TWI345316B - - Google Patents
Download PDFInfo
- Publication number
- TWI345316B TWI345316B TW95125705A TW95125705A TWI345316B TW I345316 B TWI345316 B TW I345316B TW 95125705 A TW95125705 A TW 95125705A TW 95125705 A TW95125705 A TW 95125705A TW I345316 B TWI345316 B TW I345316B
- Authority
- TW
- Taiwan
- Prior art keywords
- led element
- led
- substrate
- mounting
- metal
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 99
- 229910052751 metal Inorganic materials 0.000 claims description 99
- 239000000758 substrate Substances 0.000 claims description 92
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- 230000017525 heat dissipation Effects 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 25
- 239000012780 transparent material Substances 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 11
- 239000007789 gas Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- 239000004417 polycarbonate Substances 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 4
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 claims 4
- 230000020169 heat generation Effects 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 description 8
- 239000011888 foil Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008635 plant growth Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005352112A JP2007158086A (ja) | 2005-12-06 | 2005-12-06 | Ｌｅｄ素子の実装金属基板の形状及びｌｅｄ素子実装基板。 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200723568A TW200723568A (en) | 2007-06-16 |
| TWI345316B true TWI345316B (enrdf_load_stackoverflow) | 2011-07-11 |
Family
ID=38242040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095125705A TW200723568A (en) | 2005-12-06 | 2006-07-13 | Shape of mounting metal substrate for led element and led element mounting substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007158086A (enrdf_load_stackoverflow) |
| TW (1) | TW200723568A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100888228B1 (ko) * | 2007-06-22 | 2009-03-12 | (주)웨이브닉스이에스피 | 금속베이스 광소자 패키지 모듈 및 그 제조방법 |
| JP5833850B2 (ja) * | 2011-07-08 | 2015-12-16 | シチズン電子株式会社 | 半導体発光装置及びその製造方法 |
-
2005
- 2005-12-06 JP JP2005352112A patent/JP2007158086A/ja active Pending
-
2006
- 2006-07-13 TW TW095125705A patent/TW200723568A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200723568A (en) | 2007-06-16 |
| JP2007158086A (ja) | 2007-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7728231B2 (en) | Light emitting module, lighting device, and display device | |
| TWI313937B (enrdf_load_stackoverflow) | ||
| JP5359734B2 (ja) | 発光装置及びその製造方法 | |
| CN103814450B (zh) | Led模块以及使用它的led灯 | |
| CN101432899B (zh) | 半导体发光组件及其制造方法、半导体发光装置 | |
| JP2014170947A (ja) | 発光装置、照明用光源及び照明装置 | |
| JP2006185967A (ja) | 発光素子収納パッケージ、発光装置および照明装置 | |
| JP3938100B2 (ja) | Ｌｅｄランプおよびｌｅｄ照明具 | |
| JP2012119436A (ja) | Ｌｅｄ線状光源およびバックライト | |
| US20100301365A1 (en) | Light emitting diode module and manufacture method thereof | |
| JP2006332234A (ja) | 反射機能を有するｌｅｄ装置 | |
| TWI345316B (enrdf_load_stackoverflow) | ||
| JP4948818B2 (ja) | 発光装置および照明装置 | |
| JP4557613B2 (ja) | 発光素子収納用パッケージ、発光装置および照明装置 | |
| JP2009021384A (ja) | 電子部品及び発光装置 | |
| JP2009117124A (ja) | 光源ユニット | |
| JP6173794B2 (ja) | 半導体発光装置およびそれを用いた照明装置 | |
| JP4659515B2 (ja) | 発光素子搭載用基板，発光素子収納用パッケージ，発光装置および照明装置 | |
| JP4173527B2 (ja) | 発光素子実装用基板および発光素子モジュール | |
| JP6266135B2 (ja) | 照明装置 | |
| KR20080082295A (ko) | Ｌｅｄ 소자를 금속 기판에 실장하는 방법 및 실장한 금속기판 | |
| TWI289940B (en) | Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board | |
| JP2016012625A (ja) | 発光素子搭載用基板 | |
| CN215933639U (zh) | 发光二极管、灯条及背光模组 | |
| KR101880058B1 (ko) | 발광 소자 패키지 및 조명 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |