TWI350555B - - Google Patents

Info

Publication number
TWI350555B
TWI350555B TW096111663A TW96111663A TWI350555B TW I350555 B TWI350555 B TW I350555B TW 096111663 A TW096111663 A TW 096111663A TW 96111663 A TW96111663 A TW 96111663A TW I350555 B TWI350555 B TW I350555B
Authority
TW
Taiwan
Application number
TW096111663A
Other versions
TW200805438A (en
Inventor
Futoshi Shimai
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200805438A publication Critical patent/TW200805438A/zh
Application granted granted Critical
Publication of TWI350555B publication Critical patent/TWI350555B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW096111663A 2006-04-12 2007-04-02 Heat treatment apparatus TW200805438A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006109706A JP5105396B2 (ja) 2006-04-12 2006-04-12 加熱処理装置

Publications (2)

Publication Number Publication Date
TW200805438A TW200805438A (en) 2008-01-16
TWI350555B true TWI350555B (zh) 2011-10-11

Family

ID=38759255

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111663A TW200805438A (en) 2006-04-12 2007-04-02 Heat treatment apparatus

Country Status (5)

Country Link
US (1) US7943886B2 (zh)
JP (1) JP5105396B2 (zh)
KR (1) KR100875597B1 (zh)
CN (1) CN101055433B (zh)
TW (1) TW200805438A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8509688B2 (en) * 2009-04-23 2013-08-13 Samsung Electronics Co., Ltd. Apparatus and method for mac logical channel selection for operating piconets in body area networks
JP5891013B2 (ja) * 2011-11-18 2016-03-22 東京応化工業株式会社 紫外線照射装置及び基板処理装置
JP5856890B2 (ja) * 2012-03-29 2016-02-10 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN102707586B (zh) * 2012-05-21 2013-12-18 京东方科技集团股份有限公司 一种前烘设备及其排气方法
US10804121B2 (en) * 2016-02-25 2020-10-13 Shibaura Mechatronics Corporation Substrate treatment apparatus, substrate treatment method, and method for manufacturing substrate
JP6845696B2 (ja) * 2016-02-25 2021-03-24 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法及び基板の製造方法
CN106783684A (zh) * 2016-12-19 2017-05-31 惠科股份有限公司 基板烘烤机台及其烘烤作业方法
JP6879808B2 (ja) * 2017-04-13 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP7070313B2 (ja) * 2018-10-11 2022-05-18 三菱電機株式会社 半導体ウエハ基板の熱処理装置及び熱処理方法
CN110133969B (zh) * 2019-04-26 2024-08-30 厦门通富微电子有限公司 一种用于烘烤光刻胶的烘烤设备、烘烤系统及烘烤方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959876A (ja) * 1982-09-30 1984-04-05 Ushio Inc 光照射炉の運転方法
US5444217A (en) * 1993-01-21 1995-08-22 Moore Epitaxial Inc. Rapid thermal processing apparatus for processing semiconductor wafers
JP3324902B2 (ja) 1995-03-29 2002-09-17 東京応化工業株式会社 加熱処理装置及び加熱処理方法
KR100245260B1 (ko) * 1996-02-16 2000-02-15 엔도 마코토 반도체 제조장치의 기판 가열장치
JPH1012522A (ja) 1996-06-21 1998-01-16 Tokyo Ohka Kogyo Co Ltd 加熱処理装置
US6054688A (en) * 1997-06-25 2000-04-25 Brooks Automation, Inc. Hybrid heater with ceramic foil serrated plate and gas assist
US5911896A (en) * 1997-06-25 1999-06-15 Brooks Automation, Inc. Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
JP2000180071A (ja) * 1998-12-16 2000-06-30 Dainippon Screen Mfg Co Ltd 熱処理装置
JP3833439B2 (ja) * 2000-05-02 2006-10-11 株式会社ノリタケカンパニーリミテド 大型基板用多段加熱炉、及び両面加熱式遠赤外線パネルヒーター、並びに該加熱炉内の給排気方法
JP3696156B2 (ja) * 2000-12-26 2005-09-14 株式会社東芝 塗布膜の加熱装置、レジスト膜の処理方法
US6765178B2 (en) * 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6528767B2 (en) * 2001-05-22 2003-03-04 Applied Materials, Inc. Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications
JP2003007594A (ja) * 2001-06-21 2003-01-10 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP2003262469A (ja) * 2002-03-06 2003-09-19 Showa Mfg Co Ltd ガラス基板用熱処理装置
JP4124448B2 (ja) * 2003-03-17 2008-07-23 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP4251887B2 (ja) * 2003-02-26 2009-04-08 東京エレクトロン株式会社 真空処理装置
US20040226513A1 (en) * 2003-05-12 2004-11-18 Applied Materials, Inc. Chamber for uniform heating of large area substrates
JP4384538B2 (ja) * 2003-06-16 2009-12-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2005183596A (ja) * 2003-12-18 2005-07-07 Seiko Epson Corp 熱処理装置および半導体装置の製造方法
JP2005183638A (ja) * 2003-12-18 2005-07-07 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP2005209970A (ja) * 2004-01-26 2005-08-04 Matsushita Electric Ind Co Ltd レジスト被塗布体の加熱装置およびそのモニタリング方法
JP4343151B2 (ja) * 2004-08-11 2009-10-14 東京エレクトロン株式会社 加熱プレートの温度測定方法、基板処理装置及び加熱プレートの温度測定用のコンピュータプログラム

Also Published As

Publication number Publication date
CN101055433B (zh) 2012-05-02
JP2007287717A (ja) 2007-11-01
US20080128402A1 (en) 2008-06-05
CN101055433A (zh) 2007-10-17
KR20070101771A (ko) 2007-10-17
JP5105396B2 (ja) 2012-12-26
KR100875597B1 (ko) 2008-12-23
US7943886B2 (en) 2011-05-17
TW200805438A (en) 2008-01-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees