TWI334635B - - Google Patents

Download PDF

Info

Publication number
TWI334635B
TWI334635B TW096110444A TW96110444A TWI334635B TW I334635 B TWI334635 B TW I334635B TW 096110444 A TW096110444 A TW 096110444A TW 96110444 A TW96110444 A TW 96110444A TW I334635 B TWI334635 B TW I334635B
Authority
TW
Taiwan
Prior art keywords
carrier
electrostatic
sensing
wafer
contact
Prior art date
Application number
TW096110444A
Other languages
English (en)
Chinese (zh)
Other versions
TW200839962A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW096110444A priority Critical patent/TW200839962A/zh
Publication of TW200839962A publication Critical patent/TW200839962A/zh
Application granted granted Critical
Publication of TWI334635B publication Critical patent/TWI334635B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
TW096110444A 2007-03-27 2007-03-27 Contact sensor TW200839962A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096110444A TW200839962A (en) 2007-03-27 2007-03-27 Contact sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096110444A TW200839962A (en) 2007-03-27 2007-03-27 Contact sensor

Publications (2)

Publication Number Publication Date
TW200839962A TW200839962A (en) 2008-10-01
TWI334635B true TWI334635B (enExample) 2010-12-11

Family

ID=44212005

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110444A TW200839962A (en) 2007-03-27 2007-03-27 Contact sensor

Country Status (1)

Country Link
TW (1) TW200839962A (enExample)

Also Published As

Publication number Publication date
TW200839962A (en) 2008-10-01

Similar Documents

Publication Publication Date Title
JP4400965B2 (ja) 積層化半導体パッケージ及びその製造方法
CN101877339B (zh) 导线架、封装体及其制造方法
KR960706194A (ko) 계층화된 도전 평면을 갖는 리드 프레임(a lead frame having layered conductive planes)
JPH11354702A5 (enExample)
US20050205973A1 (en) Board-on-chip packages
EP1160856A3 (en) Flip chip type semiconductor device and method of manufacturing the same
JP2000208698A5 (enExample)
TWI266394B (en) Semiconductor device and method of fabricating the same
EP1187202A3 (en) Semiconductor package
JP2004063767A5 (enExample)
CN101015055A (zh) 功率半导体封装
KR920007132A (ko) 집적회로용 절연리드 프레임 및 그의 제조방법
JP2006507688A5 (enExample)
CN105405816A (zh) 一种指纹识别传感器的封装结构
TWI334635B (enExample)
CN103400826B (zh) 半导体封装及其制造方法
CN102222627A (zh) 具有晶圆尺寸贴片的封装方法
TW200601533A (en) Leadframe with a chip pad for double side stacking and method for manufacturing the same
US20180130778A1 (en) High-frequency module
WO2005065255A3 (en) Semiconductor chip package
CN102903645B (zh) 平面式半导体元件及其制作方法
WO2006044061A3 (en) Die attach paddle for mounting integrated circuit die
JP3174238B2 (ja) 半導体装置およびその製造方法
JP2000133762A5 (enExample)
JP4386552B2 (ja) 受発光型半導体装置の構造

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees