1335866 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種非鋼板介層之金屬基板壓合組合，尤指 利用放置於基板材料組間之非鋼料保護介層，該非鋼料保護介層 之熱膨脹係數相近於該金屬板與銅箔層之熱膨脹係數。 【先前技術】 目前之電子產品之效能及功率越來越高，因而散發出 籲之熱量也越來越尚’多半需要高散熱量之電子產品多半會 配置如導熱散熱基板之金屬基板於其内，例如個人電腦之 電源供應器。另外如近年日趨發達之發光二極體，甚至汽 車内部之散熱’亦多半使用導熱散熱基板辅助散熱。 請參閱第一圖’係為習知之金屬基板壓合組合1 〇〇之 示意圖，該金屬基板壓合組合100之一上蓋板110及一承 載板120間係放置多數組基板材料組130及保護介層組 140。當該上蓋板110及該承載板120加壓時，該金屬基板 籲壓合組合1〇〇並對該些多數組基板材料組130及保護介層 組140加熱。此時該基板材料組130之黏著層Π3融化以 黏合金屬板131與銅箔層丨32，而該保護介層組140之鋼 板141與牛皮紙層142皆係使該上蓋板110及該承載板12〇 所施加之壓力能平均分散，而能使該基板材料組13〇能平 均受壓使銅箔表面光滑平整。 當加壓完成後，等待該些基板材料組13〇冷卻後，該 黏著層133將遠金屬板131與銅ίΙ層132結合，以形成多 5 1335866 數組金屬基板。然而，於習知中金屬基板之金屬板131與 銅vl層132間之周圍時常會有黏合度不佳之情況且基材耐 熱'丨生與電性等基本特性呈現不穩定狀態，而造成該金屬基 板之散熱率降低之情況，或是於需將該黏合度不佳之部份 組成内保護介層與 金屬板搭配方法 -/Κ κ 熱膨脹係 數(ppm/ °C) 耐熱性測試 浸錫288°C 10秒，能承 受多少回 板邊黏著不 良程度 鋼料保護介層 12 介於5到20 回 0.5”到 2.0” 鋁金屬板 24 苓閱上表，傳統技術以鋼料保護介層實施，熱膨脹係數 的差為24·12=12ρριη/^，實際上板邊黏著不良程度範圍係距 離邊緣約0.5吋到2.0吋之譜’可謂嚴重的商品瑕疵。 【發明内容】 習知中如導熱散熱基板之金屬基板黏合度不佳之問 題，經由研究及實驗後得知，在於該鋼板與金屬板及銅箔 層之間之熱膨脹係數差異及剛性差異過大導致。原因之一在於， 當基板材料組及保護介層組經由加熱而逐漸冷卻後，該鋼 板與金屬板及銅箔層之間之膨脹程度不同而導致該黏著層 之外圍剝離而使黏合度不佳。因此本發明之目的在提供一 種非鋼板介層之金屬基板壓合組合及其方法，利用非鋼料保 6 1335866 護介層，熱膨脹係數與該鋁、銅金屬板與銅箔層相近之非鋼料保 護介層，以解決習知中金屬基板之鋁、銅金屬板與銅箔層間之周 圍時有黏合度不佳之情況，因而可提昇該金屬基板之散熱率 情況。 - 為了達成上述之目的，本發明另提供一種非鋼板介層 - 之金屬基板壓合組合以及壓合方法，該金屬基板壓合組合 係包含：一承載板；一上蓋板，該上蓋板係對應設置於該 承載板之上方，多數組基板材料組係層層疊合置放於該承 • 載板與該上蓋板間，其中所述一組之基板材料組係包含一 金屬板、一銅箔層、以及置於該金屬板與該銅箔層間之一 黏著層；·—非鋼料保護介層’係置放於該些基板材料組間5 該非鋼料保護介層係為一铭質墊板或一銅箔保護層，該非鋼料保 護介層之熱膨脹係數相近於該金屬板與銅绪層之熱膨脹係 數，熱膨脹係數相差在±8百萬分之一/攝氏度(ppm/°C)的範 圍内；一加溫設備，係對該些基板材料組加熱；以及一動 力設備，係動力連接於該上蓋板與該承載板，該動力設備 ® 係驅動該上蓋板與該承載板壓夾該些基板材料組；其中於 該動力設備分離該上蓋板與該承載板後，係使該黏著層結 合該鋁金屬板與該銅猪層，該些基板材料組形成多數組金 屬基板。 本發明具有以下有益之效果，由於該非鋼料保護介層 與該鋁金屬板及銅箔層之熱膨脹係數相近，因此在經由加 壓、加熱及冷卻後，該非鋼料保護介層與該紹金屬板及銅 箔層其延展及變形之程度相當，因此該黏著層可良好的結 7 1335866 合該鋁金屬板與該銅猪層，而可提高該金屬基板之散熱 率，或是減少材料之浪費。 關於本發明之優點與精神可以藉由以下的發明详述及 所附圖式得到進一步的暸解。 【實施方式】 由於本發明所提供之非鋼板介層之金屬基板壓合組合 200,可廣泛運用於各種壓合裝置，其組合實施方式更是不 _勝枚舉，故在此不再一一贅述，僅列舉其中一個較佳之實 施例來加以具體說明。 請參閱第二圖係本發明之非鋼板介層之金屬基板壓合 組合之第一實施例之示意圖。金屬基板壓合組合2〇0係包 含一承載板210、一上蓋板220、複數個非鋼料保護介層 230、一加溫設備240、一動力設備250。1335866 IX. Description of the Invention: [Technical Field] The present invention relates to a metal substrate press-bonding combination of a non-steel plate layer, in particular, a non-steel protective layer placed between groups of substrate materials, the non-steel material protection The coefficient of thermal expansion of the interlayer is similar to the coefficient of thermal expansion of the metal plate and the copper foil layer. [Prior Art] At present, the performance and power of electronic products are getting higher and higher, so the heat that is radiated is getting more and more. Most electronic products that require high heat dissipation will be equipped with a metal substrate such as a heat-dissipating heat-dissipating substrate. , for example, a personal computer power supply. In addition, as in recent years, the increasingly developed light-emitting diodes, and even the heat dissipation inside the automobile, mostly use a heat-dissipating heat-dissipating substrate to assist heat dissipation. Please refer to the first figure as a schematic diagram of a conventional metal substrate press-fit combination 1 . The metal substrate press-fit combination 100 is placed between a top cover 110 and a carrier 120 to form a multi-array substrate material set 130 and protect Interlayer group 140. When the upper cover 110 and the carrier 120 are pressurized, the metal substrate is pressed and combined to heat the plurality of array substrate material groups 130 and the protective interlayers 140. At this time, the adhesive layer 3 of the substrate material group 130 is melted to bond the metal plate 131 and the copper foil layer 32, and the steel plate 141 and the kraft layer 142 of the protective layer group 140 are used to bind the upper cover 110 and the carrier plate. The pressure applied by 12 能 can be evenly dispersed, so that the substrate material group 13 can be evenly pressed to make the surface of the copper foil smooth and flat. After the pressing is completed, after the substrate material group 13 is cooled, the adhesive layer 133 combines the far metal plate 131 and the copper layer 132 to form a plurality of 5 1335866 array metal substrates. However, in the conventional case, there is a case where the adhesion between the metal plate 131 of the metal substrate and the copper vl layer 132 is not good, and the basic characteristics such as heat generation and electrical properties of the substrate are unstable, and the metal is caused. The heat dissipation rate of the substrate is reduced, or the part of the adhesive layer is not suitable for the inner protective layer and the metal plate - / Κ κ thermal expansion coefficient (ppm / ° C) heat resistance test immersion tin 288 ° C 10 seconds, how many backboard edge adhesions can be tolerated. Steel protection layer 12 is between 5 and 20 0.5" to 2.0" aluminum metal plate 24. See the table above, the traditional technology is implemented with steel protective layer, thermal expansion coefficient The difference is 24·12=12ρριη/^. In fact, the degree of adhesion on the edge of the board is about 0.5吋 to 2.0吋 from the edge. It is a serious commodity. SUMMARY OF THE INVENTION In the prior art, the problem of poor adhesion of a metal substrate such as a heat-conductive heat-dissipating substrate is known after research and experiment, because the difference in thermal expansion coefficient and the difference in rigidity between the steel plate and the metal plate and the copper foil layer are excessively large. One of the reasons is that when the substrate material group and the protective interlayer group are gradually cooled by heating, the degree of expansion between the steel sheet and the metal plate and the copper foil layer is different, and the periphery of the adhesive layer is peeled off to make the adhesion poor. . Therefore, the object of the present invention is to provide a non-steel plate metal substrate press-bonding combination and a method thereof, using a non-steel material 6 1335866 protective layer, a thermal expansion coefficient and a non-steel similar to the aluminum, copper metal plate and copper foil layer. The material protection layer can solve the problem that the adhesion between the aluminum, the copper metal plate and the copper foil layer in the conventional metal substrate is poor, so that the heat dissipation rate of the metal substrate can be improved. In order to achieve the above object, the present invention further provides a metal substrate pressing combination and a pressing method for a non-steel plate layer, the metal substrate pressing assembly comprising: a carrier plate; an upper cover plate, the upper cover plate Correspondingly disposed above the carrier plate, a plurality of arrays of substrate material layers are stacked and placed between the carrier plate and the upper cover plate, wherein the set of substrate material layers comprises a metal plate and a a copper foil layer and an adhesive layer interposed between the metal plate and the copper foil layer; a non-steel protective interlayer is placed between the substrate material groups. 5 The non-steel protective interlayer is a Ming a quality pad or a copper foil protective layer, the thermal expansion coefficient of the non-steel protective layer is similar to the thermal expansion coefficient of the metal plate and the copper layer, and the thermal expansion coefficient differs by ±8 parts per million (ppm/°C) a heating device for heating the substrate material groups; and a power device coupled to the upper cover and the carrier plate, the power device® driving the upper cover and the carrier The plate press clamps the substrate material groups; After separation of the power plant on the cover plate and the carrier plate, so that the adhesive layer is based binding of the metal plate and the aluminum copper layer pigs, the plurality of group-forming majority of the substrate material group metal substrate. The invention has the following beneficial effects: since the non-steel protective interlayer has a thermal expansion coefficient similar to that of the aluminum metal plate and the copper foil layer, the non-steel protective interlayer and the metal after the pressurization, heating and cooling The plate and the copper foil layer have the same degree of extension and deformation, so the adhesive layer can well bond the aluminum metal plate and the copper pig layer, thereby improving the heat dissipation rate of the metal substrate or reducing the waste of materials. . The advantages and spirit of the present invention will be further understood from the following detailed description of the invention. [Embodiment] The metal substrate press-fit combination 200 of the non-steel plate layer provided by the present invention can be widely applied to various press-fit devices, and the combined embodiment thereof is not enumerated, so it is no longer one by one. BRIEF DESCRIPTION OF THE DRAWINGS Only one of the preferred embodiments will be described in detail. Please refer to the second drawing for the first embodiment of the metal substrate press-bonding combination of the non-steel plate layer of the present invention. The metal substrate press-fit combination 2〇0 includes a carrier plate 210, an upper cover plate 220, a plurality of non-steel protective layers 230, a warming device 240, and a power device 250.
上蓋板220係對應設置於承載板210之上方，上蓋板 220與承載板210係可由堅硬之材質所構成’如鋼板等， 以承受施加於上蓋板220與承載板210之作用力。 多數組基板材料組300係層層疊合置放於承載板210與上蓋 板22〇間’其中所述一組之基板材料組3〇〇係包含如鋁金屬板之 金屬板310、一銅箔層32〇、以及置於金屬板3丨〇與銅箔層32〇間 之-黏者層33〇。於本實施例中金屬板训之厚度可約為Μ至6 層32G之厚度可約為_至〇4公釐左右 層330之厚度可約為〇·05至〇·4公釐左右。 補充說明的是，金屬板31〇除了是叙金屬板之外，還 8 1335866 加溫設備24〇直通於上蓋板22Q與承載板2iq，於兑 電熱式加熱管路或熱煤油管，來對該些基板材料組 〇〇及非鋼料保護介層㈣加熱。動力設備25〇係動力連 ::上盖板22。與承载板21〇，動力設備25〇係驅動上蓋 ==承載板210壓夾該些基板材料組3(κ)。— ^40 ⑽係為習知之技術，並不多加敘述。 ^中^動力設備2Μ)分離上蓋板22〇與承載板训後，係 H層330結合金屬板31G與㈣層32()，該 „。〇形成該些多數組如導熱散熱基板之金屬 (繪製於第三圊）。 人^參閱第四圖’係本發明之非鋼板介層之金屬基板壓 ^二第二實施狀4圖，基本之結構與第三圖同， ，二貫施例不同的是，該些基板材料組均以該第一疊合方 式璺合，非鋼料保護介層现係為—_保護層，其材質轉度 可。域層32_同，_保制係介於兩基板㈣組·、3〇〇c 之間’因而基板材料組之金屬板· _所相鄰基板材料組 00c之銅 32㈣目鄰保護層係設於基板材料組之金 板310與所相鄰基板材料組3〇〇之銅箔層間。 熱膨脹係 數(ppm/ t) 銅箱保護層由於膨脹絲與金屬板與銅騎32〇相近， 且銅落保護層之厚度十分薄，因此加熱後不會與金屬板與銅 生相對位，及黏合唐g的現象 耐熱性測試 浸錫288°C 1 〇秒，能承受 板邊黏著 不良程度 組成内保護介層與 金屬板搭配方法 1335866 多少回 組合搭配 鋼料保護 介層 12 介於30〜35回 無此現象 銅金屬板 18 組合搭配 非鋼料保 護介層 24 介於30〜35回 無此現象 銘金屬板 24 組合搭配 非鋼料保 護介層 24 介於30〜35回 無此現象 銅金屬板 18 參閱上表，本發明以非鋼料保護介層230實施，三組 組合搭配例之熱膨脹係數ppm/°C差皆在±8百萬分之一/攝 氏度（ppm/°C )的範圍内，實際上沒有板邊黏著不良的現 象，確實已改良傳統所發生的問題。 請參閱第五圖，係本發明之非鋼板介層之金屬基板壓 合方法之流程圖，下列元件標號之部分請參閱第二圖至第 四圖。 步驟S101:金屬基板壓合方法係包含下列步驟將多數組基 板材料組300層層疊合，並置放於一承載板210與一上蓋 板220間，且於該些基板材料組300間置放一非鋼料保護 介層230，其中所述一組之基板材料組300係包含如紹金 屬板之金屬板310、一銅箔層320、以及置於金屬板310與 1335866 銅箔層320間之一黏著層330，非鋼料保護介層230之熱 膨脹係數相近於鋁、銅金屬板310與銅箔層320之熱膨脹 係數。 步驟S103: —加溫設備240對該些基板材料組300加熱。 ' 步驟S105: —動力設備250驅動上蓋板220與承載板210 壓夾該些基板材料組300，使黏著層330黏合金屬板310 與銅箔層320。 步驟S107 :停止對該些基板材料組300加熱，而基板 • 材料組300經放置冷卻後，分離上蓋板220與承載板210， 黏著層330固化而結合金屬板310與銅箔層320，係使該 些基板材料組300形成多數組金屬基板400。 藉由以上較佳具體實施例之詳述，係希望能更加清楚 描述本發明之特徵與精神，而並非以上述所揭露的較佳具 體實施例來對本發明之範疇加以限制。相反地，其目的是 希望能涵蓋各種改變及具相等性的安排於本發明所欲申請 $ 之專利範圍的範_内。 【圖式簡單說明】 第一圖係為習知之金屬基板壓合組合之示意圖； 第二圖係本發明之非鋼板介層之金屬基板壓合組合之第 一實施例之示意圖； 第三圖係本發明之金屬基板之組合示意圖；以及 第四圖係本發明之非鋼板介層之金屬基板壓合組合之第 二實施例之示意圖； 12 1335866 第五圖係本發明之非鋼板介層之金屬基板壓合方法之流 程圖。 【主要元件符號說明】 [習知技術] 金屬基板壓合組合100 上蓋板110 承載板120 基板材料組130 金屬板131 銅箔層132 黏著層133 保護介層組140 鋼板141 牛皮紙層142 [本發明] 金屬基板壓合組合200 承載板210 上蓋板220 非鋼料保護介層230、230a 加溫設備2 4 0 動力設備250 基板材料組 300、300a、300b、300c 金屬板 310、310a、310b 13 1335866 銅箔層 320、320a、320c 黏著層330、330a 金屬基板400The upper cover plate 220 is disposed above the carrier plate 210. The upper cover plate 220 and the carrier plate 210 may be made of a hard material such as a steel plate or the like to withstand the force applied to the upper cover plate 220 and the carrier plate 210. The multi-array substrate material group 300 is laminated and placed between the carrier plate 210 and the upper cover 22, wherein the set of substrate material groups 3 comprises a metal plate 310 such as an aluminum metal plate, and a copper foil. The layer 32 〇 and the adhesive layer 33 置于 between the metal plate 3 丨〇 and the copper foil layer 32 〇. In the present embodiment, the thickness of the metal plate may be about Μ to 6 layers. The thickness of 32G may be about _ to about 4 mm. The thickness of the layer 330 may be about 〇·05 to 〇·4 mm. In addition, the metal plate 31 is not only a metal plate, but also 8 1335866 heating equipment 24 〇 straight through the upper cover 22Q and the carrier plate 2iq, in the electric heating heating pipe or the hot kerosene pipe, to The substrate material group and the non-steel protective layer (4) are heated. Power equipment 25 动力 power linkage :: upper cover 22 . With the carrier plate 21, the power unit 25 drives the upper cover == the carrier plate 210 presses the substrate material groups 3 (κ). — ^40 (10) is a well-known technique and is not described. ^中^动力设备2Μ) After separating the upper cover 22〇 and the carrier plate, the H layer 330 is combined with the metal plate 31G and the (four) layer 32(), which forms the plurality of arrays such as the metal of the heat-dissipating heat-dissipating substrate ( It is drawn in the third 圊). People ^ refer to the fourth figure 'The metal substrate of the non-steel plate layer of the present invention is the second embodiment 4, the basic structure is the same as the third figure, and the second embodiment is different. The substrate material groups are all twisted in the first stacking manner, and the non-steel protective layer is now a protective layer, and the material rotation degree thereof can be. The domain layer 32_same, the _protection system Between the two substrates (four) group, 3〇〇c', thus the metal plate of the substrate material group, the copper 32 (four) adjacent protective layer of the adjacent substrate material group 00c is disposed on the gold plate 310 of the substrate material group and the phase Adjacent substrate material group 3 铜 between the copper foil layers. Thermal expansion coefficient (ppm / t) Copper box protective layer because the expansion wire and the metal plate and copper riding 32 〇 close, and the thickness of the copper falling protective layer is very thin, so after heating Will be in opposition to the metal plate and copper, and the phenomenon of bonding Tang g heat resistance test immersion tin 288 ° C 1 〇 second, can withstand the edge of the board Adhesive degree composition of inner protective layer and metal plate matching method 1335866 How many times combined with steel protection layer 12 between 30~35 back without this phenomenon copper metal plate 18 combination with non-steel protection layer 24 between 30~ 35 times without this phenomenon Ming metal plate 24 combination with non-steel