TWI335200B - - Google Patents
Download PDFInfo
- Publication number
- TWI335200B TWI335200B TW95104432A TW95104432A TWI335200B TW I335200 B TWI335200 B TW I335200B TW 95104432 A TW95104432 A TW 95104432A TW 95104432 A TW95104432 A TW 95104432A TW I335200 B TWI335200 B TW I335200B
- Authority
- TW
- Taiwan
- Prior art keywords
- bonding
- circuit board
- nut
- column
- melting
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 241000237858 Gastropoda Species 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095104432A TW200731904A (en) | 2006-02-09 | 2006-02-09 | Circuit board combination method and its structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095104432A TW200731904A (en) | 2006-02-09 | 2006-02-09 | Circuit board combination method and its structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200731904A TW200731904A (en) | 2007-08-16 |
| TWI335200B true TWI335200B (enExample) | 2010-12-21 |
Family
ID=44217651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095104432A TW200731904A (en) | 2006-02-09 | 2006-02-09 | Circuit board combination method and its structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200731904A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI593173B (zh) | 2016-02-24 | 2017-07-21 | 達創科技股份有限公司 | 電力傳輸裝置及其製作方法 |
-
2006
- 2006-02-09 TW TW095104432A patent/TW200731904A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200731904A (en) | 2007-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI296905B (en) | Process for mounting electric parts and mounting apparatus | |
| US7886432B2 (en) | Electric components connecting method | |
| KR20110014598A (ko) | 인쇄회로기판을 제조하는 방법, 용도 및 인쇄회로기판 | |
| US20090075025A1 (en) | Electronic component soldering structure and electronic component soldering method | |
| TWI335200B (enExample) | ||
| TWI358978B (en) | Printed circuit board, printed circuit board assem | |
| TW569062B (en) | Thermal bonding device and method | |
| JP3915765B2 (ja) | 接合方法 | |
| JP2004318074A5 (enExample) | ||
| JP2023044113A5 (ja) | 画像形成装置の製造方法 | |
| JP2023044111A5 (ja) | 画像形成装置の製造方法 | |
| CN218050734U (zh) | 一种fpc焊接冶具和焊接系统 | |
| JPH10112584A (ja) | 回路基板の接続方法、回路基板の接続構造及びその構造を用いた液晶装置 | |
| TW200529520A (en) | Thermocompression bonding apparatus and method, flexible circuit board manufactured by that method and electronic apparatus equipped with that circuit board | |
| JP2000299555A (ja) | 回路基板の接続方法 | |
| JPH07202416A (ja) | 基板接続方法、基板接続構造、及びフレキシブル連結材 | |
| JP4644756B2 (ja) | スパイラル状接触子の接合方法 | |
| JPH06140554A (ja) | 電子部品の引出しリードおよびその接合法 | |
| JP3113987B2 (ja) | 電気的接続部材及びこれを用いた電気回路部品の接続方法 | |
| JPH043514Y2 (enExample) | ||
| JP2002204068A (ja) | 印刷配線板とフレキシブル配線板の接合方法 | |
| CN100417311C (zh) | 软性印刷电路板压焊结构与制造方法 | |
| JP3723991B2 (ja) | フラットケーブル及びフラットケーブルの接続方法 | |
| JP2007266268A (ja) | 熱圧着治具、熱圧着装置、及び基板接続方法 | |
| JPH08125328A (ja) | 電子部品の接合方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |