TWI348093B - Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled - Google Patents

Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled

Info

Publication number
TWI348093B
TWI348093B TW095138408A TW95138408A TWI348093B TW I348093 B TWI348093 B TW I348093B TW 095138408 A TW095138408 A TW 095138408A TW 95138408 A TW95138408 A TW 95138408A TW I348093 B TWI348093 B TW I348093B
Authority
TW
Taiwan
Prior art keywords
cooled
cooling apparatus
method employing
plates disposed
cold plates
Prior art date
Application number
TW095138408A
Other languages
English (en)
Other versions
TW200741434A (en
Inventor
Levi A Campbell
Richard C Chu
Ellsworth, Jr
Madhusudan K Iyengar
Roger R Schmidt
Robert E Simons
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200741434A publication Critical patent/TW200741434A/zh
Application granted granted Critical
Publication of TWI348093B publication Critical patent/TWI348093B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW095138408A 2005-10-25 2006-10-18 Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled TWI348093B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/258,314 US7298617B2 (en) 2005-10-25 2005-10-25 Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled

Publications (2)

Publication Number Publication Date
TW200741434A TW200741434A (en) 2007-11-01
TWI348093B true TWI348093B (en) 2011-09-01

Family

ID=37985139

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138408A TWI348093B (en) 2005-10-25 2006-10-18 Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled

Country Status (3)

Country Link
US (3) US7298617B2 (zh)
CN (1) CN100581334C (zh)
TW (1) TWI348093B (zh)

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Also Published As

Publication number Publication date
US20080030953A1 (en) 2008-02-07
US7385817B2 (en) 2008-06-10
US7486514B2 (en) 2009-02-03
CN100581334C (zh) 2010-01-13
TW200741434A (en) 2007-11-01
US7298617B2 (en) 2007-11-20
CN1956647A (zh) 2007-05-02
US20070091569A1 (en) 2007-04-26
US20080170366A1 (en) 2008-07-17

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