US20100059201A1 - Liquid cooled rack with compliant heat exchanger support structure - Google Patents
Liquid cooled rack with compliant heat exchanger support structure Download PDFInfo
- Publication number
- US20100059201A1 US20100059201A1 US12/208,744 US20874408A US2010059201A1 US 20100059201 A1 US20100059201 A1 US 20100059201A1 US 20874408 A US20874408 A US 20874408A US 2010059201 A1 US2010059201 A1 US 2010059201A1
- Authority
- US
- United States
- Prior art keywords
- rack
- heat exchanger
- liquid cooled
- liquid
- heat exchangers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/007—Auxiliary supports for elements
- F28F9/0075—Supports for plates or plate assemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
Definitions
- FIG. 1 shows a perspective view of a typical server rack with a heat exchanger located in a data room where a part of a frame is removed so as to expose internal components therein.
- the server rack 100 has a rigid frame 101 and liquid-fed heat exchangers 102 .
- the server rack 100 also has a various kinds of electric components (not shown) disposed therein.
- a pipe system 103 is installed, typically overhead, and delivers a liquid coolant to the heat exchangers 102 to cool the electronic components.
- the sever rack 100 may include fans 108 for propagating air through the server rack 100 across the heat exchangers 102 to cool the electronic components therein.
- the liquid-fed heat exchangers 102 are rigidly held by the frame 101 approximately horizontally. Specifically, the liquid-fed heat exchangers 102 are secured to the frame 101 by screws such that the liquid-fed heat exchangers 102 are rigidly held in place in the frame 101 .
- a liquid cooled rack with compliant heat exchanger support structure includes a rack having a rigid frame for supporting electronic components therein, a plurality of flexible supports connected to the rigid frame, and a liquid-fed heat exchanger mounted within the rack via the plurality of flexible supports.
- the plurality of flexible supports are connected to the heat exchanger and configured to flexbly support the liquid-fed heat exchanger with respect to the rigid frame.
- FIG. 1 shows a perspective view of a typical server rack with a heat exchanger located in a data room where a part of a frame is removed so as to expose internal components therein.
- FIG. 2 shows a perspective view of a liquid cooled rack with compliant heat exchanger support structure in a data room in accordance with one or more embodiments of the present invention where a part of a frame are removed so as to expose internal components therein.
- FIG. 3 shows an enlarged bottom view of the heat exchanger shown in FIG. 2 .
- FIG. 4 shows an enlarged side view of the heat exchanger shown in FIG. 2 .
- FIG. 5 shows an enlarged top view of the heat exchanger shown in FIG. 2 in accordance with another embodiment of the present invention.
- FIG. 6 shows an enlarged side view of the heat exchanger shown in FIG. 5 .
- FIG. 2 shows a perspective view of a liquid cooled rack with compliant heat exchanger support structure in a data room in accordance with one or more embodiments of the present invention where a part of a frame is removed so as to expose internal components therein.
- the rack 200 has a rigid frame 201 and liquid-fed heat exchangers 202 .
- the liquid-fed heat exchangers 202 are secured to the rigid frame 201 by compliant attachment members 206 .
- compliant attachment members 206 With reference to the following figures, various embodiments of the compliant attachment members 206 are discussed in detail.
- the compliant attachment members 206 may comprise springs, flexible plates, flexible rods, flexible bands, or any other flexible supports, which are connected to the liquid-fed heat exchangers 202 in various ways depending on the configuration of the rack 200 .
- the frame 201 supports a various kinds of electric components, such as electronic modules, blade servers, or the like (not shown) disposed therein.
- the different numbers of liquid-fed heat exchangers 202 may be used.
- an overhead pipe system 203 may be installed over the rack 200 .
- the position of the overhead pipe system 203 may be adjusted according to the design of the data room and position of the rack 200 .
- the overhead pipe system 203 delivers a liquid coolant to the heat exchangers 202 to cool the electronic components therein.
- the overhead pipe system 203 is connected to each of the heat exchangers 202 in FIG. 2 , one skilled in the art will appreciate that any other connections between the overhead pipe system 203 and the heat exchangers 202 could be used as long as the overhead pipe system 203 delivers a liquid coolant to the heat exchangers 202 to cool the electronic components properly.
- the rack 200 may include fans 208 for propagating air across the heat exchangers 202 through the rack 200 to cool the electronic components.
- the number of the fans and the position of the fans may be determined based on the design of the rack 200 and the electric components disposed therein.
- FIG. 3 shows an enlarged bottom view of the heat exchanger shown in FIG. 2 .
- FIG. 4 shows an enlarged side view of the heat exchanger shown in FIG. 2 .
- the heat exchanger 202 is mounted within a holder 203 .
- the heat exchanger 202 may be disposed on the holder 203 by attachment methods known in the art.
- air may easily pass through the holder 203 such that air is propagated across the heat exchangers 202 through the rack 200 to cool the electronic components.
- any other shapes of the heat exchangers 202 and the holders 203 could be used as long as the heat exchangers 202 are flexibly supported within the rack 200 as explained below.
- the holder 203 may have recessed portions 204 at the top and bottom surface thereof
- the recessed portions 204 may be positioned around corners of the holder 204 . Further, each of the recessed portions 204 has projections 401 and 402 on the top and bottom surfaces thereof respectively.
- the frame 201 has attachments parts 401 corresponding to the recessed portions 204 .
- the frame 201 has the attachment parts 403 and 404 at the inside surface thereof.
- Each of the attachment parts 403 has a projection 405 on the bottom surface thereof.
- each of the attachment parts 404 has a projection 406 on the top surface thereof
- the recessed portions 204 of the heat exchangers 202 have projections 410 and 412 .
- a spring 407 is installed between the projections 405 and 410 . Also, a spring 408 is installed between the projections 406 and 412 .
- the recessed portions 204 of the holder 203 are flexibly connected to the attachment parts 403 and 404 via the springs 407 and 408 . That is, the springs 407 and 408 flexibly supports the heat exchangers 202 approximately horizontally with respect to the rigid frame 201 .
- the liquid cooled rack with compliant heat exchanger support structure allows the heat exchangers 202 to rotate/swivel and absorb displacement of the frame 201 transmitted from the frame 201 due to a vibration, such as, by an earthquake, allowing the heat exchangers 202 to maintain the spatial geometry and envelope.
- the positions, the numbers, the size, and the shape of the recessed portions 204 , attachment parts 403 and 404 , springs 407 and 408 , projections 406 , 408 , 410 , and 412 may be adjusted in accordance with the design of the heat exchangers 202 , the frame 201 , and the internal electric components as long as the heat exchangers 202 are flexibly supported within the rack 200 as described.
- FIG. 5 shows an enlarged top view of the heat exchanger shown in FIG. 2 in accordance with another embodiment of the present invention.
- FIG. 6 shows an enlarged side view of the heat exchanger shown in FIG. 5 .
- one end of the flexible support 501 may be attached to the holder 203 of the heat exchangers 202 by a screw 502
- the other end of the flexible support 501 may be attached to the inside surface of the frame 201 by screw 503 .
- each corners the heat exchangers 202 are attached to the inside surface of the frame 201 via a pair of the flexible supports 501 so that the heat exchangers 202 are supported flexibly by the flexible supports 501 with respect to the rigid frame 201 .
- the liquid cooled rack with compliant heat exchanger support structure allows the heat exchangers 202 to rotate/swivel and absorb displacement of the frame 201 transmitted from the frame 201 due to an earthquake, allowing the heat exchangers 202 to maintain the spatial geometry and envelope during the earthquake.
- both ends of the flexible supports may be attached by adhesives, bonding, or any other methods known in the art as long as the heat exchangers 202 are flexibly supported by the flexible supports 501 with respect to the rigid frame 201 as explained above.
- any other the positions, the numbers, the sizes, and the shapes of the flexible supports 501 could be used as long as the heat exchangers 202 are flexibly supported within the rack 200 as explained above.
- the liquid cooled rack with compliant heat exchanger support structure allows the heat exchangers to rotate/swivel and absorb the rack's frame displacement transmitted from the frame due to an earthquake, allowing the heat exchangers to maintain the spatial geometry and envelope during the earthquake. Further, the liquid cooled rack with compliant heat exchanger support structure prevents the flexure of the heat exchangers from exceeding the allowed flexure resulting in mechanical failure and or a leakage of the coolant.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A liquid cooled rack with compliant heat exchanger support structure includes a rack having a rigid frame for supporting electronic components therein, a plurality of flexible supports connected to the rigid frame, and a liquid-fed heat exchanger mounted within the rack via the plurality of flexible supports. The plurality of flexible supports are connected to the heat exchanger and configured to flexibly support the liquid-fed heat exchanger with respect to the rigid frame.
Description
-
FIG. 1 shows a perspective view of a typical server rack with a heat exchanger located in a data room where a part of a frame is removed so as to expose internal components therein. As can be seen fromFIG. 1 , theserver rack 100 has arigid frame 101 and liquid-fedheat exchangers 102. Theserver rack 100 also has a various kinds of electric components (not shown) disposed therein. In the data room, apipe system 103 is installed, typically overhead, and delivers a liquid coolant to theheat exchangers 102 to cool the electronic components. Thesever rack 100 may includefans 108 for propagating air through theserver rack 100 across theheat exchangers 102 to cool the electronic components therein. - The liquid-fed
heat exchangers 102 are rigidly held by theframe 101 approximately horizontally. Specifically, the liquid-fedheat exchangers 102 are secured to theframe 101 by screws such that the liquid-fedheat exchangers 102 are rigidly held in place in theframe 101. - One or more embodiments of the present invention relate to a liquid cooled rack with compliant heat exchanger support structure includes a rack having a rigid frame for supporting electronic components therein, a plurality of flexible supports connected to the rigid frame, and a liquid-fed heat exchanger mounted within the rack via the plurality of flexible supports. The plurality of flexible supports are connected to the heat exchanger and configured to flexbly support the liquid-fed heat exchanger with respect to the rigid frame.
- Other aspects and advantageous of the invention will be apparent from the following description and appended claims.
-
FIG. 1 shows a perspective view of a typical server rack with a heat exchanger located in a data room where a part of a frame is removed so as to expose internal components therein. -
FIG. 2 shows a perspective view of a liquid cooled rack with compliant heat exchanger support structure in a data room in accordance with one or more embodiments of the present invention where a part of a frame are removed so as to expose internal components therein. -
FIG. 3 shows an enlarged bottom view of the heat exchanger shown inFIG. 2 . -
FIG. 4 shows an enlarged side view of the heat exchanger shown inFIG. 2 . -
FIG. 5 shows an enlarged top view of the heat exchanger shown inFIG. 2 in accordance with another embodiment of the present invention. -
FIG. 6 shows an enlarged side view of the heat exchanger shown inFIG. 5 . - Specific embodiments of the invention will now be described in detail with reference to the accompanying figures. Like elements in the various figures are denoted by like reference numerals for consistency.
- In the following detailed description of embodiments of the invention, numerous specific details are set forth in order to provide a more thorough understanding of the invention. However, it will be apparent to one of ordinary skill in the art that the invention may be practiced without these specific details. In other instances, well-known features have not been described in detail to avoid unnecessarily complicating the description.
-
FIG. 2 shows a perspective view of a liquid cooled rack with compliant heat exchanger support structure in a data room in accordance with one or more embodiments of the present invention where a part of a frame is removed so as to expose internal components therein. As can be seen fromFIG. 2 , therack 200 has arigid frame 201 and liquid-fedheat exchangers 202. The liquid-fedheat exchangers 202 are secured to therigid frame 201 bycompliant attachment members 206. With reference to the following figures, various embodiments of thecompliant attachment members 206 are discussed in detail. In one or more embodiments, thecompliant attachment members 206 may comprise springs, flexible plates, flexible rods, flexible bands, or any other flexible supports, which are connected to the liquid-fedheat exchangers 202 in various ways depending on the configuration of therack 200. Theframe 201 supports a various kinds of electric components, such as electronic modules, blade servers, or the like (not shown) disposed therein. The different numbers of liquid-fedheat exchangers 202 may be used. - In the data room, an
overhead pipe system 203 may be installed over therack 200. The position of theoverhead pipe system 203 may be adjusted according to the design of the data room and position of therack 200. Theoverhead pipe system 203 delivers a liquid coolant to theheat exchangers 202 to cool the electronic components therein. - Although the
overhead pipe system 203 is connected to each of theheat exchangers 202 inFIG. 2 , one skilled in the art will appreciate that any other connections between theoverhead pipe system 203 and theheat exchangers 202 could be used as long as theoverhead pipe system 203 delivers a liquid coolant to theheat exchangers 202 to cool the electronic components properly. - Further, the
rack 200 may includefans 208 for propagating air across theheat exchangers 202 through therack 200 to cool the electronic components. The number of the fans and the position of the fans may be determined based on the design of therack 200 and the electric components disposed therein. -
FIG. 3 shows an enlarged bottom view of the heat exchanger shown inFIG. 2 . Those skilled in the art will appreciate that the top view of the heat exchanger may be the same as that shown inFIG. 2 .FIG. 4 shows an enlarged side view of the heat exchanger shown inFIG. 2 . - As can be seen from
FIG. 3 , theheat exchanger 202 is mounted within aholder 203. Specifically, theheat exchanger 202 may be disposed on theholder 203 by attachment methods known in the art. Also, air may easily pass through theholder 203 such that air is propagated across theheat exchangers 202 through therack 200 to cool the electronic components. In one or more embodiments, one skilled in the art will appreciate that any other shapes of theheat exchangers 202 and theholders 203 could be used as long as theheat exchangers 202 are flexibly supported within therack 200 as explained below. - As shown in
FIGS. 3 and 4 , theholder 203 may have recessedportions 204 at the top and bottom surface thereof Therecessed portions 204 may be positioned around corners of theholder 204. Further, each of therecessed portions 204 hasprojections 401 and 402 on the top and bottom surfaces thereof respectively. - The
frame 201 hasattachments parts 401 corresponding to therecessed portions 204. Specifically, theframe 201 has theattachment parts attachment parts 403 has aprojection 405 on the bottom surface thereof. Also, each of theattachment parts 404 has aprojection 406 on the top surface thereof Correspondingly, therecessed portions 204 of theheat exchangers 202 haveprojections - A
spring 407 is installed between theprojections spring 408 is installed between theprojections recessed portions 204 of theholder 203 are flexibly connected to theattachment parts springs springs heat exchangers 202 approximately horizontally with respect to therigid frame 201. - As a result, the liquid cooled rack with compliant heat exchanger support structure allows the
heat exchangers 202 to rotate/swivel and absorb displacement of theframe 201 transmitted from theframe 201 due to a vibration, such as, by an earthquake, allowing theheat exchangers 202 to maintain the spatial geometry and envelope. - The positions, the numbers, the size, and the shape of the
recessed portions 204,attachment parts springs projections heat exchangers 202, theframe 201, and the internal electric components as long as theheat exchangers 202 are flexibly supported within therack 200 as described. - In one or more embodiments, one skilled in the art will appreciate that, instead of
springs heat exchangers 202 are flexibly supported within therack 200 with respect to therigid frame 201 as explained. For example,FIG. 5 shows an enlarged top view of the heat exchanger shown inFIG. 2 in accordance with another embodiment of the present invention.FIG. 6 shows an enlarged side view of the heat exchanger shown inFIG. 5 . - As shown in
FIGS. 5 and 6 , one end of theflexible support 501 may be attached to theholder 203 of theheat exchangers 202 by ascrew 502, and the other end of theflexible support 501 may be attached to the inside surface of theframe 201 by screw 503. Specifically, each corners theheat exchangers 202 are attached to the inside surface of theframe 201 via a pair of theflexible supports 501 so that theheat exchangers 202 are supported flexibly by theflexible supports 501 with respect to therigid frame 201. - As a result, the liquid cooled rack with compliant heat exchanger support structure allows the
heat exchangers 202 to rotate/swivel and absorb displacement of theframe 201 transmitted from theframe 201 due to an earthquake, allowing theheat exchangers 202 to maintain the spatial geometry and envelope during the earthquake. - In one or more embodiments, both ends of the flexible supports may be attached by adhesives, bonding, or any other methods known in the art as long as the
heat exchangers 202 are flexibly supported by theflexible supports 501 with respect to therigid frame 201 as explained above. Also, one skilled in the art will appreciate that any other the positions, the numbers, the sizes, and the shapes of theflexible supports 501 could be used as long as theheat exchangers 202 are flexibly supported within therack 200 as explained above. - One or more embodiments of the present invention may have one or more of the following advantages. The liquid cooled rack with compliant heat exchanger support structure allows the heat exchangers to rotate/swivel and absorb the rack's frame displacement transmitted from the frame due to an earthquake, allowing the heat exchangers to maintain the spatial geometry and envelope during the earthquake. Further, the liquid cooled rack with compliant heat exchanger support structure prevents the flexure of the heat exchangers from exceeding the allowed flexure resulting in mechanical failure and or a leakage of the coolant.
- While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments can be advised which do not depart from the scope of the invention as described therein Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (9)
1. A liquid cooled rack with compliant heat exchanger support structure, comprising:
a rack comprising a rigid frame for supporting electronic components therein;
a plurality of flexible supports connected to the rigid frame; and
a liquid-fed heat exchanger mounted within the rack via the plurality of flexible supports;
wherein the plurality of flexible supports are connected to the heat exchanger and configured to flexibly support the liquid-fed heat exchanger with respect to the rigid frame.
2. The liquid cooled rack of claim 1 , wherein the plurality of flexible supports are connected to the heat exchanger at corners thereof.
3. The liquid cooled rack of claim 1 , wherein the plurality of flexible supports comprise a plurality of springs.
4. The liquid cooled rack of claim 1 , wherein the plurality of flexible supports comprise a plurality of flexible plates.
5. The liquid cooled rack of claim 1 , wherein the plurality of flexible supports comprise a plurality of flexible rods.
6. The liquid cooled rack of claim 1 , wherein the plurality of flexible supports comprise a plurality of flexible rods.
7. The liquid cooled rack of claim 1 , further comprising: a plurality of heat exchangers mounted within the rack via the plurality of flexible supports.
8. The liquid cooled rack of claim 1 , further comprising fans mounted within the rack for propagating air across the heat exchangers through the rack to cool electronic components mounted therein.
9. The liquid cooled rack of claim 1 , further comprising an overhead pipe system for delivering liquid coolant to the heat exchangers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US12/208,744 US20100059201A1 (en) | 2008-09-11 | 2008-09-11 | Liquid cooled rack with compliant heat exchanger support structure |
Applications Claiming Priority (1)
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US12/208,744 US20100059201A1 (en) | 2008-09-11 | 2008-09-11 | Liquid cooled rack with compliant heat exchanger support structure |
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US20100059201A1 true US20100059201A1 (en) | 2010-03-11 |
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ID=41798198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/208,744 Abandoned US20100059201A1 (en) | 2008-09-11 | 2008-09-11 | Liquid cooled rack with compliant heat exchanger support structure |
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US (1) | US20100059201A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8787013B1 (en) | 2011-09-19 | 2014-07-22 | Amazon Technologies, Inc. | Carrier with adjustable heat removal elements |
CN105723176A (en) * | 2013-08-29 | 2016-06-29 | 林德股份公司 | Method for producing a plate heat exchanger with multiple heat exchanger blocks connected by solder-coated supports |
EP3089571A4 (en) * | 2013-12-25 | 2017-07-26 | NEC Platforms, Ltd. | Cooling system and electronic apparatus |
US10157814B1 (en) | 2017-06-27 | 2018-12-18 | International Business Machines Corporation | Compliant heat sink |
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US804884A (en) * | 1905-03-13 | 1905-11-21 | William L Rutan | Machine-support. |
US2173342A (en) * | 1938-11-16 | 1939-09-19 | Rosenzweig Siegfried | Vibration isolation unit |
US4190738A (en) * | 1978-02-06 | 1980-02-26 | Samuels George A | Modular furniture structure |
US5653070A (en) * | 1996-01-24 | 1997-08-05 | Seguin; Serge | Self-stabilizing system for rack-mounting equipment |
US20030147216A1 (en) * | 2002-02-06 | 2003-08-07 | Patel Chandrakant D. | Method, apparatus, and system for cooling electronic components |
US7298617B2 (en) * | 2005-10-25 | 2007-11-20 | International Business Machines Corporation | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled |
US7450385B1 (en) * | 2007-06-15 | 2008-11-11 | International Business Machines Corporation | Liquid-based cooling apparatus for an electronics rack |
-
2008
- 2008-09-11 US US12/208,744 patent/US20100059201A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US804884A (en) * | 1905-03-13 | 1905-11-21 | William L Rutan | Machine-support. |
US2173342A (en) * | 1938-11-16 | 1939-09-19 | Rosenzweig Siegfried | Vibration isolation unit |
US4190738A (en) * | 1978-02-06 | 1980-02-26 | Samuels George A | Modular furniture structure |
US5653070A (en) * | 1996-01-24 | 1997-08-05 | Seguin; Serge | Self-stabilizing system for rack-mounting equipment |
US20030147216A1 (en) * | 2002-02-06 | 2003-08-07 | Patel Chandrakant D. | Method, apparatus, and system for cooling electronic components |
US7298617B2 (en) * | 2005-10-25 | 2007-11-20 | International Business Machines Corporation | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled |
US7450385B1 (en) * | 2007-06-15 | 2008-11-11 | International Business Machines Corporation | Liquid-based cooling apparatus for an electronics rack |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8787013B1 (en) | 2011-09-19 | 2014-07-22 | Amazon Technologies, Inc. | Carrier with adjustable heat removal elements |
US9720461B2 (en) | 2011-09-19 | 2017-08-01 | Amazon Technologies, Inc. | Carrier with adjustable heat removal elements |
CN105723176A (en) * | 2013-08-29 | 2016-06-29 | 林德股份公司 | Method for producing a plate heat exchanger with multiple heat exchanger blocks connected by solder-coated supports |
EP3089571A4 (en) * | 2013-12-25 | 2017-07-26 | NEC Platforms, Ltd. | Cooling system and electronic apparatus |
US10408545B2 (en) | 2013-12-25 | 2019-09-10 | Nec Platforms, Ltd. | Cooling system and electronic equipment |
US10157814B1 (en) | 2017-06-27 | 2018-12-18 | International Business Machines Corporation | Compliant heat sink |
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Legal Events
Date | Code | Title | Description |
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AS | Assignment |
Owner name: SUN MICROSYSTEMS, INC.,CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MASTO, ANDREW R.;VOGEL, MARLIN R.;COPELAND, DAVID W.;REEL/FRAME:021551/0374 Effective date: 20080905 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |