TW200520268A - Light-emitting diode and semiconductor light-emitting device - Google Patents

Light-emitting diode and semiconductor light-emitting device

Info

Publication number
TW200520268A
TW200520268A TW093133220A TW93133220A TW200520268A TW 200520268 A TW200520268 A TW 200520268A TW 093133220 A TW093133220 A TW 093133220A TW 93133220 A TW93133220 A TW 93133220A TW 200520268 A TW200520268 A TW 200520268A
Authority
TW
Taiwan
Prior art keywords
light
optically reflective
laminate
phosphorescent plate
reflective film
Prior art date
Application number
TW093133220A
Other languages
Chinese (zh)
Other versions
TWI346394B (en
Inventor
Hirohisa Saito
Yoshiyuki Hirose
Youichi Nagai
Hiroyuki Kitabayashi
Ayako Ikeda
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200520268A publication Critical patent/TW200520268A/en
Application granted granted Critical
Publication of TWI346394B publication Critical patent/TWI346394B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033Means for improving the coupling-out of light from the light guide
    • G02B6/0035Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0045Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide
    • G02B6/0046Tapered light guide, e.g. wedge-shaped light guide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46Reflective coating, e.g. dielectric Bragg reflector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)

Abstract

A light-emitting diode ( 1 ) is furnished with a semiconductor laminate ( 6 ), optically reflective layers ( 17 ) and ( 19 ), an optically reflective film ( 25 ), and a phosphorescent plate ( 27 ). The laminate ( 6 ) is formed by an n-type cladding layer ( 9 ), an active layer ( 11 ), a p-type cladding layer ( 13 ), and a p-type contact layer ( 15 ), laminated in order onto a substrate ( 7 ). The optically reflective layers ( 17 ) and ( 19 ) are provided respectively on the p-type contact layer ( 15 ) and on the back side ( 7 b) of the substrate ( 7 ). The optically reflective film ( 25 ) is provided on the three side surfaces of the laminate ( 6 ). The phosphorescent plate ( 27 ) is mounted on a side face among the side faces of the laminate ( 6 ), on which there is no optically reflective film ( 25 ). Blue light (L 1 ) outputted from the active layer ( 11 ) is reflected on each of the optically reflective layers, and is gathered on the side face on which the phosphorescent plate ( 27 ) is provided. A portion of the blue light (L 1) turns into yellow light (L 2) in the phosphorescent plate ( 27 ), and white light derived from the blue light (L 1) and yellow light (L 2 ) is emitted.
TW093133220A 2003-11-20 2004-11-01 Light-emitting diode and semiconductor light-emitting device TWI346394B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003390882A JP2005158795A (en) 2003-11-20 2003-11-20 Light-emitting diode and semiconductor light-emitting device

Publications (2)

Publication Number Publication Date
TW200520268A true TW200520268A (en) 2005-06-16
TWI346394B TWI346394B (en) 2011-08-01

Family

ID=34431599

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133220A TWI346394B (en) 2003-11-20 2004-11-01 Light-emitting diode and semiconductor light-emitting device

Country Status (6)

Country Link
US (1) US20050110032A1 (en)
EP (1) EP1533851A3 (en)
JP (1) JP2005158795A (en)
KR (1) KR20050049390A (en)
CN (1) CN100438091C (en)
TW (1) TWI346394B (en)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070267646A1 (en) * 2004-06-03 2007-11-22 Philips Lumileds Lighting Company, Llc Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic
US20070029555A1 (en) * 2005-08-04 2007-02-08 Lester Steven D Edge-emitting LED light source
KR20070017030A (en) * 2005-08-04 2007-02-08 아바고 테크놀로지스 이씨비유 아이피 (싱가포르) 피티이 리미티드 Edge-emitting led light source
KR20070049322A (en) * 2005-11-08 2007-05-11 엘지이노텍 주식회사 Back-light assembly and liquid crystal display device with the same
CN101395728B (en) * 2006-03-10 2011-04-13 松下电工株式会社 Light-emitting device and its manufacture method
US7521727B2 (en) * 2006-04-26 2009-04-21 Rohm And Haas Company Light emitting device having improved light extraction efficiency and method of making same
US7955531B1 (en) 2006-04-26 2011-06-07 Rohm And Haas Electronic Materials Llc Patterned light extraction sheet and method of making same
US7626210B2 (en) * 2006-06-09 2009-12-01 Philips Lumileds Lighting Company, Llc Low profile side emitting LED
US8080828B2 (en) 2006-06-09 2011-12-20 Philips Lumileds Lighting Company, Llc Low profile side emitting LED with window layer and phosphor layer
WO2008011724A1 (en) * 2006-07-28 2008-01-31 Tir Techonology Lp Light source comprising edge emitting elements
TWI460881B (en) 2006-12-11 2014-11-11 Univ California Transparent light emitting diodes
KR100849887B1 (en) * 2007-02-08 2008-08-04 주식회사 파워라이텍 The struction of white led chip
DE102007019776A1 (en) 2007-04-26 2008-10-30 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing a plurality of optoelectronic components
TWI345318B (en) * 2007-07-20 2011-07-11 Chimei Innolux Corp Light emitting diode
CN101378103A (en) 2007-08-28 2009-03-04 富士迈半导体精密工业(上海)有限公司 White light light-emitting device and manufacturing method thereof
RU2489775C2 (en) * 2007-11-20 2013-08-10 Конинклейке Филипс Электроникс Н.В. Side light-emitting device with wavelength conversion
CN101897040B (en) * 2007-12-11 2013-06-12 皇家飞利浦电子股份有限公司 Side emitting device with hybrid top reflector
KR100936001B1 (en) * 2007-12-17 2010-01-08 삼성전기주식회사 Nitride semiconductor light emitting device and manufacturing method thereof
CN101911318A (en) * 2007-12-28 2010-12-08 3M创新有限公司 The down-converted light source of uniform wavelength emission
US20110156002A1 (en) * 2008-09-04 2011-06-30 Leatherdale Catherine A Light source having light blocking components
US7741134B2 (en) * 2008-09-15 2010-06-22 Bridgelux, Inc. Inverted LED structure with improved light extraction
KR101007117B1 (en) 2008-10-16 2011-01-11 엘지이노텍 주식회사 Semiconductor light emitting device and fabrication method thereof
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
KR101719655B1 (en) 2010-09-29 2017-03-24 서울반도체 주식회사 Phosphor sheet, light-emitting device having the phosphor sheet and method of manufacturing the same
CN102969427A (en) * 2011-08-31 2013-03-13 华夏光股份有限公司 Semiconductor light-emitting device and manufacturing method thereof
WO2014034228A1 (en) * 2012-08-31 2014-03-06 三菱化学株式会社 Illumination method and light emitting device
TWI506813B (en) * 2013-04-09 2015-11-01 Unity Opto Technology Co Ltd Single crystal dual light source light emitting element
KR101457036B1 (en) * 2013-06-04 2014-10-31 고려대학교 산학협력단 Light emitting diode and manufacturing method of the same
CN105556202A (en) * 2013-09-10 2016-05-04 飞利浦照明控股有限公司 A light emitting device
EP2854186A1 (en) * 2013-09-26 2015-04-01 Seoul Semiconductor Co., Ltd. Light source module, fabrication method therefor, and backlight unit including the same
US10401556B2 (en) * 2013-09-30 2019-09-03 Seoul Semiconductor Co., Ltd. Light source module and backlight unit having the same
JP6299176B2 (en) * 2013-11-22 2018-03-28 日亜化学工業株式会社 LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LIGHTING DEVICE EQUIPPED WITH THE LIGHT EMITTING DEVICE
WO2015080416A1 (en) * 2013-11-28 2015-06-04 순천대학교 산학협력단 Side-emitting light emitting diode, surface light source, and method for manufacturing same
KR101539994B1 (en) * 2013-11-28 2015-07-30 순천대학교 산학협력단 Edge light emitting diode and method of fabricating the same
EP3092664B1 (en) 2014-01-09 2019-08-14 Lumileds Holding B.V. Light emitting device with reflective sidewall
EP2947484B1 (en) * 2014-05-14 2017-04-05 Philips Lighting Holding B.V. A light emitting device
TWI641285B (en) 2014-07-14 2018-11-11 新世紀光電股份有限公司 Light emitting module and method for manufacturing light emitting unit
DE102014110071A1 (en) * 2014-07-17 2016-01-21 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
JP6520373B2 (en) * 2015-05-14 2019-05-29 日亜化学工業株式会社 Light emitting element
CN106549094B (en) * 2015-09-18 2020-03-10 新世纪光电股份有限公司 Light emitting device package structure
JP2017098398A (en) * 2015-11-24 2017-06-01 豊田合成株式会社 Light-emitting device and lighting device
CN105529386B (en) * 2016-01-20 2018-05-22 华灿光电股份有限公司 A kind of light-emitting diode chip for backlight unit and preparation method thereof
CN205944139U (en) 2016-03-30 2017-02-08 首尔伟傲世有限公司 Ultraviolet ray light -emitting diode spare and contain this emitting diode module
CN106449619B (en) * 2016-09-09 2019-06-11 华灿光电(浙江)有限公司 A kind of light-emitting diode chip for backlight unit and preparation method thereof
DE102016118030A1 (en) * 2016-09-23 2018-03-29 Osram Opto Semiconductors Gmbh RADIATION-EMITTING SEMICONDUCTOR COMPONENT
KR101672878B1 (en) * 2016-10-04 2016-11-07 주식회사 세미콘라이트 Semiconductor light emitting diode
JP6925694B2 (en) * 2017-04-12 2021-08-25 シチズン電子株式会社 Light emitting device
KR102432217B1 (en) * 2017-11-07 2022-08-12 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package and lighting apparatus
US10651351B1 (en) 2018-11-13 2020-05-12 Cree, Inc. Light emitting diode packages
JP6876274B2 (en) 2018-11-14 2021-05-26 日亜化学工業株式会社 Light emitting element, light emitting device and manufacturing method of light emitting element
DE102018132651A1 (en) * 2018-12-18 2020-06-18 Osram Opto Semiconductors Gmbh OPTOELECTRONIC SEMICONDUCTOR COMPONENT
CN110289254A (en) 2019-06-27 2019-09-27 京东方科技集团股份有限公司 It is micro-led and preparation method thereof
JP7037080B2 (en) * 2019-08-07 2022-03-16 日亜化学工業株式会社 Light emitting element
JP7361257B2 (en) 2019-09-27 2023-10-16 日亜化学工業株式会社 light emitting device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1267716A (en) * 1984-02-23 1990-04-10 Frederick W. Scholl Edge-emitting light emitting diode
GB2295265B (en) * 1994-11-18 1998-04-29 Northern Telecom Ltd Injection laser assembly incorporating a monitor photosensor
US5625635A (en) * 1994-11-28 1997-04-29 Sandia Corporation Infrared emitting device and method
JP2900928B2 (en) * 1997-10-20 1999-06-02 日亜化学工業株式会社 Light emitting diode
US5952681A (en) * 1997-11-24 1999-09-14 Chen; Hsing Light emitting diode emitting red, green and blue light
TW413956B (en) * 1998-07-28 2000-12-01 Sumitomo Electric Industries Fluorescent substrate LED
US6417523B1 (en) * 1999-01-19 2002-07-09 Texas Instruments Incorporated Organic edge emitting diode with light guide and pixel isolation
TW500962B (en) * 1999-11-26 2002-09-01 Sanyo Electric Co Surface light source and method for adjusting its hue
JP2002076432A (en) * 2000-08-30 2002-03-15 Stanley Electric Co Ltd Edge-light emitting semiconductor device, its manufacturing method and free-space optical transmitter
US6650044B1 (en) * 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
US6930737B2 (en) * 2001-01-16 2005-08-16 Visteon Global Technologies, Inc. LED backlighting system
MY145695A (en) * 2001-01-24 2012-03-30 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
JP2002335015A (en) * 2001-05-09 2002-11-22 Rohm Co Ltd Semiconductor light emitting element
WO2002093535A1 (en) * 2001-05-14 2002-11-21 Nichia Corporation Light emitting device and vehicle display device
US6949395B2 (en) * 2001-10-22 2005-09-27 Oriol, Inc. Method of making diode having reflective layer
TW513821B (en) * 2002-02-01 2002-12-11 Hsiu-Hen Chang Electrode structure of LED and manufacturing the same
JP3946062B2 (en) * 2002-03-18 2007-07-18 シャープ株式会社 Display device and manufacturing method thereof
TW569479B (en) * 2002-12-20 2004-01-01 Ind Tech Res Inst White-light LED applying omnidirectional reflector
US7635874B2 (en) * 2005-09-26 2009-12-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Edge-emitting LED assembly

Also Published As

Publication number Publication date
KR20050049390A (en) 2005-05-25
CN1619849A (en) 2005-05-25
EP1533851A3 (en) 2010-05-26
JP2005158795A (en) 2005-06-16
US20050110032A1 (en) 2005-05-26
CN100438091C (en) 2008-11-26
TWI346394B (en) 2011-08-01
EP1533851A2 (en) 2005-05-25

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