TWI340875B - Imprint lithographic apparatus, device manufacturing method and device manufactured thereby - Google Patents

Imprint lithographic apparatus, device manufacturing method and device manufactured thereby

Info

Publication number
TWI340875B
TWI340875B TW094122207A TW94122207A TWI340875B TW I340875 B TWI340875 B TW I340875B TW 094122207 A TW094122207 A TW 094122207A TW 94122207 A TW94122207 A TW 94122207A TW I340875 B TWI340875 B TW I340875B
Authority
TW
Taiwan
Prior art keywords
lithographic apparatus
imprint lithographic
device manufacturing
device manufactured
manufactured
Prior art date
Application number
TW094122207A
Other languages
English (en)
Other versions
TW200613927A (en
Inventor
Berge Peter Ten
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/914,604 external-priority patent/US20060035159A1/en
Priority claimed from US10/964,814 external-priority patent/US7398177B2/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200613927A publication Critical patent/TW200613927A/zh
Application granted granted Critical
Publication of TWI340875B publication Critical patent/TWI340875B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW094122207A 2004-08-10 2005-06-30 Imprint lithographic apparatus, device manufacturing method and device manufactured thereby TWI340875B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/914,604 US20060035159A1 (en) 2004-08-10 2004-08-10 Method of providing alignment marks, method of aligning a substrate, device manufacturing method, computer program, and device
US10/964,814 US7398177B2 (en) 2004-10-15 2004-10-15 Measurement substrate, substrate table, lithographic apparatus, method of calculating an angle of an alignment beam of an alignment system, and alignment verification method

Publications (2)

Publication Number Publication Date
TW200613927A TW200613927A (en) 2006-05-01
TWI340875B true TWI340875B (en) 2011-04-21

Family

ID=35539394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094122207A TWI340875B (en) 2004-08-10 2005-06-30 Imprint lithographic apparatus, device manufacturing method and device manufactured thereby

Country Status (3)

Country Link
US (1) US7927090B2 (zh)
TW (1) TWI340875B (zh)
WO (1) WO2006024908A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI721298B (zh) * 2017-08-07 2021-03-11 荷蘭商Ａｓｍｌ荷蘭公司 度量衡方法及相關之電腦程式產品

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US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
JP5268239B2 (ja) * 2005-10-18 2013-08-21 キヤノン株式会社 パターン形成装置、パターン形成方法
JP4795300B2 (ja) 2006-04-18 2011-10-19 キヤノン株式会社 位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法
JP4958614B2 (ja) 2006-04-18 2012-06-20 キヤノン株式会社 パターン転写装置、インプリント装置、パターン転写方法および位置合わせ装置
US7612882B2 (en) * 2006-10-20 2009-11-03 Hewlett-Packard Development Company, L.P. Optical gratings, lithography tools including such optical gratings and methods for using same for alignment
EP2118706B1 (en) 2007-02-06 2019-09-18 Canon Kabushiki Kaisha Imprint apparatus and process
DE102008048660B4 (de) * 2008-09-22 2015-06-18 Carl Zeiss Sms Gmbh Verfahren und Vorrichtung zur Vermessung von Strukturen auf Photolithographiemasken
JP2010080630A (ja) * 2008-09-25 2010-04-08 Canon Inc 押印装置および物品の製造方法
US8345242B2 (en) * 2008-10-28 2013-01-01 Molecular Imprints, Inc. Optical system for use in stage control
US20100112310A1 (en) * 2008-10-30 2010-05-06 Molecular Imprints, Inc. Substrate Patterning
CN101850625B (zh) * 2009-03-30 2013-06-05 鸿富锦精密工业（深圳）有限公司 制造光学元件的方法
NL2005266A (en) 2009-10-28 2011-05-02 Asml Netherlands Bv Imprint lithography.
WO2011064020A1 (en) * 2009-11-24 2011-06-03 Asml Netherlands B.V. Alignment and imprint lithography
NL2005975A (en) 2010-03-03 2011-09-06 Asml Netherlands Bv Imprint lithography.
NL2006004A (en) * 2010-03-25 2011-09-27 Asml Netherlands Bv Imprint lithography.
NL2006454A (en) 2010-05-03 2011-11-07 Asml Netherlands Bv Imprint lithography method and apparatus.
NL2006747A (en) * 2010-07-26 2012-01-30 Asml Netherlands Bv Imprint lithography alignment method and apparatus.
WO2012016744A1 (en) 2010-08-05 2012-02-09 Asml Netherlands B.V. Imprint lithography
JP2013041947A (ja) * 2011-08-12 2013-02-28 Canon Inc リソグラフィ装置及び物品の製造方法
JP5535164B2 (ja) * 2011-09-22 2014-07-02 株式会社東芝 インプリント方法およびインプリント装置
US9237261B2 (en) * 2012-01-22 2016-01-12 Nikon Corporation Apparatus and method for improving contrast detected in a fringe projection autofocus system
CN103713477B (zh) * 2012-09-28 2015-11-25 无锡华润上华半导体有限公司 双面光刻机的对位结构及对位方法
US9074873B1 (en) * 2013-01-31 2015-07-07 Kla-Tencor Corporation Measurement of thickness variation and shape of wafers
JP2014220263A (ja) * 2013-04-30 2014-11-20 キヤノン株式会社 リソグラフィ装置、及び物品の製造方法
KR101750521B1 (ko) 2015-07-27 2017-07-03 주식회사 고영테크놀러지 기판 검사 장치 및 방법
KR102097225B1 (ko) * 2015-09-08 2020-04-03 캐논 가부시끼가이샤 나노임프린트 리소그래피에서의 기재 전처리 및 식각 균일성
JP6971567B2 (ja) * 2016-12-16 2021-11-24 キヤノン株式会社 位置合わせ装置、位置合わせ方法、リソグラフィ装置、および物品製造方法
EP3629086A1 (en) * 2018-09-25 2020-04-01 ASML Netherlands B.V. Method and apparatus for determining a radiation beam intensity profile

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KR20050014795A (ko) * 2002-03-06 2005-02-07 어드밴스드 포토메트릭스, 인크. 복사 인코딩 및 분석을 위한 방법 및 장치
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US7130049B2 (en) * 2003-12-24 2006-10-31 Asml Netherlands B.V. Method of measurement, method for providing alignment marks, and device manufacturing method
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI721298B (zh) * 2017-08-07 2021-03-11 荷蘭商Ａｓｍｌ荷蘭公司 度量衡方法及相關之電腦程式產品

Also Published As

Publication number Publication date
US20070266875A1 (en) 2007-11-22
TW200613927A (en) 2006-05-01
WO2006024908A3 (en) 2006-05-04
WO2006024908A2 (en) 2006-03-09
US7927090B2 (en) 2011-04-19

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