protection layer 24 between 30~35 back without this phenomenon copper metal plate 18 Referring to the above table, the present invention is implemented with non-steel protection layer 230, three groups of combinations The difference in the coefficient of thermal expansion of the matching example is in the range of ±8 parts per million per degree Celsius (ppm/°C). In fact, there is no problem of poor adhesion on the edge of the board, and the problems that have occurred in the conventional practice have indeed been improved. Please refer to FIG. 5 , which is a flow chart of a metal substrate pressing method for a non-steel plate layer according to the present invention. For the parts of the following components, please refer to the second to fourth figures. Step S101: The metal substrate pressing method includes the following The step of stacking the multi-array substrate material group 300 is disposed between a carrier plate 210 and an upper cover 220, and a non-steel protective interlayer 230 is disposed between the substrate material groups 300. One The substrate material group 300 of the group includes a metal plate 310 such as a metal plate, a copper foil layer 320, and an adhesive layer 330 disposed between the metal plate 310 and the 1335866 copper foil layer 320, and the non-steel protective layer 230 The coefficient of thermal expansion is similar to the coefficient of thermal expansion of the aluminum, copper metal plate 310 and the copper foil layer 320. Step S103: - the heating device 240 heats the substrate material group 300. 'Step S105: - The power device 250 drives the upper cover 220 and The carrier plate 210 presses the substrate material groups 300 such that the adhesive layer 330 bonds the metal plate 310 and the copper foil layer 320. Step S107: stopping the heating of the substrate material groups 300, and after the substrate/material group 300 is placed and cooled, separating the upper cover 220 and the carrier plate 210, and the adhesive layer 330 is solidified to bond the metal plate 310 and the copper foil layer 320. The substrate material group 300 is formed into a multi-array metal substrate 400. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, it is intended to cover various variations and equivalent arrangements within the scope of the patent scope of the invention claimed. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic view of a conventional metal substrate press-fit combination; the second figure is a schematic view of a first embodiment of a metal substrate press-fit combination of a non-steel plate layer of the present invention; Schematic diagram of the combination of the metal substrate of the present invention; and the fourth diagram is a schematic diagram of the second embodiment of the metal substrate press-bonding combination of the non-steel plate layer of the present invention; 12 1335866 The fifth figure is the metal of the non-steel plate layer of the present invention Flow chart of the substrate pressing method. [Main component symbol description] [Prior Art] Metal substrate press-fit combination 100 Upper cover 110 Carrier plate 120 Substrate material group 130 Metal plate 131 Copper foil layer 132 Adhesive layer 133 Protective interlayer group 140 Steel plate 141 Kraft paper layer 142 [This Invention] Metal substrate press-fit combination 200 carrier plate 210 upper cover plate 220 non-steel protective layer 230, 230a heating device 2400 power device 250 substrate material group 300, 300a, 300b, 300c metal plate 310, 310a, 310b 13 1335866 Copper foil layer 320, 320a, 320c Adhesive layer 330, 330a Metal substrate 400
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