TWI326405B - Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure - Google Patents

Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure Download PDF

Info

Publication number
TWI326405B
TWI326405B TW095146673A TW95146673A TWI326405B TW I326405 B TWI326405 B TW I326405B TW 095146673 A TW095146673 A TW 095146673A TW 95146673 A TW95146673 A TW 95146673A TW I326405 B TWI326405 B TW I326405B
Authority
TW
Taiwan
Prior art keywords
liquid
module
heat
heat exchanger
evaporator
Prior art date
Application number
TW095146673A
Other languages
English (en)
Chinese (zh)
Other versions
TW200732900A (en
Inventor
Brian A Scott
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200732900A publication Critical patent/TW200732900A/zh
Application granted granted Critical
Publication of TWI326405B publication Critical patent/TWI326405B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
TW095146673A 2005-12-28 2006-12-13 Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure TWI326405B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/321,245 US20070144199A1 (en) 2005-12-28 2005-12-28 Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure

Publications (2)

Publication Number Publication Date
TW200732900A TW200732900A (en) 2007-09-01
TWI326405B true TWI326405B (en) 2010-06-21

Family

ID=37950217

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095146673A TWI326405B (en) 2005-12-28 2006-12-13 Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure

Country Status (3)

Country Link
US (1) US20070144199A1 (fr)
TW (1) TWI326405B (fr)
WO (1) WO2007078767A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402475B (fr) * 2010-12-24 2013-07-21

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012142737A1 (fr) * 2011-04-18 2012-10-26 Empire Technology Development Llc Dissipation thermique utilisant une circulation de réfrigérant
US10010811B2 (en) 2013-05-28 2018-07-03 Empire Technology Development Llc Evaporation-condensation systems and methods for their manufacture and use
WO2014190484A1 (fr) 2013-05-28 2014-12-04 Empire Technology Development Llc Systèmes de pellicules minces et leurs procédés d'utilisation et de fabrication

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE343217B (fr) * 1970-07-23 1972-03-06 Lkb Medical Ab
US4790370A (en) * 1987-08-19 1988-12-13 Sundstrand Corporation Heat exchanger apparatus for electrical components
US5220804A (en) * 1991-12-09 1993-06-22 Isothermal Systems Research, Inc High heat flux evaporative spray cooling
GB9312984D0 (en) * 1993-06-23 1993-08-04 Bespak Plc Atomising dispenser
DE69732256T2 (de) * 1996-05-16 2005-12-22 L-3 Communications Integrated Systems L.P. Wärmeableitungssystem und verfahren zur kühlung von wärmerzeugenden bauteilen
US5924482A (en) * 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US6349760B1 (en) * 1999-10-22 2002-02-26 Intel Corporation Method and apparatus for improving the thermal performance of heat sinks
JPWO2002046677A1 (ja) * 2000-12-04 2004-04-08 富士通株式会社 冷却システムおよび吸熱装置
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI402475B (fr) * 2010-12-24 2013-07-21

Also Published As

Publication number Publication date
US20070144199A1 (en) 2007-06-28
WO2007078767A2 (fr) 2007-07-12
TW200732900A (en) 2007-09-01
WO2007078767A3 (fr) 2007-12-21

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MM4A Annulment or lapse of patent due to non-payment of fees