TWI349146B - A light-mixing type light-emitting device - Google Patents
A light-mixing type light-emitting deviceInfo
- Publication number
- TWI349146B TWI349146B TW095117359A TW95117359A TWI349146B TW I349146 B TWI349146 B TW I349146B TW 095117359 A TW095117359 A TW 095117359A TW 95117359 A TW95117359 A TW 95117359A TW I349146 B TWI349146 B TW I349146B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting device
- mixing type
- type light
- mixing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Led Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095117359A TWI349146B (en) | 2006-05-15 | 2006-05-15 | A light-mixing type light-emitting device |
US11/798,521 US8882290B2 (en) | 2006-05-15 | 2007-05-15 | Light-mixing type light-emitting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095117359A TWI349146B (en) | 2006-05-15 | 2006-05-15 | A light-mixing type light-emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200742918A TW200742918A (en) | 2007-11-16 |
TWI349146B true TWI349146B (en) | 2011-09-21 |
Family
ID=38684899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095117359A TWI349146B (en) | 2006-05-15 | 2006-05-15 | A light-mixing type light-emitting device |
Country Status (2)
Country | Link |
---|---|
US (1) | US8882290B2 (zh) |
TW (1) | TWI349146B (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008073400A1 (en) | 2006-12-11 | 2008-06-19 | The Regents Of The University Of California | Transparent light emitting diodes |
KR101255280B1 (ko) * | 2008-02-22 | 2013-04-15 | 엘지디스플레이 주식회사 | 백라이트 유닛 |
TWI416755B (zh) * | 2008-05-30 | 2013-11-21 | Epistar Corp | 光源模組、其對應之光棒及其對應之液晶顯示裝置 |
WO2011037876A1 (en) * | 2009-09-25 | 2011-03-31 | Cree, Inc. | Lighting device having heat dissipation element |
US8319247B2 (en) | 2010-03-25 | 2012-11-27 | Koninklijke Philips Electronics N.V. | Carrier for a light emitting device |
US8486761B2 (en) * | 2010-03-25 | 2013-07-16 | Koninklijke Philips Electronics N.V. | Hybrid combination of substrate and carrier mounted light emitting devices |
US20120014091A1 (en) * | 2010-07-14 | 2012-01-19 | Shenzhen China Star Optoelectronics Technology Co Ltd. | Led package assembly and backlight module |
TWI557875B (zh) * | 2010-07-19 | 2016-11-11 | 晶元光電股份有限公司 | 多維度發光裝置 |
US8198109B2 (en) | 2010-08-27 | 2012-06-12 | Quarkstar Llc | Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination |
KR20120029727A (ko) * | 2010-09-17 | 2012-03-27 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
US8192051B2 (en) | 2010-11-01 | 2012-06-05 | Quarkstar Llc | Bidirectional LED light sheet |
US8410726B2 (en) | 2011-02-22 | 2013-04-02 | Quarkstar Llc | Solid state lamp using modular light emitting elements |
US8314566B2 (en) | 2011-02-22 | 2012-11-20 | Quarkstar Llc | Solid state lamp using light emitting strips |
TWI456733B (zh) * | 2011-04-14 | 2014-10-11 | Formosa Epitaxy Inc | 混光發光裝置及其製造方法 |
DE102011087886A1 (de) * | 2011-12-07 | 2013-06-13 | Osram Gmbh | Halbleiterleuchte |
WO2014011419A1 (en) * | 2012-07-10 | 2014-01-16 | Toshiba Techno Center, Inc. | Submount for led device package |
DE102012108719A1 (de) * | 2012-09-17 | 2014-03-20 | Alanod Gmbh & Co. Kg | Reflektor, Beleuchtungskörper mit einem derartigen Reflektor und Verwendung eines Basismaterials zu dessen Herstellung |
TWI520383B (zh) * | 2013-10-14 | 2016-02-01 | 新世紀光電股份有限公司 | 發光二極體封裝結構 |
JP6489820B2 (ja) * | 2014-12-18 | 2019-03-27 | スタンレー電気株式会社 | 光学装置 |
WO2018172175A1 (en) * | 2017-03-21 | 2018-09-27 | Philips Lighting Holding B.V. | A light emitting assembly, a spot lamp and a luminaire |
TWI677116B (zh) * | 2017-03-29 | 2019-11-11 | 宏齊科技股份有限公司 | 半導體發光模組及其半導體發光二極體晶片 |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
CN112241088B (zh) * | 2020-10-15 | 2021-09-03 | Tcl华星光电技术有限公司 | 一种微型发光二极管灯板、背光模组及其制备方法 |
Family Cites Families (18)
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US3899826A (en) * | 1971-12-20 | 1975-08-19 | Motorola Inc | Scannable light emitting diode array and method |
US3746853A (en) * | 1972-03-10 | 1973-07-17 | Bell Canada Northern Electric | Light emitting devices |
EP0221531A3 (en) * | 1985-11-06 | 1992-02-19 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | High heat conductive insulated substrate and method of manufacturing the same |
US5583350A (en) * | 1995-11-02 | 1996-12-10 | Motorola | Full color light emitting diode display assembly |
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
TW344900B (en) | 1997-06-18 | 1998-11-11 | Jing Yuan Opto-Electronics Corp | Light-emitting diode a light-emitting diode comprises a substrate formed on a first electrode; a first bonding layer; an active layer; a second bonding layer; etc. |
US6697130B2 (en) * | 2001-01-16 | 2004-02-24 | Visteon Global Technologies, Inc. | Flexible led backlighting circuit |
US6455878B1 (en) * | 2001-05-15 | 2002-09-24 | Lumileds Lighting U.S., Llc | Semiconductor LED flip-chip having low refractive index underfill |
TW522534B (en) * | 2001-09-11 | 2003-03-01 | Hsiu-Hen Chang | Light source of full color LED using die bonding and packaging technology |
WO2003056636A1 (en) * | 2001-12-29 | 2003-07-10 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
CN100595937C (zh) * | 2002-08-01 | 2010-03-24 | 日亚化学工业株式会社 | 半导体发光元件及发光装置 |
US7213942B2 (en) * | 2002-10-24 | 2007-05-08 | Ac Led Lighting, L.L.C. | Light emitting diodes for high AC voltage operation and general lighting |
US6903381B2 (en) * | 2003-04-24 | 2005-06-07 | Opto Tech Corporation | Light-emitting diode with cavity containing a filler |
DE112004002083T5 (de) * | 2003-10-31 | 2008-03-20 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung |
JP4489423B2 (ja) * | 2003-12-26 | 2010-06-23 | シャープ株式会社 | バックライト及び液晶表示装置 |
TWI239108B (en) | 2004-01-19 | 2005-09-01 | Chi Mei Optoelectronics Corp | LED array and direct type back light module |
US7569863B2 (en) * | 2004-02-19 | 2009-08-04 | Panasonic Corporation | Semiconductor light emitting device |
TWI244535B (en) * | 2004-03-24 | 2005-12-01 | Yuan Lin | A full color and flexible illuminating strap device |
-
2006
- 2006-05-15 TW TW095117359A patent/TWI349146B/zh active
-
2007
- 2007-05-15 US US11/798,521 patent/US8882290B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW200742918A (en) | 2007-11-16 |
US8882290B2 (en) | 2014-11-11 |
US20070263384A1 (en) | 2007-11-15 |
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