TWI351067B - Method for making qfn package with power and ground rings - Google Patents

Method for making qfn package with power and ground rings

Info

Publication number
TWI351067B
TWI351067B TW096108811A TW96108811A TWI351067B TW I351067 B TWI351067 B TW I351067B TW 096108811 A TW096108811 A TW 096108811A TW 96108811 A TW96108811 A TW 96108811A TW I351067 B TWI351067 B TW I351067B
Authority
TW
Taiwan
Prior art keywords
power
qfn package
ground rings
making
making qfn
Prior art date
Application number
TW096108811A
Other languages
English (en)
Other versions
TW200741924A (en
Inventor
Antonio Romarico S San
Anang Subagio
Original Assignee
Advanced Interconnect Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Interconnect Tech Ltd filed Critical Advanced Interconnect Tech Ltd
Publication of TW200741924A publication Critical patent/TW200741924A/zh
Application granted granted Critical
Publication of TWI351067B publication Critical patent/TWI351067B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4828—Etching
    • H01L21/4832—Etching a temporary substrate after encapsulation process to form leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48253—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a potential ring of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW096108811A 2006-03-14 2007-03-14 Method for making qfn package with power and ground rings TWI351067B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78225506P 2006-03-14 2006-03-14
US11/714,390 US7816186B2 (en) 2006-03-14 2007-03-06 Method for making QFN package with power and ground rings

Publications (2)

Publication Number Publication Date
TW200741924A TW200741924A (en) 2007-11-01
TWI351067B true TWI351067B (en) 2011-10-21

Family

ID=38510054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108811A TWI351067B (en) 2006-03-14 2007-03-14 Method for making qfn package with power and ground rings

Country Status (5)

Country Link
US (1) US7816186B2 (zh)
EP (1) EP1994551A4 (zh)
JP (1) JP2009534812A (zh)
TW (1) TWI351067B (zh)
WO (1) WO2007106487A2 (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7554179B2 (en) * 2005-02-08 2009-06-30 Stats Chippac Ltd. Multi-leadframe semiconductor package and method of manufacture
US7977774B2 (en) * 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US7838974B2 (en) * 2007-09-13 2010-11-23 National Semiconductor Corporation Intergrated circuit packaging with improved die bonding
US7737537B2 (en) * 2007-12-12 2010-06-15 Infineon Technologies Ag Electronic device
US8067821B1 (en) * 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US8618674B2 (en) * 2008-09-25 2013-12-31 Infineon Technologies Ag Semiconductor device including a sintered insulation material
JP5404083B2 (ja) * 2009-02-10 2014-01-29 株式会社東芝 半導体装置
US8133759B2 (en) * 2009-04-28 2012-03-13 Macronix International Co., Ltd. Leadframe
US8203201B2 (en) * 2010-03-26 2012-06-19 Stats Chippac Ltd. Integrated circuit packaging system with leads and method of manufacture thereof
US8017447B1 (en) * 2010-08-03 2011-09-13 Linear Technology Corporation Laser process for side plating of terminals
CN102044445B (zh) * 2010-10-26 2013-02-20 日月光封装测试(上海)有限公司 无外引脚半导体封装构造的导线架制造方法
DE102011112659B4 (de) 2011-09-06 2022-01-27 Vishay Semiconductor Gmbh Oberflächenmontierbares elektronisches Bauelement
US20130161804A1 (en) * 2011-12-21 2013-06-27 Clifford R. Fishley Integrated circuit (ic) leadframe design
US9087777B2 (en) * 2013-03-14 2015-07-21 United Test And Assembly Center Ltd. Semiconductor packages and methods of packaging semiconductor devices
JP6164895B2 (ja) * 2013-04-02 2017-07-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TWI566357B (zh) * 2014-01-03 2017-01-11 矽品精密工業股份有限公司 半導體封裝件及其製法暨其承載結構與其製法
TW201539674A (zh) * 2014-04-10 2015-10-16 Chipmos Technologies Inc 四方扁平無引腳封裝及其製造方法
US9704785B2 (en) 2015-01-14 2017-07-11 Mediatek Inc. Semiconductor package with die paddle
US10264664B1 (en) * 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
KR20210058165A (ko) * 2019-11-13 2021-05-24 삼성전자주식회사 반도체 패키지
CN113035722A (zh) 2019-12-24 2021-06-25 维谢综合半导体有限责任公司 具有选择性模制的用于镀覆的封装工艺
CN113035721A (zh) 2019-12-24 2021-06-25 维谢综合半导体有限责任公司 用于侧壁镀覆导电膜的封装工艺
EP3879569A1 (en) * 2020-03-11 2021-09-15 Nexperia B.V. A leadless semiconductor package and method of manufacture

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5764484A (en) 1996-11-15 1998-06-09 Olin Corporation Ground ring for a metal electronic package
US5877551A (en) 1996-11-18 1999-03-02 Olin Corporation Semiconductor package having a ground or power ring and a metal substrate
JP3285815B2 (ja) * 1998-03-12 2002-05-27 松下電器産業株式会社 リードフレーム，樹脂封止型半導体装置及びその製造方法
US6933594B2 (en) * 1998-06-10 2005-08-23 Asat Ltd. Leadless plastic chip carrier with etch back pad singulation
KR100359304B1 (ko) * 2000-08-25 2002-10-31 삼성전자 주식회사 주변 링 패드를 갖는 리드 프레임 및 이를 포함하는반도체 칩 패키지
US6348726B1 (en) * 2001-01-18 2002-02-19 National Semiconductor Corporation Multi row leadless leadframe package
KR100369393B1 (ko) * 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US6630373B2 (en) * 2002-02-26 2003-10-07 St Assembly Test Service Ltd. Ground plane for exposed package
US6812552B2 (en) 2002-04-29 2004-11-02 Advanced Interconnect Technologies Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
JP2004071801A (ja) * 2002-08-06 2004-03-04 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法
JP4159431B2 (ja) 2002-11-15 2008-10-01 株式会社ルネサステクノロジ 半導体装置の製造方法
TWI250632B (en) * 2003-05-28 2006-03-01 Siliconware Precision Industries Co Ltd Ground-enhancing semiconductor package and lead frame
US6812580B1 (en) 2003-06-09 2004-11-02 Freescale Semiconductor, Inc. Semiconductor package having optimized wire bond positioning
US6882035B2 (en) * 2003-07-09 2005-04-19 Agilent Technologies, Inc. Die package
CN101375382B (zh) 2003-08-14 2011-04-20 宇芯（毛里求斯）控股有限公司 半导体器件封装及其制造方法
TWI250622B (en) * 2003-09-10 2006-03-01 Siliconware Precision Industries Co Ltd Semiconductor package having high quantity of I/O connections and method for making the same

Also Published As

Publication number Publication date
EP1994551A2 (en) 2008-11-26
US20070215990A1 (en) 2007-09-20
EP1994551A4 (en) 2010-03-10
JP2009534812A (ja) 2009-09-24
WO2007106487A2 (en) 2007-09-20
US7816186B2 (en) 2010-10-19
WO2007106487A3 (en) 2008-07-31
TW200741924A (en) 2007-11-01

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