TWI350274B - - Google Patents
Info
- Publication number
- TWI350274B TWI350274B TW093116725A TW93116725A TWI350274B TW I350274 B TWI350274 B TW I350274B TW 093116725 A TW093116725 A TW 093116725A TW 93116725 A TW93116725 A TW 93116725A TW I350274 B TWI350274 B TW I350274B
- Authority
- TW
- Taiwan
- Prior art keywords
- dispersion
- nickel
- copper
- fine particles
- palladium hydride
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B6/00—Hydrides of metals including fully or partially hydrided metals, alloys or intermetallic compounds ; Compounds containing at least one metal-hydrogen bond, e.g. (GeH3)2S, SiH GeH; Monoborane or diborane; Addition complexes thereof
- C01B6/02—Hydrides of transition elements; Addition complexes thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003164666 | 2003-06-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200503955A TW200503955A (en) | 2005-02-01 |
TWI350274B true TWI350274B (zh) | 2011-10-11 |
Family
ID=33549191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093116725A TW200503955A (en) | 2003-06-10 | 2004-06-10 | Metal hydride fine particle, method for producing same, liquid dispersion containing metal hydride fine particle, and metallic material |
Country Status (8)
Country | Link |
---|---|
US (1) | US7550513B2 (zh) |
EP (1) | EP1640338B1 (zh) |
JP (1) | JP4747839B2 (zh) |
KR (1) | KR101093465B1 (zh) |
CN (1) | CN100344528C (zh) |
AT (1) | ATE531669T1 (zh) |
TW (1) | TW200503955A (zh) |
WO (1) | WO2004110925A1 (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004110925A1 (ja) | 2003-06-10 | 2004-12-23 | Asahi Glass Company, Limited | 金属水素化物微粒子、その製造方法、金属水素化物微粒子を含有する分散液及び金属質材料 |
JP2005081501A (ja) * | 2003-09-09 | 2005-03-31 | Ulvac Japan Ltd | 金属ナノ粒子及びその製造方法、金属ナノ粒子分散液及びその製造方法、並びに金属細線及び金属膜及びその形成方法 |
WO2005088652A1 (ja) * | 2004-03-10 | 2005-09-22 | Asahi Glass Company, Limited | 金属含有微粒子、金属含有微粒子分散液および導電性金属含有材料 |
WO2006109410A1 (ja) * | 2005-04-12 | 2006-10-19 | Asahi Glass Company, Limited | インク組成物及び金属質材料 |
TWI392594B (zh) * | 2006-04-20 | 2013-04-11 | Microjet Technology Co Ltd | 微小顆粒製造系統及製程 |
JP5131191B2 (ja) * | 2006-07-28 | 2013-01-30 | 旭硝子株式会社 | 金属微粒子を含有する分散液の製造方法 |
KR101375047B1 (ko) * | 2006-12-29 | 2014-03-26 | 엘지디스플레이 주식회사 | 표시장치 제조방법 |
JP5593699B2 (ja) * | 2008-02-07 | 2014-09-24 | 旭硝子株式会社 | 水素化銅ナノ粒子、その製造方法、金属ペーストおよび物品 |
US7901491B2 (en) * | 2008-03-31 | 2011-03-08 | General Electric Company | Hydrogen storage material and related system |
JP5387034B2 (ja) * | 2009-02-20 | 2014-01-15 | 大日本印刷株式会社 | 導電性基板 |
KR101490571B1 (ko) | 2010-01-28 | 2015-02-05 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 패턴 형상 도전성막의 형성 방법 |
CN102985857B (zh) | 2010-07-15 | 2016-02-24 | 旭硝子株式会社 | 超材料的制造方法及超材料 |
JP5077728B1 (ja) * | 2011-03-31 | 2012-11-21 | Dic株式会社 | 有機化合物と銀コア銅シェルナノ粒子との複合体及びその製造方法 |
JPWO2013021567A1 (ja) | 2011-08-11 | 2015-03-05 | 三洋電機株式会社 | 金属の接合方法および金属接合構造 |
JP5088760B1 (ja) * | 2011-11-14 | 2012-12-05 | 石原薬品株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
JP2015110682A (ja) * | 2012-03-21 | 2015-06-18 | 旭硝子株式会社 | 導電インク、導体付き基材、および導体付き基材の製造方法 |
JP2015110683A (ja) * | 2012-03-22 | 2015-06-18 | 旭硝子株式会社 | 導電インク、導体付き基材及び導体付き基材の製造方法 |
US9234112B2 (en) * | 2013-06-05 | 2016-01-12 | Korea Institute Of Machinery & Materials | Metal precursor powder, method of manufacturing conductive metal layer or pattern, and device including the same |
JP6137049B2 (ja) * | 2014-05-13 | 2017-05-31 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
CN114162784B (zh) * | 2021-11-03 | 2023-02-17 | 五邑大学 | 一种钯氢化合物的绿色制备方法及其应用 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3844854A (en) * | 1967-09-20 | 1974-10-29 | Dow Chemical Co | Stabilization of light metal hydride |
JPS462162B1 (zh) * | 1968-12-17 | 1971-01-20 | ||
US3963831A (en) * | 1972-06-15 | 1976-06-15 | Dynamit Nobel Aktiengesellschaft | Process for the manufacture of alkali metal hydrides in coarse powder form |
US4666735A (en) * | 1983-04-15 | 1987-05-19 | Polyonics Corporation | Process for producing product having patterned metal layer |
JPS60160192A (ja) * | 1983-10-12 | 1985-08-21 | 日立粉末冶金株式会社 | 混成集積回路基板の製造方法 |
JPH02294417A (ja) * | 1989-05-10 | 1990-12-05 | Seidou Kagaku Kogyo Kk | 超微粒子銅粉末の製造方法 |
US6528441B1 (en) * | 1992-10-28 | 2003-03-04 | Westinghouse Savannah River Company, L.L.C. | Hydrogen storage composition and method |
MY125159A (en) * | 1998-09-14 | 2006-07-31 | Mitsubishi Materials Corp | Fine metal particle-dispersion solution and conductive film using the same |
US6589312B1 (en) * | 1999-09-01 | 2003-07-08 | David G. Snow | Nanoparticles for hydrogen storage, transportation, and distribution |
US20030170314A1 (en) * | 2000-07-27 | 2003-09-11 | Burrell Robert E. | Compositions of metal-containing compounds |
JP3942816B2 (ja) | 2000-10-25 | 2007-07-11 | ハリマ化成株式会社 | 金属間のロウ付け接合方法 |
JP3774638B2 (ja) | 2001-04-24 | 2006-05-17 | ハリマ化成株式会社 | インクジェット印刷法を利用する回路パターンの形成方法 |
JP3764349B2 (ja) | 2001-05-07 | 2006-04-05 | ハリマ化成株式会社 | 金属微粒子分散液を用いたメッキ代替導電性金属皮膜の形成方法 |
JP3817201B2 (ja) * | 2002-04-19 | 2006-09-06 | Jsr株式会社 | 導電性膜形成用組成物、導電性膜およびその形成法 |
WO2004110925A1 (ja) | 2003-06-10 | 2004-12-23 | Asahi Glass Company, Limited | 金属水素化物微粒子、その製造方法、金属水素化物微粒子を含有する分散液及び金属質材料 |
-
2004
- 2004-06-09 WO PCT/JP2004/008370 patent/WO2004110925A1/ja active Application Filing
- 2004-06-09 JP JP2005506963A patent/JP4747839B2/ja not_active Expired - Fee Related
- 2004-06-09 KR KR1020057022915A patent/KR101093465B1/ko active IP Right Grant
- 2004-06-09 EP EP04745922A patent/EP1640338B1/en not_active Expired - Lifetime
- 2004-06-09 CN CNB2004800162335A patent/CN100344528C/zh not_active Expired - Fee Related
- 2004-06-09 AT AT04745922T patent/ATE531669T1/de active
- 2004-06-10 TW TW093116725A patent/TW200503955A/zh not_active IP Right Cessation
-
2005
- 2005-12-08 US US11/296,321 patent/US7550513B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPWO2004110925A1 (ja) | 2006-07-20 |
EP1640338A1 (en) | 2006-03-29 |
JP4747839B2 (ja) | 2011-08-17 |
US20060070493A1 (en) | 2006-04-06 |
EP1640338B1 (en) | 2011-11-02 |
CN100344528C (zh) | 2007-10-24 |
ATE531669T1 (de) | 2011-11-15 |
KR20060037260A (ko) | 2006-05-03 |
KR101093465B1 (ko) | 2011-12-13 |
WO2004110925A1 (ja) | 2004-12-23 |
US7550513B2 (en) | 2009-06-23 |
CN1805901A (zh) | 2006-07-19 |
TW200503955A (en) | 2005-02-01 |
EP1640338A4 (en) | 2008-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |