TWI334635B - - Google Patents
Download PDFInfo
- Publication number
- TWI334635B TWI334635B TW96110444A TW96110444A TWI334635B TW I334635 B TWI334635 B TW I334635B TW 96110444 A TW96110444 A TW 96110444A TW 96110444 A TW96110444 A TW 96110444A TW I334635 B TWI334635 B TW I334635B
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier
- electrostatic
- sensing
- wafer
- contact
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96110444A TW200839962A (en) | 2007-03-27 | 2007-03-27 | Contact sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96110444A TW200839962A (en) | 2007-03-27 | 2007-03-27 | Contact sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200839962A TW200839962A (en) | 2008-10-01 |
TWI334635B true TWI334635B (ko) | 2010-12-11 |
Family
ID=44212005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96110444A TW200839962A (en) | 2007-03-27 | 2007-03-27 | Contact sensor |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200839962A (ko) |
-
2007
- 2007-03-27 TW TW96110444A patent/TW200839962A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200839962A (en) | 2008-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4400965B2 (ja) | 積層化半導体パッケージ及びその製造方法 | |
CN101877339B (zh) | 导线架、封装体及其制造方法 | |
KR960706194A (ko) | 계층화된 도전 평면을 갖는 리드 프레임(a lead frame having layered conductive planes) | |
US20050205973A1 (en) | Board-on-chip packages | |
EP1160856A3 (en) | Flip chip type semiconductor device and method of manufacturing the same | |
JP2000208698A5 (ko) | ||
TWI266394B (en) | Semiconductor device and method of fabricating the same | |
JP2004063767A5 (ko) | ||
WO2005050699A3 (en) | Method of forming a semiconductor package and structure thereof | |
KR920007132A (ko) | 집적회로용 절연리드 프레임 및 그의 제조방법 | |
TW200832753A (en) | LED chip package structure with thickness guiding pin | |
JP2006507688A5 (ko) | ||
CN102569242A (zh) | 整合屏蔽膜的半导体封装件及其制造方法 | |
EP1651020A4 (en) | ELECTRODE FOR PACKAGING, PACKAGING, DEVICE, AND METHOD FOR PRODUCING THE DEVICE | |
WO2006044061A3 (en) | Die attach paddle for mounting integrated circuit die | |
TWI334635B (ko) | ||
CN102222627A (zh) | 具有晶圆尺寸贴片的封装方法 | |
TW200601533A (en) | Leadframe with a chip pad for double side stacking and method for manufacturing the same | |
CN105980840B (zh) | 制造具有凸起接触的半导体器件的方法 | |
WO2005065255A3 (en) | Semiconductor chip package | |
US10068882B2 (en) | High-frequency module | |
JP3174860U (ja) | 3dリードフレーム構造 | |
JP2007088220A (ja) | 半導体装置の製造方法 | |
JP3174238B2 (ja) | 半導体装置およびその製造方法 | |
JP2000133762A5 (ko) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |