1338958 九、發明說明： 【發明所屬之技術領域】 .本發明係關於一種供電子產品使用的F 1 ash LED 之製造方法，尤指一種在材料的切割過程中利用單 面貼膠的方式，保持其切割後的完整性，以簡化製 程的Flash LED之製造方法。 Φ 【先前技術】 閃光燈是拍照時的輔助工具，係使用時周圍環 境亮度不足的情況下’ 一般傳統相機内建或外加的 閃光燈，通常都是利用振盪電路和變壓器升壓，經 電容器儲存能量，而在瞬間釋放並感應高壓，以激 發惰性氣體發出脈衝光源’但是，由於傳統閃光燈 並無法應用在講求低耗能的電子產品上，因而才有1338958 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for manufacturing an F 1 ash LED for use in an electronic product, and more particularly to a method for maintaining a single-sided adhesive in a material cutting process. Its post-cut integrity to simplify the manufacturing process of Flash LEDs. Φ [Prior Art] The flash is an auxiliary tool for taking pictures. When the brightness of the surrounding environment is insufficient, the flash of the built-in or external camera of the conventional camera is usually boosted by an oscillating circuit and a transformer, and the energy is stored by the capacitor. It releases and induces high voltage in an instant to excite the inert gas to emit a pulsed light source. However, since the conventional flash lamp cannot be applied to electronic products that are low in energy consumption,
Flash LED ( LED 閃光燈）的出現，Flash LED 是一 _ 種低壓閃光燈，其不需振盪電路'升壓變壓器及儲 能電容器’可透過較小的直流電壓、較小的電流， 就激發出高亮度光線’其電路設計簡單、高效、省 電、低成本、體積小，因此，特別適用於手機、數 位相機或PDA等電子產品上。 而Flash LED與一般的表面黏著型（SMT) LEI) 的結構相近似，惟電路設計上略有不同，請參閱「第 1圖」，為習知SMT LED封裝的步驟流程圖，如圖中 所示’其製作流程係包括：第一步驟1〇1，第一次 6 1338958 、佈光阻’在一銅材表面塗佈有一層光阻；第二步 驟1 02 ’第—次曝光顯影，利用曝光顯影方式，以 在銅材表面形成一光罩圖案；第三步驟103,第一 人蝕刻’利用化學蝕刻方式，在銅材表面成型一凹 且未貫穿的第一圖形；第四步驟第一次封 膠，本w 除銅材表面的光阻後，於第一圖形内填入封 膠，以 _ 元成第一階段加工；第五步驟1〇5，翻面及 、、人塗佈光阻’將完成第一階段加工的銅材翻面 塗佈光阻’第六步驟i 06，第二次曝光顯影，利 用暖《ik ,光顯影方式’以在銅材表面形成一對應第一圖 /的光罩圖案；第七步驟107，第二次蝕刻，再度 利 用 化學蝕刻方式，在銅材表面成型為一第二圖 並與第一圖形呈連通；第八步驟1〇8，第二次 封膠 乂 ’同樣地’去除銅材表面的光阻後，於第二圖 形肉 •填入封膠，並與第一圖形内的封膠連成一體， 而形成一晶片座；第九步驟109，晶片座加工，利 用麵刻或CNC加工的方式，在晶片座上成型一個晶 错以供放置發光晶片及利於光反射；第十步驟 11 〇 ’固晶，將發光晶片固定於晶片槽内；第十一步 ^ 111 ’打線’透過金屬線將發光晶片與導電電極 電性連接；第十二步驟11 2，覆晶，最後在晶片座 表面附上一層環氧樹脂層，以完成此SMT LED之封 裝；請在參閱第2圖’為習知SMT LED的立體外觀 圖，， - 如圖中所示，綜上所述，其SMT LED 20係包括 7 1338958 一晶片座201、複數個導電電極2〇2、複數個發光晶 片2 0 3及環氧樹脂層2 0 4 ’且其晶片座2 0 1上係成 , 型有複數個晶片槽2 011 ’供以固設發光晶片2 0 3， ， 並藉由打線將金屬線205打在發光晶片203及兩側 的導電電極202上’最後再以環氧樹脂層2〇4加以 包覆，其封裝製程不但手續繁瑣，而增加其製造成 本’且製作第一圖形與第二圖形需要更高的精密 φ 度’以免造成封裝不良的問題，因此，生產效率不 足’且成品品質也較不易受到控制。 【發明内容】 有鑑於習知SMT LED進行封裝時，其手續繁瑣， 且要求精密度高’容易增加製造成本，而且成品的 品質也不穩定的缺點，因此，本發明人爰精心研究， 並積個人從事該項事業的多年經驗’終設計出—種 • 薪新的 Flash LED之製造方法。 本發明之主要目的，旨在提供一種可簡化封穿 程序，及改善成品品質的F丨ash LED之製造方法。 為達上述目的，本發明Flash LED之製造方法， 其包括； 第一步驟，第一次切割，本發明係利用化學蝕 刻或是沖壓成型的方式，對一第一材料進行第—次 切割’並在化學蝕刻前或是沖壓成型後，於第一材 料單面上貼附一膠布，以保持其第一材料經過切割 8 1338958 後的完整性； 第二步驟，封膠，其第一材料經過切割後，會 在第一材料表面成型有若千縫隙’其縫隙間係呈連 通狀’接著’在縫隙間填入絕緣導熱膠； 第三步驟’貼合，將一第二材料以加熱加壓的 方式，貼合在經過切割的第一材料另一面，以形成 一底座； 第四步驟’第二次切割，以CNC加工的方式在 前述底座上成型有一杯口，其杯口内並成型對應第 一材料的一放置部及複數個導電部； 第五步驟’電鍍，將貼附在第一材料表面的膠 布撕除後’並於前述底座的導電部鍍上一金屬層； 第六步驟，固晶，將至少一個發光晶片固設於 底座杯口中央的放置部上； 第七步驟，打線，利用打線的方式將金屬線打 在發光晶片及兩側電極部上，以使發光晶月與電極 部呈電性連接；以及 第八步驟’覆晶，利用環氧樹脂填滿杯口，以 將發光晶片、金屬線、放置部及電極部包覆於内， 而完成一 F1 ash LED的封奘.π J 5丁衮，綜上所述，與一般表 面黏著型（SMT ) LED的封梦创4 L ，说 J 裒製程相比，係獲得大幅 度的簡化，進而可降低製诰屮士 + 衣k成本，使生產更有效率， 且本發明以膠布固定被切宣，丨 J纠的第一材料，可用來保 持其完整性’因此，也可担古丄、 ^ j知咼成品的品質。 9 1338958 又，本發明所製作的Flash LED，其包括：一底 座複數個發光晶片及—環氧樹脂層，其底座係由 第一材料經過切割後，與第二材料加壓加熱貼合而 製成，並在由第二材料表面以^耽加工成型有一杯 口，而在杯口内的第一材料則對應形成一放置部及 複數個電極部，以將複數個發光晶片固設於放置部 上，再利用打線技術將金屬線打在發光晶片與電極 _ 一間，使發光晶片分別與兩側的電極部呈電性連 接，最後再將環氧樹脂灌注於杯口内，以將發光晶 片、金屬線、放置部及電極部包覆於其内，其結構 相當簡單，與一般的SMT LED幾乎相同，因此，在 減少製作手續的情況下，就可以達到降低製作成本 的目的》 為使貴審查委員能清楚了解本發明之内容，僅 以下列說明搭配圖示，敬請參閱。 【實施方式】 晴參閱「第3圖」，為本發明較佳實施例之立體 外觀圖’如圖中所示，本發明所製作的Flash LED 3 Ο，主要係由—底座3 〇 1、複數個發光晶片3 〇 2及 一環氧樹脂層3 0 3所組成的，其底座3 〇 1又係由兩 不同材料分別經過切割加工，再加壓加熱貼合而 成，貼合後，在底座301表面經過CNC加工以半貫 穿的方式成型有一杯口 3011’其切削的深度係大於 10 表面材料的厚度，其杯口 3011内的下層材料上，對 應形成一放置部3012及複數個電極部3〇13，而可 將複數個發光晶片302固設於放置部3〇12上，再利 用打線技術將金屬線304打在發光晶片3〇2與周圍 的電極部3013間，使發光晶片302分別與周圍的電 極部3013呈電性連接，最後再將環氧樹脂灌注於杯 口 301内，以包覆發光晶片3〇2、金屬線3〇4、放置 部3012及電極部3013，而在杯口 3〇11内形成一環 氧樹月曰層3 0 3，其結構相當簡單，與一般的$ μ τ l E D 幾乎相同，其不需振盪電路、升壓變壓器及儲能電 容器，可透過較小的直流電壓、較小的電流，就激 發出高亮度光線，其電路設計簡單、高效、省電、 低成本、體積小，因此，特別適用於手機、數位相 機或PDA等電子產品上。 凊參閱「第4圖」’為本發明較佳實施例之步驟 流程圖，如圖中所示，前述Flash LED製造時，係 經過下列步驟’其包括：第一步驟4〇1，第一次切 割，其係利用化學蝕刻或是沖壓成型的方式，對一 第一材料進行第一次切割，並在化學蝕刻前或是沖 壓成型後，於第一材料單面上貼附一膠布，以保持 其第一材料經過切割後的完整性；第二步驟4〇2， 封膠’其第一材料經過切割後，會在第—材料表面 成型有若干縫隙，其縫隙間係呈連通狀，接著，在 縫隙間填入絕緣導熱膠；第三步驟4〇3，貼合，將 1338958 一第二材料以加熱加壓的方式，貼合在經過切割的 第一材料另一面，以形成一底座；第四步驟404, 第二次切割，以CNC加工的方式在前述底座上成型 有一杯口，其杯口内並成型對應第一材料的一放置 邵的複數個導電部；Flash LED (LED flash), flash LED is a low-voltage flash, which does not require an oscillating circuit 'boost transformer and energy storage capacitor' can excite high brightness through a small DC voltage, a small current Light's circuit design is simple, efficient, power-saving, low-cost, small size, so it is especially suitable for electronic products such as mobile phones, digital cameras or PDAs. The structure of the Flash LED is similar to that of the general surface mount type (SMT) LEI. However, the circuit design is slightly different. Please refer to "Figure 1" for the flow chart of the conventional SMT LED package. Show 'the production process includes: the first step 1〇1, the first time 6 1338958, the cloth photoresist 'coated with a layer of photoresist on the surface of a copper material; the second step 1 02 'first exposure development, use Exposing the development mode to form a mask pattern on the surface of the copper material; in a third step 103, the first person etches a first pattern that is concave and not penetrated on the surface of the copper material by chemical etching; the fourth step is first Sub-sealing, this w removes the photoresist on the surface of the copper, fills the sealant in the first pattern, and processes it in the first stage. The fifth step is 1〇5, the surface is turned, and the person is coated with light. Resistance 'will complete the first stage processing of the copper surface coating photoresist' sixth step i 06, the second exposure and development, using the warm "ik, light development method" to form a corresponding first map on the copper surface / reticle pattern; seventh step 107, second etching, re-use of chemical etching The method is: forming a second image on the surface of the copper material and communicating with the first pattern; in the eighth step 1〇8, the second sealing layer 同样 'samely' removes the photoresist on the surface of the copper material, and then in the second pattern The meat is filled with the sealant and integrated with the sealant in the first pattern to form a wafer holder; in a ninth step 109, the wafer holder is processed, and a wafer or a CNC is processed to form a wafer holder. Crystallization for placing the illuminating wafer and facilitating light reflection; the tenth step 11 〇 'solidification, fixing the luminescent wafer in the wafer slot; the eleventh step ^ 111 'wire' through the metal wire to electrically connect the luminescent wafer and the conductive electrode Connection; twelfth step 11 2, flip chip, and finally attach an epoxy layer on the surface of the wafer holder to complete the packaging of the SMT LED; please refer to FIG. 2 ' is a stereoscopic appearance of the conventional SMT LED, As shown in the figure, in summary, the SMT LED 20 includes 7 1338958 a wafer holder 201, a plurality of conductive electrodes 2 〇 2, a plurality of luminescent wafers 2 0 3 and an epoxy layer 2 0 4 ' And the wafer holder 20 1 is formed thereon, and the pattern has a plurality of wafer slots 2 01 1' is provided with a fixed light-emitting chip 2 0 3, and the metal wire 205 is struck on the light-emitting chip 203 and the conductive electrodes 202 on both sides by wire bonding, and finally coated with an epoxy resin layer 2〇4, The packaging process is not only cumbersome, but also increases its manufacturing cost 'and requires a higher precision φ degree for the first pattern and the second pattern to avoid the problem of poor packaging. Therefore, the production efficiency is insufficient' and the quality of the finished product is less controllable. . SUMMARY OF THE INVENTION In view of the conventional simplification of the SMT LED, the procedure is cumbersome, and the precision is high, the manufacturing cost is easily increased, and the quality of the finished product is unstable. Therefore, the inventors carefully studied and accumulated Personal experience in this business for many years, 'final design' - kind of production method for the new Flash LED. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a method of manufacturing a F丨ash LED which simplifies the sealing process and improves the quality of the finished product. In order to achieve the above object, a method for manufacturing a flash LED of the present invention includes: a first step, a first cutting, and a first etching of a first material by chemical etching or stamping. Before chemical etching or after stamping, a tape is attached to one side of the first material to maintain the integrity of the first material after cutting 8 1338958; the second step, sealing, the first material is cut. After that, there will be thousands of slits formed on the surface of the first material, and the gaps between them are connected. Then, the insulating thermal conductive adhesive is filled between the slits. The third step is to fit and heat a second material. The method is applied to the other side of the cut first material to form a base; the fourth step of 'second cutting, forming a cup of mouth on the base by CNC machining, and forming a corresponding one in the cup mouth a placing portion of the material and a plurality of conductive portions; a fifth step of 'electroplating, tearing off the tape attached to the surface of the first material' and plating a metal layer on the conductive portion of the base; Solid crystal, at least one illuminating wafer is fixed on the placement portion at the center of the base of the base; in the seventh step, the wire is struck, and the metal wire is hit on the illuminating chip and the electrode portions on both sides by using a wire to make the illuminating crystal Electrically connected to the electrode portion; and the eighth step of 'covering the crystal, filling the cup with epoxy resin to cover the light-emitting chip, the metal wire, the placement portion and the electrode portion, and completing the F1 ash LED Feng 奘 π J 5 衮 衮, in summary, compared with the general surface adhesion type (SMT) LED Fengmeng 4 L, said J 裒 process, the system is greatly simplified, which can reduce the 诰屮The cost of the gentleman + clothing k makes the production more efficient, and the invention is fixed by the adhesive tape, and the first material can be used to maintain its integrity. Therefore, it can also be used to make the finished product. Quality. 9 1338958 In addition, the flash LED manufactured by the invention comprises: a plurality of illuminating wafers and an epoxy resin layer, wherein the base is cut by the first material and pressed and heated with the second material. And forming a cup of mouth on the surface of the second material, and the first material in the mouth of the cup correspondingly forms a placement portion and a plurality of electrode portions to fix the plurality of luminescent wafers on the placement portion Then, using the wire bonding technology, the metal wire is placed on the light-emitting chip and the electrode _, so that the light-emitting chip is electrically connected to the electrode portions on both sides, and finally the epoxy resin is poured into the cup mouth to illuminate the wafer and the metal. The wire, the placement portion, and the electrode portion are covered therein, and the structure thereof is relatively simple, and is almost the same as that of a general SMT LED. Therefore, in the case of reducing the manufacturing procedure, the purpose of reducing the production cost can be achieved. The contents of the present invention can be clearly understood, and only the following descriptions are used in conjunction with the drawings, please refer to it. [Embodiment] Referring to "Fig. 3", a perspective view of a preferred embodiment of the present invention is shown in the figure. The Flash LED 3 制作 produced by the present invention is mainly composed of a base 3 〇 1, a plurality The light-emitting chip 3 〇2 and an epoxy resin layer 3 0 3 are composed of the base 3 〇1 which are respectively cut and processed by two different materials, and then pressed and heated to form a joint. The surface of the 301 is formed by a CNC process in a semi-through manner with a cup opening 3011' whose depth of cut is greater than the thickness of the surface material of 10, and a lower portion of the material in the cup opening 3011 correspondingly forms a placement portion 3012 and a plurality of electrode portions 3. 〇13, a plurality of illuminating wafers 302 can be fixed on the placing portion 3〇12, and the metal wires 304 are struck between the illuminating wafer 3〇2 and the surrounding electrode portions 3013 by a wire bonding technique, so that the illuminating wafers 302 are respectively The surrounding electrode portion 3013 is electrically connected, and finally, an epoxy resin is poured into the cup mouth 301 to cover the light-emitting chip 3〇2, the metal wire 3〇4, the placement portion 3012, and the electrode portion 3013, and at the cup mouth. An epoxy tree layer is formed in 3〇11. 3, its structure is quite simple, almost the same as the general $ μ τ l ED, it does not require an oscillating circuit, a step-up transformer and a storage capacitor, which can excite high brightness through a small DC voltage and a small current. Light, its circuit design is simple, efficient, power-saving, low-cost, small size, so it is especially suitable for electronic products such as mobile phones, digital cameras or PDAs. Referring to "FIG. 4", a flow chart of a step of a preferred embodiment of the present invention is shown. As shown in the figure, the aforementioned Flash LED is manufactured by the following steps 'which includes: first step 4〇1, first time Cutting, which is a first cutting of a first material by chemical etching or stamping, and a tape is attached to one side of the first material before or after chemical etching to maintain The first material is subjected to the integrity after cutting; the second step 4〇2, the sealant's first material is cut, and a plurality of slits are formed on the surface of the first material, and the gaps are connected, and then, The insulating thermal conductive adhesive is filled between the gaps; in the third step 4〇3, the first material is attached to the other side of the cut first material by heat and pressure to form a base; a fourth step 404, the second cutting, forming a cup of mouth on the base by means of CNC machining, and forming a plurality of conductive portions corresponding to the first material in the cup mouth;
在第一材料表面的膠布撕除後，並於前述底座的導 電部鍍上一金屬層；第六步驟406，固晶，將至少 一個發光晶片固設於底座杯口中央的放置部上；第 七步驟4 0 7，打線，利用打線的方式將金屬線打在 發光晶片及兩側電極部上，以使發光晶片與電極部 呈電性連接；以及第八步驟4 〇 8，覆晶，利用環氧 樹脂填滿杯口，以將發光晶片、金屬線、放置部及 電極部包覆於内，而完成一 Flash LED的封裝：综 上所述，與前述SMT LED的封裝製程相比，係獲得 大幅度的簡化，進而可降低製造成本，使生產更有 政率，且本發明以膠布固定被切割的第一材料，可 用來保持其完整性，因此，也可提高成品的品質。 請參閱「第5圖」，為本發明較佳實施例進行加 :的動作示意圖（一），如圖中所示，首先，係在一 利：材料5〇的—面上貼附-層膠布60,接著，再 5:用化學敍刻或是沖廢成型的方式，對此第一材料 的區塊仃切：’以將其第—材料5“刀割成不等大小 _ =其間係成型有複數個縫隙5〇1 ’而膠布Μ 來保持經切割後的第-材料5。的完整性， 12 『338958 又，S使用化學蝕刻加工時，係在加工前就將膠布 60貼在第一材料5〇表面，而使用沖壓成型加工時， 則係在加工完畢後才將膠布6〇貼在第一材料5〇表 面。 »月參閱「第6圖」，為本發明較佳實施例進行加 工的動作示意圖（二），如圖中所示，其切割完畢的 第一材料50上係成型有複數個縫隙501 ,且相鄰縫 φ 隙5 0 1間係呈連通狀，而可以塗佈或貼附的方式， 將絕緣導熱膠70填滿於第一材料5〇的縫隙5〇 i 内’以將第一材料5 0的不同區塊加以分隔，並使相 鄰區塊不導通。 清參閱「第7圖」’為本發明較佳實施例進行加 工的動作示意圖（三），如圖中所示，將一個對應第 材料5 0尺寸形狀的第一材料8 0，以加熱加壓的 方式，將第一材料50及第二材料80貼合成一底座 φ 30 1，且其貼合所使用的膠體同樣是絕緣導熱膠7〇， 因此’其底座301貼合後’第一材料50與第二材料 8 0間係呈絕緣不導通的狀態。 請參閱「第8圖」，為本發明較佳實施例進行加 工的動作示意圖（四），如圖中所示，當底座301的 兩材料貼合後，係以CNC加工的方式，在第二材料 80表面進行半貫穿加工以成型一杯口 3011，加工完 畢後，其與前述第一材料50的不同區塊會有外露的 部分，便形成了一供放置前述發光晶片302的放置 13 1338958 部3(H2,及複數個導電部3〇13,且其放置部3〇i2 與導電部3013也不會與杯口 3〇11表面的前述第二 u 材料8 0相導通。 叫 > 閱第9圖」，為本發明較佳實施例進行加 工的動作示意圖（五）’如圖中所示’其底座3〇1的 杯口 3011加工完畢後，將前述第一材料5〇表面的 前述膠布60撕掉，並開始進行電鍍的工作，以在杯 # 口 3011、杯口 3011内面的導電部3013,及底座301 底面的導電部3013表面鍍上一層金屬層9〇，其杯 口 3011内面的金屬層9〇可作為打線之用。 請參閱「第1 0圖」，為本發明較佳實施例進行 加工的動作示意圖（六），如圖中所示，將發光晶片 302固設於底座301的放置部3012上，並利用打線 將金屬線3 0 4連接於發光晶片3 0 2與兩側導電部 3013的金屬層90上，以使發光晶片302與兩側的 _ 導電部3013呈電性連接。 請參閱「第11圖」，為本發明較佳實施例進行 加工的動作示意圖（七），如圊中所示，最後，再利 用點膠或灌膠的方式，將環氧樹脂灌注於底座301 的杯口 3011内，使發光晶片302、金屬線304、放 置部3012及導電部3013被包覆於其内，而在杯口 3011形成一環氧樹脂層303，以完成Flash LED 30 的製作。 請參閱「第12圖」，為本發明另一較佳實施例 14After the tape on the surface of the first material is removed, and a conductive layer is plated on the conductive portion of the base; in a sixth step 406, the at least one light-emitting chip is fixed on the placement portion at the center of the base of the base; Seven steps 4 0 7, hitting the wire, hitting the metal wire on the light-emitting chip and the electrode portions on both sides by wire bonding, so that the light-emitting chip and the electrode portion are electrically connected; and the eighth step 4 〇8, flip chip, use The epoxy resin fills the cup to cover the light-emitting chip, the metal wire, the placement portion and the electrode portion, and completes the packaging of the Flash LED: in summary, compared with the packaging process of the SMT LED described above, A substantial simplification is achieved, which in turn reduces manufacturing costs and makes production more politic, and the present invention secures the cut first material with a tape that can be used to maintain its integrity and, therefore, improve the quality of the finished product. Please refer to FIG. 5 for a schematic view of the operation of the preferred embodiment of the present invention. (1) As shown in the figure, firstly, a layer of tape is attached to the surface of the material: 60, then, again 5: using chemical stenciling or scouring, the block of the first material is cut: 'to cut its first material 5' into different sizes _ = There are a plurality of slits 5〇1' and the tape Μ to maintain the integrity of the cut material-material 5. 12 338958 In addition, when S is used in chemical etching, the tape 60 is attached to the first before processing. The material is 5 〇 surface, and when the press forming process is used, the adhesive tape 6 〇 is applied to the surface of the first material 5 加工 after the processing is completed. »See "Figure 6" for processing the preferred embodiment of the present invention. The schematic diagram of the action (2), as shown in the figure, is formed by forming a plurality of slits 501 on the cut first material 50, and the adjacent slits φ gaps are connected in a shape, and can be coated or In the manner of attaching, the insulating thermal conductive adhesive 70 is filled in the gap 5〇i of the first material 5〇 to the first material The different blocks of material 50 are separated and the adjacent blocks are not turned on. Refer to "FIG. 7" for a schematic view of the operation of the preferred embodiment of the present invention (3). As shown in the figure, a first material 80 corresponding to the shape of the first material 50 is heated and pressurized. The first material 50 and the second material 80 are pasted into a base φ 30 1, and the glue used for bonding is also an insulating thermal conductive adhesive 7 〇, so that 'the base 301 is attached after the first material 50 It is insulated from the second material 80 and is in a non-conducting state. Please refer to FIG. 8 for a schematic view of the operation of the preferred embodiment of the present invention (4). As shown in the figure, when the two materials of the base 301 are attached, the method is CNC machining, and the second is The surface of the material 80 is subjected to a semi-through process to form a cup mouth 3011. After processing, the exposed portion of the first material 50 has an exposed portion, thereby forming a place for placing the light-emitting wafer 302. 13 1338958 part 3 (H2, and a plurality of conductive portions 3〇13, and the placement portion 3〇i2 and the conductive portion 3013 are not electrically connected to the second u material 80 on the surface of the cup 3〇11. Calling > Figure 5 is a schematic view of the operation of the preferred embodiment of the present invention. (5) 'As shown in the figure, after the cup mouth 3011 of the base 3〇1 is finished, the aforementioned tape 60 of the surface of the first material 5〇 is formed. The work of electroplating is torn off and the electroplating work is started to coat the surface of the conductive portion 3013 on the inner surface of the cup #3011, the cup mouth 3011, and the conductive portion 3013 on the bottom surface of the base 301 with a metal layer 9〇, the metal inside the cup mouth 3011. Layer 9 can be used as a line. See "1st" FIG. 3 is a schematic view showing the operation of the preferred embodiment of the present invention. The illuminating wafer 302 is fixed on the placing portion 3012 of the base 301, and the metal wire is wound by a wire. It is connected to the metal layer 90 of the light-emitting chip 306 and the two-side conductive portion 3013 to electrically connect the light-emitting chip 302 to the conductive portions 3013 on both sides. Please refer to FIG. 11 for the present invention. The operation diagram of the processing performed in the embodiment (7), as shown in the ,, finally, the epoxy resin is poured into the cup mouth 3011 of the base 301 by means of dispensing or potting to make the light-emitting chip 302 and the metal wire. 304, the placing portion 3012 and the conductive portion 3013 are covered therein, and an epoxy layer 303 is formed on the cup opening 3011 to complete the fabrication of the flash LED 30. Please refer to "Fig. 12", which is another Preferred embodiment 14
示’前述Flash LED製造 獲得相同的成品，其包括 ’第一次切割，其係利用 方式，對一第一材料進行 刻前或是沖壓成型後，於 布’以保持其第一材料經 步驟402，封膠，其第一 一材料表面成型有若干縫 ’接著，在縫隙間填入絕 ’第二次切割，以CNC加 成型有一杯口；第三步驟 杯口的第二材料以加熱加 割的第一材料另一面，以 杯口内成型對應第一材料 部；第五步驟405，電鍍， 膠布撕除後，並於前述底 :第六步驟406，固晶， 之步驟流程圖’如圖中所 時’可改變某些製程，而 下列步驟：第一步驟401 化學蝕刻或是沖壓成型的 第一次切割，並在化學蝕 第一材料單面上貼附一膠 過切割後的完整性；第二 材料經過切割後，會在第 隙’其縫隙間係呈連通狀 緣導熱膠；第三步驟403 工的方式在一第二材料上 4〇3,貼合，將前述成型有 壓的方式’貼合在經過切 形成一底座，因此，可在 的一放置部的複數個導電 將貼附在第一材料表面的 座的導電部鑛上一金屬層 將至夕一個發光晶片固設於底座杯口中央的放置部 上；第七步驟407，打線，利用打線的方式將金屬 線打在發光晶片及兩側電極部上，以使發光晶片與 電極部呈電性連接；以及第八步驟408，覆晶，利 用環氧樹脂填滿杯口’以將發光晶片、金屬線、放 置部及電極部包覆於内，而完成_ Flash UD的封 裝；綜上所述，與前述SMT LED的封裝製程相比， 15Show 'the aforementioned Flash LED manufacturing to obtain the same finished product, which includes 'first cutting, which is used in a manner, before or after stamping a first material, in the cloth' to keep its first material through step 402 , the sealant, the surface of the first material is formed with a plurality of slits. Then, the second cut is filled between the gaps, and a cup is formed by CNC. The second step of the cup is heated and cut. The other side of the first material is formed in the mouth of the cup corresponding to the first material portion; the fifth step 405, electroplating, after the tape is removed, and at the foregoing bottom: the sixth step 406, the solid crystal, the step flow chart is as shown in the figure When the process can be changed, the following steps are performed: the first step 401 is chemical etching or the first cutting of the stamping, and the integrity of the glue after the cutting is attached to the chemically etched first material; After the second material is cut, it will be in the first gap 'the gap between the gaps is the conductive edge thermal conductive glue; the third step 403 works on a second material 4 〇 3, fit, the above-mentioned forming pressure method 'Fitting in the cut shape Forming a base, so that a plurality of conductive portions of a placement portion can be attached to the conductive portion of the seat on the surface of the first material, and a metal layer is fixed on the placement portion of the center of the base cup a seventh step 407, the wire is struck, and the metal wire is struck on the light-emitting chip and the electrode portions on both sides to electrically connect the light-emitting chip and the electrode portion; and the eighth step 408, flip-chip, using epoxy The resin fills the cup mouth to cover the light-emitting chip, the metal wire, the placement portion, and the electrode portion, and completes the packaging of the _Flash UD; in summary, compared with the packaging process of the aforementioned SMT LED, 15
係獲得大幅度的簡化’進而可降低製造成本，使 產更有效率’且本發明以膠布固定被切割的第一 料，可用來保持其完整性，因此，也可提高成品 品質。 如上所述，本發明其據以實 布固定切割前或切割後的第一材料，以確保經過 割後的第一材料的完整性，便於後續的加工，確 可簡化一般的封裝程序，以達到改善成品品質 Flash LED之製造方法，進而降低製造成本。 唯’以上所述者’僅為本發明之較佳之實施 而已，並非用以限定本發明實施之範圍；任何熟 此技藝者，在不脫離本發明之精神與範圍下所作 均等變化與修倚’皆應涵蓋於本發明之專利範圍戶 综上所述，本發明FUsh LED之製造方法之 效，係具有發明之「產業可刹田卜斗 「〜 座栗J利用性」、「新穎性」 進步性」專專利要件；申請人至&击1丨 文旰，甲明人茇依專利法之規定 向鈞局提起發明專利之申請。 生 材 的 膠 切 實 的 例 習 之 3 ° 功 與 16 1338958 【圖式簡單說明】 第1圖，為習知SMT LED封裝的步驟流程圖。 第2圖，為習知SMT LED的立體外觀圖。 第3圖，為本發明較佳實施例之立體外觀圖。 第4圖，為本發明較佳實施例之步驟流程圖。 第5圖，為本發明較佳實施例進行加工的動作示意 圖（一）。 第6圖，為本發明較佳實施例進行加工的動作示意 圖（二）。 第7圖，為本發明較佳實施例進行加工的動作示意 圖（三）。 第8圖，為本發明較佳實施例進行加工的動作示意 圖（四）。 第9圖，為本發明較佳實施例進行加工的動作示意 圖（五）。 第1 0圖，為本發明較佳實施例進行加工的動作示意 圖（六）。 第11圖，為本發明較佳實施例進行加工的動作示意 圖（七）。 第1 2圖，為本發明另一較佳實施例之步驟流程圖。 【主要元件符號說明】 101 第 一步驟 102 第 二步驟 17 1338958A substantial simplification is achieved, which in turn reduces manufacturing costs and makes production more efficient. The present invention uses a tape to hold the first material to be cut, which can be used to maintain its integrity and, therefore, improve the quality of the finished product. As described above, the present invention secures the first material before or after cutting to ensure the integrity of the cut first material, facilitating subsequent processing, and simplifying the general packaging process to achieve Improve the manufacturing method of finished quality Flash LEDs, thereby reducing manufacturing costs. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; any skilled person can make equal changes and modifications without departing from the spirit and scope of the present invention. All of them should be included in the patent scope of the present invention. The effect of the manufacturing method of the FUsh LED of the present invention is that the invention can be improved by the "industry can be used in the field", "the utilization of the chestnut J", and the "novelty". "Special" patent requirements; applicants to & 1 丨 旰 旰 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲3 ° work and 16 1338958 [Simplified Schematic] Figure 1 is a flow chart of the steps of the conventional SMT LED package. Figure 2 is a perspective view of a conventional SMT LED. Figure 3 is a perspective view of a preferred embodiment of the present invention. Figure 4 is a flow chart showing the steps of a preferred embodiment of the present invention. Fig. 5 is a schematic view (1) of the operation for processing in accordance with a preferred embodiment of the present invention. Figure 6 is a schematic view (2) of the operation for processing in accordance with a preferred embodiment of the present invention. Figure 7 is a schematic view (3) of the operation for processing in accordance with a preferred embodiment of the present invention. Figure 8 is a schematic view (4) of the operation for processing in accordance with a preferred embodiment of the present invention. Figure 9 is a schematic view (5) of the operation for processing according to a preferred embodiment of the present invention. Fig. 10 is a schematic view showing the operation of processing according to a preferred embodiment of the present invention (6). Figure 11 is a schematic view (7) of the operation for processing in accordance with a preferred embodiment of the present invention. Figure 12 is a flow chart showing the steps of another preferred embodiment of the present invention. [Main component symbol description] 101 First step 102 Second step 17 1338958
103 第三步驟 104 第四步驟 105 第五步驟 106 第六步驟 107 第七步驟 108 第八步驟 109 第九步驟 110 第十步驟 111 第十一步驟 112 第十二步驟 20 SMT LED 201 晶片座 2011 晶片槽 202 發光晶片 203 導電電極 204 環氧樹脂層 205 金屬線 30 Flash LED 301 底座 3011 杯口 3012 放置部 3013 導電部 302 發光晶片 303 環氧樹脂層 18 1338958 304 金 屬 線 401 第 一 步 驟 402 第 二 步 驟 403 第 二 步 驟 404 第 四 步 驟 405 第 五 步 驟 406 第 步 驟 407 第 七 步 驟 408 第 八 步 驟 50 第 一 材 料 60 膠 布 70 絕 緣 導 熱膠 80 第 二 材 料 90 金 屬 層 19103 Third Step 104 Fourth Step 105 Fifth Step 106 Sixth Step 107 Seventh Step 108 Eighth Step 109 Ninth Step 110 Tenth Step 111 Eleventh Step 112 Twelfth Step 20 SMT LED 201 Wafer Holder 2011 Wafer Slot 202 luminescent wafer 203 conductive electrode 204 epoxy layer 205 metal wire 30 Flash LED 301 base 3011 cup mouth 3012 placement portion 3013 conductive portion 302 illuminating wafer 303 epoxy layer 18 1338958 304 metal wire 401 first step 402 second step 403 second step 404 fourth step 405 fifth step 406 first step 407 seventh step 408 eighth step 50 first material 60 tape 70 insulating thermal paste 80 second material 90 metal layer 19