TWI347862B - Method of dispensing paste using paste dispenser and pneumatic supply apparatus used therefor - Google Patents
Method of dispensing paste using paste dispenser and pneumatic supply apparatus used thereforInfo
- Publication number
- TWI347862B TWI347862B TW097126076A TW97126076A TWI347862B TW I347862 B TWI347862 B TW I347862B TW 097126076 A TW097126076 A TW 097126076A TW 97126076 A TW97126076 A TW 97126076A TW I347862 B TWI347862 B TW I347862B
- Authority
- TW
- Taiwan
- Prior art keywords
- paste
- supply apparatus
- apparatus used
- used therefor
- pneumatic supply
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080008666A KR100860880B1 (ko) | 2008-01-28 | 2008-01-28 | 페이스트 디스펜서의 페이스트 도포 방법 및 이에 사용되는공기압 공급장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200932378A TW200932378A (en) | 2009-08-01 |
TWI347862B true TWI347862B (en) | 2011-09-01 |
Family
ID=40023890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097126076A TWI347862B (en) | 2008-01-28 | 2008-07-10 | Method of dispensing paste using paste dispenser and pneumatic supply apparatus used therefor |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2009172571A (zh) |
KR (1) | KR100860880B1 (zh) |
CN (1) | CN101318405B (zh) |
TW (1) | TWI347862B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI644734B (zh) * | 2016-05-28 | 2018-12-21 | 鴻海精密工業股份有限公司 | 灌膠機 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101089748B1 (ko) * | 2009-10-19 | 2011-12-07 | 에이피시스템 주식회사 | 도포장치의 제어 방법 |
KR101176990B1 (ko) * | 2009-11-18 | 2012-08-24 | 주식회사 탑 엔지니어링 | 디스펜서의 디스펜싱 조건 설정방법 및 그에 따른 디스펜서 |
KR101661289B1 (ko) * | 2009-12-17 | 2016-09-30 | 에이피시스템 주식회사 | 도포장치 및 그 동작방법 |
JP5477822B2 (ja) * | 2011-06-20 | 2014-04-23 | アルファーデザイン株式会社 | 基板遮蔽層形成方法及び装置及びプログラム |
CN103182840B (zh) * | 2011-12-29 | 2015-01-28 | 上海富奇凡机电科技有限公司 | 微注射器式多喷头三维打印机 |
JP6006509B2 (ja) | 2012-03-08 | 2016-10-12 | 武蔵エンジニアリング株式会社 | 液体定量吐出装置および塗布装置 |
KR20160149347A (ko) | 2015-06-17 | 2016-12-28 | 에이피시스템 주식회사 | 도포 방법 및 도포 장치 |
CN105903651B (zh) * | 2016-06-30 | 2019-08-27 | 京东方科技集团股份有限公司 | 一种封框胶涂布方法及装置 |
CN108146068B (zh) * | 2016-12-05 | 2021-07-06 | 塔工程有限公司 | 喷墨型液体涂布模块及其除气方法 |
KR20190011481A (ko) * | 2017-07-25 | 2019-02-07 | 세메스 주식회사 | 박막 형성 방법 및 박막 형성 장치 |
US11814291B2 (en) * | 2018-12-21 | 2023-11-14 | Uti Limited Partnership | Nanomaterials, nanocomposite materials, and methods thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2519358B2 (ja) * | 1991-07-12 | 1996-07-31 | 日立テクノエンジニアリング株式会社 | ペ−スト塗布機 |
JP3260511B2 (ja) * | 1993-09-13 | 2002-02-25 | 株式会社日立製作所 | シール剤描画方法 |
JP4116132B2 (ja) * | 1998-02-19 | 2008-07-09 | 株式会社東芝 | 液体塗布装置及び塗布体の製造方法 |
JP3769261B2 (ja) * | 2001-12-19 | 2006-04-19 | 松下電器産業株式会社 | ディスプレイパネルのパターン形成方法及び形成装置 |
JP2005218971A (ja) * | 2004-02-06 | 2005-08-18 | Hitachi Industries Co Ltd | ペースト塗布機と塗布方法 |
JP5142477B2 (ja) * | 2006-03-30 | 2013-02-13 | 芝浦メカトロニクス株式会社 | ペースト塗布装置及びペースト塗布方法 |
-
2008
- 2008-01-28 KR KR1020080008666A patent/KR100860880B1/ko active IP Right Grant
- 2008-07-08 JP JP2008178060A patent/JP2009172571A/ja active Pending
- 2008-07-10 TW TW097126076A patent/TWI347862B/zh not_active IP Right Cessation
- 2008-07-10 CN CN2008101268854A patent/CN101318405B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI644734B (zh) * | 2016-05-28 | 2018-12-21 | 鴻海精密工業股份有限公司 | 灌膠機 |
Also Published As
Publication number | Publication date |
---|---|
CN101318405A (zh) | 2008-12-10 |
TW200932378A (en) | 2009-08-01 |
KR100860880B1 (ko) | 2008-09-29 |
CN101318405B (zh) | 2011-04-13 |
JP2009172571A (ja) | 2009-08-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |