TWI348217B - Semiconductor component and method of manufacturing same - Google Patents

Semiconductor component and method of manufacturing same

Info

Publication number
TWI348217B
TWI348217B TW093125243A TW93125243A TWI348217B TW I348217 B TWI348217 B TW I348217B TW 093125243 A TW093125243 A TW 093125243A TW 93125243 A TW93125243 A TW 93125243A TW I348217 B TWI348217 B TW I348217B
Authority
TW
Taiwan
Prior art keywords
semiconductor component
manufacturing same
manufacturing
same
semiconductor
Prior art date
Application number
TW093125243A
Other languages
English (en)
Chinese (zh)
Other versions
TW200514253A (en
Inventor
Darrell Hill
Mariam G Sadaka
Marcus Ray
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of TW200514253A publication Critical patent/TW200514253A/zh
Application granted granted Critical
Publication of TWI348217B publication Critical patent/TWI348217B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H10D10/80—Heterojunction BJTs
    • H10D10/821—Vertical heterojunction BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/80—FETs having rectifying junction gate electrodes
    • H10D30/801—FETs having heterojunction gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/05—Manufacture or treatment characterised by using material-based technologies using Group III-V technology
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
TW093125243A 2003-08-29 2004-08-20 Semiconductor component and method of manufacturing same TWI348217B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/651,544 US6919590B2 (en) 2003-08-29 2003-08-29 Heterojunction bipolar transistor with monolithically integrated junction field effect transistor and method of manufacturing same

Publications (2)

Publication Number Publication Date
TW200514253A TW200514253A (en) 2005-04-16
TWI348217B true TWI348217B (en) 2011-09-01

Family

ID=34217426

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125243A TWI348217B (en) 2003-08-29 2004-08-20 Semiconductor component and method of manufacturing same

Country Status (5)

Country Link
US (1) US6919590B2 (enExample)
EP (1) EP1661185A4 (enExample)
JP (1) JP4960092B2 (enExample)
TW (1) TWI348217B (enExample)
WO (1) WO2005024954A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200620539A (en) * 2004-10-14 2006-06-16 Koninkl Philips Electronics Nv BiCMOS compatible JFET device and method of manufacturing same
KR100677816B1 (ko) * 2005-03-28 2007-02-02 산요덴키가부시키가이샤 능동 소자 및 스위치 회로 장치
JP4712683B2 (ja) * 2006-12-21 2011-06-29 パナソニック株式会社 トランジスタおよびその製造方法
JP4524298B2 (ja) * 2007-06-04 2010-08-11 パナソニック株式会社 半導体装置の製造方法
JP5295593B2 (ja) * 2008-03-13 2013-09-18 パナソニック株式会社 半導体装置
JP2010206020A (ja) 2009-03-04 2010-09-16 Panasonic Corp 半導体装置
JP2010225765A (ja) * 2009-03-23 2010-10-07 Panasonic Corp 半導体装置及びその製造方法
US9099397B1 (en) * 2012-03-22 2015-08-04 Hrl Laboratories, Llc Fabrication of self aligned base contacts for bipolar transistors
JP6022998B2 (ja) * 2013-05-10 2016-11-09 日本電信電話株式会社 半導体装置
CN107871741A (zh) * 2017-10-30 2018-04-03 湖南大学 一种用于dc/dc斩波电路的单片集成半导体芯片及制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5068756A (en) 1989-02-16 1991-11-26 Texas Instruments Incorporated Integrated circuit composed of group III-V compound field effect and bipolar semiconductors
US5223449A (en) 1989-02-16 1993-06-29 Morris Francis J Method of making an integrated circuit composed of group III-V compound field effect and bipolar semiconductors
US5097312A (en) 1989-02-16 1992-03-17 Texas Instruments Incorporated Heterojunction bipolar transistor and integration of same with field effect device
JP2686827B2 (ja) * 1989-08-03 1997-12-08 本田技研工業株式会社 半導体装置
US5077231A (en) 1991-03-15 1991-12-31 Texas Instruments Incorporated Method to integrate HBTs and FETs
US5243207A (en) 1991-03-15 1993-09-07 Texas Instruments Incorporated Method to integrate HBTs and FETs
JPH0541393A (ja) * 1991-08-05 1993-02-19 Nippon Telegr & Teleph Corp <Ntt> 接合型電界効果トランジスタ
JPH06163829A (ja) 1992-07-31 1994-06-10 Texas Instr Inc <Ti> 集積回路とその製法
JP3323544B2 (ja) * 1992-08-21 2002-09-09 株式会社日立製作所 半導体装置
US5250826A (en) * 1992-09-23 1993-10-05 Rockwell International Corporation Planar HBT-FET Device
JPH0883808A (ja) * 1994-07-13 1996-03-26 Hitachi Ltd 半導体装置
DE69522075T2 (de) 1994-11-02 2002-01-03 Trw Inc., Redondo Beach Verfahren zum Herstellen von multifunktionellen, monolithisch-integrierten Schaltungsanordnungen
US6043519A (en) * 1996-09-12 2000-03-28 Hughes Electronics Corporation Junction high electron mobility transistor-heterojunction bipolar transistor (JHEMT-HBT) monolithic microwave integrated circuit (MMIC) and single growth method of fabrication
JP2000058663A (ja) * 1998-08-11 2000-02-25 Mitsubishi Electric Corp 集積型バイアス回路素子

Also Published As

Publication number Publication date
JP2007504649A (ja) 2007-03-01
TW200514253A (en) 2005-04-16
JP4960092B2 (ja) 2012-06-27
US6919590B2 (en) 2005-07-19
EP1661185A4 (en) 2007-08-22
WO2005024954A1 (en) 2005-03-17
US20050045911A1 (en) 2005-03-03
EP1661185A1 (en) 2006-05-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees