TWI346394B - Light-emitting diode and semiconductor light-emitting device - Google Patents

Light-emitting diode and semiconductor light-emitting device

Info

Publication number
TWI346394B
TWI346394B TW093133220A TW93133220A TWI346394B TW I346394 B TWI346394 B TW I346394B TW 093133220 A TW093133220 A TW 093133220A TW 93133220 A TW93133220 A TW 93133220A TW I346394 B TWI346394 B TW I346394B
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
emitting device
emitting
semiconductor light
Prior art date
Application number
TW093133220A
Other languages
Chinese (zh)
Other versions
TW200520268A (en
Inventor
Hirohisa Saito
Yoshiyuki Hirose
Youichi Nagai
Hiroyuki Kitabayashi
Ayako Ikeda
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200520268A publication Critical patent/TW200520268A/en
Application granted granted Critical
Publication of TWI346394B publication Critical patent/TWI346394B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0045—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide
    • G02B6/0046—Tapered light guide, e.g. wedge-shaped light guide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
TW093133220A 2003-11-20 2004-11-01 Light-emitting diode and semiconductor light-emitting device TWI346394B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003390882A JP2005158795A (en) 2003-11-20 2003-11-20 Light-emitting diode and semiconductor light-emitting device

Publications (2)

Publication Number Publication Date
TW200520268A TW200520268A (en) 2005-06-16
TWI346394B true TWI346394B (en) 2011-08-01

Family

ID=34431599

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133220A TWI346394B (en) 2003-11-20 2004-11-01 Light-emitting diode and semiconductor light-emitting device

Country Status (6)

Country Link
US (1) US20050110032A1 (en)
EP (1) EP1533851A3 (en)
JP (1) JP2005158795A (en)
KR (1) KR20050049390A (en)
CN (1) CN100438091C (en)
TW (1) TWI346394B (en)

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US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
KR101719655B1 (en) 2010-09-29 2017-03-24 서울반도체 주식회사 Phosphor sheet, light-emitting device having the phosphor sheet and method of manufacturing the same
CN102969427A (en) * 2011-08-31 2013-03-13 华夏光股份有限公司 Semiconductor light-emitting device and manufacturing method thereof
EP2892306B9 (en) * 2012-08-31 2021-08-25 Citizen Electronics Co., Ltd. Illumination method and light emitting device
TWI506813B (en) * 2013-04-09 2015-11-01 Unity Opto Technology Co Ltd Single crystal dual light source light emitting element
KR101457036B1 (en) * 2013-06-04 2014-10-31 고려대학교 산학협력단 Light emitting diode and manufacturing method of the same
US20160218260A1 (en) * 2013-09-10 2016-07-28 Philips Lighting Holding B.V. A light emitting device
EP2854186A1 (en) * 2013-09-26 2015-04-01 Seoul Semiconductor Co., Ltd. Light source module, fabrication method therefor, and backlight unit including the same
US10401556B2 (en) * 2013-09-30 2019-09-03 Seoul Semiconductor Co., Ltd. Light source module and backlight unit having the same
JP6299176B2 (en) * 2013-11-22 2018-03-28 日亜化学工業株式会社 LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LIGHTING DEVICE EQUIPPED WITH THE LIGHT EMITTING DEVICE
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JP6749240B2 (en) 2014-01-09 2020-09-02 ルミレッズ ホールディング ベーフェー Light emitting device with reflective sidewalls
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CN105529386B (en) * 2016-01-20 2018-05-22 华灿光电股份有限公司 A kind of light-emitting diode chip for backlight unit and preparation method thereof
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CN106449619B (en) * 2016-09-09 2019-06-11 华灿光电（浙江）有限公司 A kind of light-emitting diode chip for backlight unit and preparation method thereof
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CN110289254A (en) * 2019-06-27 2019-09-27 京东方科技集团股份有限公司 It is micro-led and preparation method thereof
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Also Published As

Publication number Publication date
CN1619849A (en) 2005-05-25
JP2005158795A (en) 2005-06-16
EP1533851A2 (en) 2005-05-25
TW200520268A (en) 2005-06-16
KR20050049390A (en) 2005-05-25
EP1533851A3 (en) 2010-05-26
CN100438091C (en) 2008-11-26
US20050110032A1 (en) 2005-05-26

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees