200839962 . 九、發明說明： # 【發明所屬之技術領域】 本發明係關於一種接觸式感應器，特別是一種具有靜 電放電功能之接觸式感應器構裝結構設計。 〃 【先前技術】 目前應用於指紋辨識器、滑鼠、…等接觸式感應器構 裝結構設計，概如我國專利證書第1231584 !虎「接觸式感應 器封裝構造及其製造方法」發明專利案所揭示者，該接觸 籲式感應器之構裝構造主要係於—具有接地端的基板上黏著 -具有感應區之感應晶片’另設有至少—導電件設於該基 板上，該導電件電性連接該基板上的接地端，再以一封膠 體包覆該感應晶片以及該導電件，該感應晶片之感應區以 及導電件之部份顯露於封膠體外。 惟前述接觸式感應器之封裝構造設計，除可以其上之 感應晶片之感應區對使用者之手指指紋等提供辨識的功能 外，更透過該接地的導電件設計，導除使用者手指的靜電 ·’避免靜電對該感應晶片不可逆之損壞'然而，前揭接觸 式感應器須額外置入導電物質來製該導電件，不但增加製 造成本，且增加製程的複雜度，因而不利於接觸“應： 的產品競爭力。 【發明内容】 本心月之主要目的在於提供一種接觸式感應器，希藉 此設計解決先前既有接觸式感應器之製程複雜、成^ 南等缺點。 4 200839962 ' 為達成前揭目的，本發明所設計之接觸式感應器係包 . 括： 一載體’包括一絕緣本體、至少一靜電導引件以及數 焊墊，該絕緣本體上表面形成一下凹的晶片容置穴，該靜 電導引件係設於該晶片容置穴的側邊，該靜電導引件包括 接也墊 靜電條以及至少一導電塊，該接地塾及靜電 條分没於該載體下表面及上表面，該導電塊設於該載體内 。卩且電性連接於該靜電條與接地墊之間，該些焊墊佈設於 晶片容置穴之一側端，且自該载體上表面延伸至下表面； 一感應晶片，係沉置固定於該載體之晶片容置穴中， 其上表面具有一感應區，以及數接點間隔排列於該感應晶 片側端，該些接點各以導線連接該載體上相對應之焊墊 ;以及 匕覆體’设於该載體上表面具有焊墊之一端，將該 些焊墊、感應晶片具有接點之一端及該些導線包覆於内。 _ 本發明藉由前揭技術方案之設計，其特點在於：本發 月藉由5亥内設有靜電導引件之載體設計，使載體於製造過 季中成幵y 4塾的同時，一併成形該靜電導件，之後，再將 感應晶片沉置載體中，以打線接合手段使感應晶片上之接 點電性連接載體上的焊墊，再於該載體上設一包覆體，將 ^些焊墊、感應晶片具有接點之一端及該些導線包覆於内 ，即可完成該接觸式感應器，是故，本發明在製造過程中 可以免除先前技術於已成形之基板上置入導電物質成形該 導電件等瑣碎之步驟，進而減少製程步驟，降低成本，並 5 200839962 可得到較佳品質水準的接觸式感應器。 【實施方式】 如第一至三圖所示，係揭示本發明接觸式感應器之一 較佳實施例，由圖中可以見及，該接觸式感應器係包括一載 體（10)、〜感應晶片（20)以及包覆體（3〇)， 其中： 〇)包括一絕緣本體（11)、至 該載體200839962 . Nine, invention description: # [Technical field to which the invention pertains] The present invention relates to a contact inductor, and more particularly to a contact inductor structure design having an electrostatic discharge function. 〃 【Prior Art】 At present, it is applied to the design of the sensor structure of fingerprint sensor, mouse, etc., such as China Patent Certificate No. 1231584! Tiger "contact inductor package structure and its manufacturing method" invention patent case It is disclosed that the structure of the contact-call sensor is mainly attached to the substrate having the grounding end - the sensing chip having the sensing area is further provided with at least a conductive member disposed on the substrate, and the conductive member is electrically The grounding end of the substrate is connected, and the sensing chip and the conductive member are covered with a gel. The sensing area of the sensing chip and a portion of the conductive member are exposed outside the sealing body. However, the package structure design of the contact sensor can not only provide the function of identifying the finger fingerprint of the user on the sensing area of the sensing chip, but also design the static electricity of the user's finger through the grounded conductive member design. · 'Avoid static electricity irreversible damage to the sensor chip' However, the front contact sensor needs to be additionally placed with conductive material to make the conductive member, which not only increases the manufacturing cost, but also increases the complexity of the process, which is not conducive to contact "should be : Product competitiveness. [Invention] The main purpose of this month is to provide a contact sensor, which is designed to solve the shortcomings of the previous contact sensor, which is complicated and complicated. 4 200839962 ' The contact sensor package designed by the present invention comprises: a carrier 'including an insulative body, at least one electrostatic guiding member and a plurality of solder pads, the upper surface of the insulating body forming a concave wafer receiving a hole, the static guiding member is disposed on a side of the wafer receiving hole, the static guiding member comprises a bonding pad and at least one conductive block The grounding bar and the static strip are not disposed on the lower surface and the upper surface of the carrier, and the conductive block is disposed in the carrier, and is electrically connected between the electrostatic strip and the ground pad, and the pads are disposed on the wafer One side of the hole is disposed, and extends from the upper surface of the carrier to the lower surface; a sensing wafer is fixed in the wafer receiving hole of the carrier, and the upper surface thereof has a sensing area and a plurality of contact intervals Arranging on the side of the sensing chip, the contacts are respectively connected to the corresponding pads on the carrier by wires; and the covering body is disposed on the upper surface of the carrier and has one end of the pad, the pads, the sensing chip One end of the contact and the wires are covered. _ The invention is designed by the prior art, and the feature is that the carrier is designed by the carrier with the electrostatic guiding member within 5 The electrostatic guiding member is formed together in the middle of the manufacturing process, and then the sensing wafer is placed in the carrier, and the contacts on the sensing wafer are electrically connected to the pads on the carrier by wire bonding. And further providing a covering body on the carrier, The solder pads and the sensing wafers have one end of the contacts and the wires are covered therein to complete the contact inductor. Therefore, the present invention can eliminate the prior art on the formed substrate during the manufacturing process. Into the conductive material to form the conductive member and other trivial steps, thereby reducing the process steps, reducing costs, and 5,039,962 can obtain a better quality level of contact sensors. [Embodiment] As shown in the first to third figures, reveal A preferred embodiment of the contact sensor of the present invention is as seen in the figure. The contact sensor comprises a carrier (10), a sensing chip (20) and a covering body (3〇), wherein: 〇) including an insulative body (11) to the carrier
電導引件（1 2 )以及數焊墊（i 3 )，該絕緣本體（i 1)上表面形成_向下凹陷的晶片容置穴（η工），該 靜電導引件(1 2)係設於該晶片容置穴"工丄）的侧 且自錢體（1 Q)上表面延伸至下表面，所述之靜 电導引件（12)包括一接地墊（1一 1 2 2 )以及至少 道干右/ 主夕—導電塊（1 2 3 )，該接地墊（1 2 1 )設於該載體（』 於該載體（10)上？1下表面，該靜電條（122)設 載體（1〇)内部且if面’該導電&(123)設於該 电性連接於該靜電條（1 2 2 )與接 地墊（1 2 1 )之„ _ 〜卩 曰’"亥些焊墊（1 3 )佈設於晶片容置 八主 θ之側端，且自該載體（1 0 )上表面延伸至 '第提：外:ρ連接以及感應晶片（2〇)連接之用。 々弟至一圖所不之較佳實施例，該載體（1 0)具 有一靜電導引件（19、 /、 、1 2 )，分別設置該晶片容置穴（1 Ί 1 )兩侧，所述之靜蕾 静電V引件（i 2)之接地墊（ )可為長條狀，該靜曾仡f…。。、A 、丄匕丄 、蓄/ 静電條（1 2 2 )為長條狀，且該靜電 導引件（1 2 )中且右献加 "有數個導電塊（丄2 3)間隔排列於 6 200839962 ‘ 載體（1 0)内部且上下連接靜電條（1 2 2)及接地墊 (12 1)。 該感應晶片（2 0 )具有一感應區（2 1 )位於感應 晶片（2 0 )之上表面，以及數接點（2 2 )設於該感應 晶片（2 0 )之上表面，且位於該感應區（2 1 )侧端呈 間隔排列狀，該感應晶片（2 0 )係沉置固定於該载體（ 10)之晶片容置穴（111)中，該些接點（22)鄰 近該載體（1 0 )並以數導線（2 3 )分別連接該載體（ 1 0 )上表面相對應之焊墊（1 3 )。 該包覆體（3 〇 )可為模塑成形的實心封膠體，並成 形於該載體（1 〇)上表面具有焊墊（1 3)之一端，將 該些焊墊、感應晶片（2 〇 )具有接點之一端及該些導線 包覆於内，或是，該包覆體亦可為預先成形之中空蓋體， 其開口朝下，使其蓋合固設於該載體（i 〇 )上表面具有 焊墊（1 3 )之一端，將該些焊墊（i 3 )、感應晶片（ 20)具有接點（22)之一端及該些導線（23)包覆 電路板上， ，並使該靜電導引件（1 2 )An electric guiding member (12) and a plurality of pads (i3), the upper surface of the insulating body (i1) forming a wafer receiving hole (n=) which is recessed downward, the static guiding member (1 2) It is disposed on the side of the wafer receiving hole "worker" and extends from the upper surface of the body (1Q) to the lower surface, and the electrostatic guiding member (12) includes a grounding pad (1-12 2 And at least a dry right/main eve-conductive block (1 2 3 ), the grounding pad (1 2 1 ) is disposed on the carrier (10) on the lower surface of the carrier (1), the static strip (122) The carrier (1〇) is internally and the if surface 'the conductive & (123) is disposed on the electrically connected strip (1 2 2 ) and the ground pad (1 2 1 ) „ _ 卩曰 &'" The solder pads (13) are disposed on the side end of the wafer accommodating the eight main θ, and extend from the upper surface of the carrier (10) to the 'first: outer: ρ connection and the sensing wafer (2 〇) connection In a preferred embodiment of the present invention, the carrier (10) has an electrostatic guiding member (19, /, , 1 2 ), respectively disposed on both sides of the wafer receiving hole (1 Ί 1 ) , the grounding pad of the static bud electrostatic V-lead (i 2) ) can be a long strip, the static 仡 仡, ..., A, 丄匕丄, storage / static strip (1 2 2) is elongated, and the static guide (1 2) is in the right There are several conductive blocks (丄2 3) spaced at 6 200839962 'carrier (1 0) inside and connected to the static strip (1 2 2) and ground pad (12 1). The sensor chip (20) A sensing area (2 1 ) is located on the upper surface of the sensing wafer (20), and a plurality of contacts (2 2 ) are disposed on the upper surface of the sensing wafer (20) and located on the sensing area (2 1 ) side The sensing wafers (20) are placed and fixed in the wafer receiving holes (111) of the carrier (10), and the contacts (22) are adjacent to the carrier (10) and The plurality of wires (23) are respectively connected to the corresponding pads (13) on the upper surface of the carrier (10). The covering body (3 〇) may be a molded solid encapsulant and formed on the carrier ( 1)) the upper surface has one end of the solder pad (1 3), and the solder pads, the sensing chip (2 〇) have one end of the contact and the wires are covered, or the covering body may be Pre-formed a cover body having an opening facing downward, and the cover is fixed on the upper surface of the carrier (i 〇) and has one end of the pad (1 3 ), and the pads (i 3 ) and the sensing chip (20) are connected One end of the point (22) and the wires (23) cover the circuit board, and the electrostatic guiding member (1 2 )
本毛明以别揭接觸式感應器構裝結構設計於使用時， 可令該接觸式感應器透過表面黏著技術固接於控制裝置的 12)接地’如第四圖所 20)之感應區感 ▲，同時透過該接地 22)導除使用者手指上 (20)或控制電路不可 7 200839962 逆之損壞。 • 【圖式簡單說明】 第一圖係本發明接觸式感應器之一較隹實施例之立體 分解示意圖。 第一圖係第一圖所示接觸式感應器較佳實施例組成後 之立體示意圖。 第二圖係第一圖所示接觸式感應器較佳實施例之組合 剖面示意圖。 第四圖係第一圖所示接觸式感應器較佳實施例之使用 狀恶參考圖。 【主要元件符號說明】 (1 1 )絕緣本體 (1 2 )靜電導引件 (1 2 2 )靜電條 (1 3 )焊墊 (2 1 )感應區 (2 3 )導線 (1 〇)載體 (1 1 1 )晶片容置穴 (121)接地塾 (1 2 3 )導電塊 (2 〇)感應晶片 (2 2 )接點 (3 〇 )包覆體 8Ben Maoming is designed to be used in a different contact sensor structure, which allows the contact sensor to be fixed to the grounding of the control device through the surface adhesion technology (as shown in the fourth figure 20). ▲, at the same time through the ground 22) to guide the user's finger (20) or control circuit can not be reversed. • [Simple Description of the Drawings] The first figure is a perspective exploded view of one of the contact sensors of the present invention. The first figure is a perspective view of the preferred embodiment of the contact inductor shown in the first figure. The second drawing is a schematic cross-sectional view of a preferred embodiment of the contact inductor shown in the first figure. The fourth figure is a reference diagram of the preferred embodiment of the contact sensor shown in the first figure. [Main component symbol description] (1 1) Insulating body (1 2 ) Electrostatic guide (1 2 2 ) Electrostatic strip (1 3 ) Pad (2 1 ) Sensing area (2 3 ) Conductor (1 〇) carrier ( 1 1 1) wafer receiving hole (121) grounding 塾 (1 2 3) conductive block (2 〇) sensing wafer (2 2 ) contact (3 〇) cladding 8