TWI346592B - Laser processing apparatus - Google Patents
Laser processing apparatusInfo
- Publication number
- TWI346592B TWI346592B TW097142601A TW97142601A TWI346592B TW I346592 B TWI346592 B TW I346592B TW 097142601 A TW097142601 A TW 097142601A TW 97142601 A TW97142601 A TW 97142601A TW I346592 B TWI346592 B TW I346592B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing apparatus
- laser processing
- laser
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Optical Elements Other Than Lenses (AREA)
- Lenses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007301632A JP4401410B2 (ja) | 2007-11-21 | 2007-11-21 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200927348A TW200927348A (en) | 2009-07-01 |
TWI346592B true TWI346592B (en) | 2011-08-11 |
Family
ID=40724126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097142601A TWI346592B (en) | 2007-11-21 | 2008-11-05 | Laser processing apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4401410B2 (zh) |
KR (1) | KR100955150B1 (zh) |
CN (1) | CN101439442B (zh) |
TW (1) | TWI346592B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI618591B (zh) * | 2012-09-17 | 2018-03-21 | 三星顯示器有限公司 | 雷射處理設備 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011066300A (ja) * | 2009-09-18 | 2011-03-31 | Shimadzu Corp | レーザ共振器 |
CN102211250A (zh) * | 2010-04-08 | 2011-10-12 | 深圳市大族激光科技股份有限公司 | 一种激光加工方法及系统 |
JP2013188785A (ja) * | 2012-03-15 | 2013-09-26 | Mitsuboshi Diamond Industrial Co Ltd | 被加工物の加工方法および分割方法 |
JP5885173B2 (ja) | 2012-06-15 | 2016-03-15 | 三菱電機株式会社 | レーザ加工装置 |
WO2014174659A1 (ja) * | 2013-04-26 | 2014-10-30 | 三菱電機株式会社 | 曲率制御装置およびレーザ加工機 |
JP6299111B2 (ja) * | 2013-08-28 | 2018-03-28 | オムロン株式会社 | レーザ加工装置 |
JP6218770B2 (ja) * | 2014-06-23 | 2017-10-25 | 三菱電機株式会社 | レーザ加工装置 |
JP5902281B2 (ja) * | 2014-11-19 | 2016-04-13 | 三星ダイヤモンド工業株式会社 | レーザー加工装置 |
JP6395681B2 (ja) * | 2015-08-28 | 2018-09-26 | 三菱電機株式会社 | レーザ加工装置 |
WO2018110191A1 (ja) * | 2016-12-16 | 2018-06-21 | 三菱電機株式会社 | 形状可変鏡及びレーザ加工装置 |
CN112025088B (zh) * | 2020-08-06 | 2022-04-15 | 武汉华工激光工程有限责任公司 | 一种激光光束像散补偿方法及激光加工系统 |
CN114945301A (zh) * | 2021-03-24 | 2022-08-26 | 深圳汝原科技有限公司 | 辐射源、干燥设备和反光座 |
CN113231734B (zh) * | 2021-04-23 | 2024-06-04 | 大族激光科技产业集团股份有限公司 | 激光光路校准方法、装置、存储介质和激光切割机 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000084689A (ja) * | 1998-07-16 | 2000-03-28 | Amada Eng Center Co Ltd | レーザ加工装置 |
JP3479878B2 (ja) | 2000-03-27 | 2003-12-15 | 住友重機械工業株式会社 | レーザ加工方法及び加工装置 |
TWI275439B (en) * | 2003-05-19 | 2007-03-11 | Mitsubishi Electric Corp | Laser processing apparatus |
JP2005103630A (ja) * | 2003-10-02 | 2005-04-21 | Matsushita Electric Ind Co Ltd | レーザ加工装置及びレーザ加工方法 |
JP4184288B2 (ja) * | 2004-01-20 | 2008-11-19 | 日立ビアメカニクス株式会社 | レーザ加工機 |
JP4544904B2 (ja) * | 2004-04-28 | 2010-09-15 | オリンパス株式会社 | 光学系 |
CN1777489B (zh) * | 2004-06-01 | 2010-05-05 | 三菱电机株式会社 | 激光加工装置 |
KR20060037568A (ko) * | 2004-10-28 | 2006-05-03 | 주식회사 이오테크닉스 | 듀얼 빔 레이저 가공 시스템 |
TWI382795B (zh) * | 2005-03-04 | 2013-01-11 | Hitachi Via Mechanics Ltd | A method of opening a printed circuit board and an opening device for a printed circuit board |
JP4552848B2 (ja) * | 2005-12-23 | 2010-09-29 | 三菱電機株式会社 | 形状可変鏡及び形状可変鏡を用いるレーザ加工装置 |
KR100819616B1 (ko) * | 2006-03-13 | 2008-04-04 | 미쓰비시덴키 가부시키가이샤 | 레이저 가공 장치 |
-
2007
- 2007-11-21 JP JP2007301632A patent/JP4401410B2/ja active Active
-
2008
- 2008-11-05 TW TW097142601A patent/TWI346592B/zh active
- 2008-11-20 KR KR1020080115666A patent/KR100955150B1/ko active IP Right Grant
- 2008-11-21 CN CN2008101775454A patent/CN101439442B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI618591B (zh) * | 2012-09-17 | 2018-03-21 | 三星顯示器有限公司 | 雷射處理設備 |
Also Published As
Publication number | Publication date |
---|---|
TW200927348A (en) | 2009-07-01 |
CN101439442B (zh) | 2012-03-21 |
JP4401410B2 (ja) | 2010-01-20 |
KR100955150B1 (ko) | 2010-04-28 |
CN101439442A (zh) | 2009-05-27 |
KR20090052818A (ko) | 2009-05-26 |
JP2009125761A (ja) | 2009-06-11 |
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