fixedly electrically connected to the first plate portion 235 of one of the conductive sheets 233 of the carrier. The body 5 is sleeved on the carrier for cooperating with the carrier to seal the image sensing chip 3. The body 50 is in the form of a semi-tubular tube comprising a semi-closed-and-open end closed by a transparent plate 50!. The cover 5 is disposed on the carrier having the image sensing chip %, and the transparent plate 501 corresponds to the sensing area 3〇 of the image sensing chip 3〇, and the sensing area 301 of the image sensing chip passes through the sensing area 301 The transparent plate 501 receives the optical signal β. The open end of the cover 5 is provided with a flange 5 step 52 which extends from the outer side of the step 52. The inner wall profile of the flange 51 is slightly larger than the contour of the carrier body and is sleeved outside the side wall 212 of the base body 21. The inner wall of the step brother is smaller than the wheel of the carrier body, and has a step surface 521 which is fixed on the top surface of the side wall 212 of the carrier. The step η corresponds to the top surface of the side wall and the conductive sheet. The two step surfaces 521 are recessed toward the inner wall of the cover 50 toward the transparent plate 5〇1 end of the cover body 5 to form a recess 523 for the recess 523. The welding wire is placed 4〇. The other two step surfaces 521 of the step force are respectively convexly provided with a strip 524, and the strip 524 is engaged with the card slot 217 of the top surface of the side wall 212. The lens module includes a lens holder 74, a lens barrel 70, a plurality of lenses 71 and a cover plate. The lens holder 74 has a hollow cylindrical shape, and an inner thread 741 is provided on the inner circumference thereof. Lai is a hollow cylinder, the content of which is placed with a plurality of strokes, and the outer ® is placed - the appearance is π, and the internal thread 741 of the oblique 敎 plaque holder ^ is closed, so that the lens barrel 7 is placed in the mirror holder 74 It can rotate relative to the mirror base. The seesaw 73 is a flat plate (four)' which is disposed at the top of the rhyme, which can make the secret close, and can also block 8 1355194. The dust and the like enter the lens barrel 70 and contaminate the lens 71. The preferred embodiment of the digital camera module process of the present invention The method includes the following steps: Please refer to the fourth and fifth figures, providing a bracket 6〇. The bracket 6A includes two phases - a set of strips 62, a plurality of beams connected to the two strips 62 & 'plurally formed on the beam 6 = a sheet 233 and a plurality of fins 231 formed between the beams 64. The plurality of beams are disposed between the strips 62 and perpendicular to the strip 62. Each of the conductive sheets 233 is parallel to the strip 62 and the cross-label 64 is provided with a plurality of conductive strips 233 distributed in a uniform sentence, except for the two ends _ & Only the "=" conductive sheet 233, the remaining beams 64 are provided with conductive sheets 233 on both sides. The first plate portion 235 to which the conductive sheet 233 and the two beams 64 are connected, the second plate portion at the end of the conductive sheet 233, and the connecting portion 237 of the first plate portion 235 and the second plate portion 236 are connected to the first plate portion 235. The second portion 236 is parallel to and spaced apart from each other by a certain distance, and the connecting portion 237 is inclined at an angle with respect to the first plate portion and the second portion 236. Each of the heat sinks 23 stands between the adjacent two horizontal 襟μ and: the strip 62. The heat sink 231 and the second plate portion 23 of the conductive sheet 233 stand in the same plane, and are connected to the two strips 62 through the connecting arms 66 provided at the four end corners thereof. When the bracket 6 is manufactured, A conductive plate made of a material with good electrical properties of copper or _ alloy material, the conductive plate is formed into a structure of the bracket by a stamping method or a surname method. Please refer to m(10)人成魏(1•细·mGk丨 ing ) - 体 财 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Shout) or PPS (P〇lyPhenylene sulfide 'polyphenylene sulfide) and other engineering plastic materials, the structure please Referring to the seventh figure, the base body 21 is formed on the periphery of the bracket 60 as a rectangular frame. The first portion of the plate portion 235 of the conductive member 233 is inserted into the side wall 212 of the base body 21 and the upper surface thereof is exposed to the side wall. The top surface of the 212; the second plate portion of the electric piece 233 is completely embedded in the bottom 21〇 of the base 21, and the lower surface thereof is exposed to the bottom surface of the bottom portion 2κ). The connecting portion 237 of the conductive piece 233 is completely lost. The sidewalls 212 of the base 21 are uncovered. The top surfaces of the sidewalls 212 are formed with a long strip-shaped card slot 217. The heat sink 231 is embedded in the bottom portion 210 of the base 21 and the lower surface thereof is exposed to the bottom surface of the bottom portion 21 The carrier tape and the horizontal mark of the bracket 6 are all located outside the base 21. Referring to the seventh figure, a plurality of image sensing wafers 30 are provided. The adhesive is applied over the heat sink 231 of the bottom 2 of each substrate 21 The image sensing wafer is placed on the adhesive and the adhesive is cured, so that the image sensing wafer 30 is fixed in the chamber 214 of the substrate 21. 9 1355194 30 曰·*!· One end of the mother bow I line is electrically connected The image sensing wafer has been soldered to the first plate portion 235 of the conductive #233. So that the signal of 30 can be transmitted to the conductive sheet 233 of the carrier. The material of the bow line 4Q is the metal with better conductivity. The substrate 21 is cut along its side to make the strip of the bracket 6G 62. At the same time, the first plate portion 235 of the electric piece 233 and the connecting arm 66 of the heat sink 231 are cut, and the conductive plates 233 of the same horizontal and side are respectively located in the two image sensing chip packages. One end of the first plate portion 235 is exposed to the base 21 and exposed to the air. Usually, unlike the shrinkage ratio of the base 21, the conductive sheet 233 is retracted into the base 21 after the plural base 21 is cut. Reading @@@, providing—he-he (such as ultrasonic miscellaneous ' _ miscellaneous, heat-fusion splicing temple) blasts the outer edge of the side wall 212 of the base 21, and the end of the conductive piece 233 is in the base 21, and (4) is emptied Wei Wei. " : Referring to the second figure, the third figure and the figure of the person, a plurality of cover bodies 5 () are provided, and each cover body is coated on the 521 and the card bar 524, and then a cover body 50 is applied. Λ ) 丨 3G carrier, wherein the transparent plate 5gi corresponds to the image sensing: the sensing area 301 of the film 30, the card strip 524 of the cover 50 and the card slot 217 of the base 21 are separated into a cover a concave portion 523 towel, and the outer surface of the cover 51 of the cover 5G, the step surface 521 of the cover 50 and the side wall 212 of the carrier 50, refer to FIG. The lens mount 74 is welded to the cover 50 of the image-sensing sun-filled package. So far, the process of the digital camera module & ^=Understand 'the image_crystal>{The cover of the package 5G can be integrated with the mirror base of the mirror block, the card strip of the body 50 and the card slot 217 of the top surface of the side wall 212 of the carrier ^ The combination 'reduces the possibility that the cover 5G is detached from the carrier. It is omitted to understand that the card strip 524 of the body 5 与 and the side wall of the carrier body can be omitted. At this time, the cover body 50_ is fixed by the adhesive shaft. = The camera; the process can simultaneously produce multiple image sensing chip packages, greatly enabling the second line to be in an open space, allowing the wire machine to move freely, so the shirt is like the sensing 4 domain The area of the carrier can be reduced as much as possible to the same size as the home image (9)% area 1355194. Thus, the dust in the receiving portion 214 can be reduced to improve the quality, and the volume of the image sensing chip package can be greatly reduced. In turn, the volume of the digital camera module is reduced. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic view of a conventional image sensing chip package; the second figure is a cross-sectional view of a preferred embodiment of the image sensing chip package of the process of the digital camera module of the present invention; A cross-sectional view of another preferred embodiment of the image sensor chip package of the digital camera module of the present invention; the fourth figure is a schematic diagram of a preferred embodiment of the process of the digital camera module of the present invention. The fifth drawing is a cross-sectional view along the VV of the fourth drawing; the sixth drawing is a schematic view of the bracket and the base forming of the preferred embodiment of the digital camera module of the present invention; and the seventh drawing is the process of the digital camera module of the present invention. The image sensing chip of the preferred embodiment is mounted on the carrier; and the eighth embodiment is a preferred embodiment of the digital camera module of the present invention. The cover and the lens module are not assembled on the image sensing chip. Schematic diagram on the carrier. [Main component symbol description] Base 21 Bottom 210 Side wall 212 Room 214 Card slot 217 Conductor frame 23 Heat sink 231 Conductive sheet 233 First plate portion 235 Second plate portion 236 Connection portion 237 Image sensing wafer 30 Sensing region 301 Wafer Soldering 塾 302 Lead 40 Cover 50 Transparent 501 Flange 51 1355194 Step 52 Step 521 Recess 523 Strip 524 Bracket 60 Tape 62 Beam 64 Connecting Arm 66 Lens 70 Lens 71 External Thread 72 Cover 73 Inside the Mirror 74 Thread 741 « 12