1325735 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種封裝方法及結構，尤係關於一種有機 發光顯示裝置（Organic Light Emitting Device ; OLED)之封 裝方法及結構。 【先前技術】 目前有機發光顯示裝置常見之技術為應用薄膜覆晶封裝 (Chip on Film ; COF)元件與顯示之玻璃基板相互接著，此 技術係將驅動1C直接接合在薄膜上，COF是一種將驅動ic 之晶粒覆晶接合（Flip Chip Bonding)在軟性電路（Flexible Printed Circuit ; FPC)板基材上的技術，也就是可將驅動IC 及其電子零件直接固定於薄膜上，可省去傳統的印刷電路 板，而達到更輕薄短小的目的。 而有機發光顯示裝置之另一種常見之技術為應用玻璃覆 晶封裝（Chip on Glass; C0G)技術於具顯示電路之玻璃基板 上，乃將驅動1C直接設置於玻璃基板上，此技術之優點為 提商整體封裝密度及減輕重量，從而使得顯示面板更為輕 薄’以及可減少使用材料降低生產成本。 然而有機發光顯示裝置卻常因導線區之導線產生侵蝕， 而導致電路燒毀或短路之情形，故導致有機發光顯示裝置 之發光區顯不不正常，發生諸如不正常亮線或不正常暗線 之情形。 圖1⑷係習知之有機發光顯示裝置封裝結構之俯視示意 圖，該有機發光顯示冑置10包含形成於一基㈣0之上之一 *5- 1325735 發光區110及一導線區120。該發光區110内包含複數個陽極 線及複數個陰極線（圖未詳示），係疊置於該基板1〇〇上，並 有上蓋體150與基板1〇〇將發光區110内線路密封於一空間 内。該導線區120包含複數個連接該陽極線之陽極導線i2〇a 及複數個連接該陰極線之陰極導線120b，係分別疊置於該 發光區110外之基板1〇〇上。 圖1(b)係圖1(a)有機發光顯示裝置封裝結構沿a— A剖面 線之剖面圖。無論是COF或COG方式的有機發光顯示裝置 ’習知之有機發光顯示裝置10之封裝方法為首先覆蓋一第 一封膠層140於該發光區11〇外圍該導線區12〇之基板1〇〇上 ;接著再覆蓋一上蓋體150於該第一封膠層14〇及該發光區 110之上。最後覆蓋一第二封膠層16〇於該導線區12〇之基板 100 上。 但實際應用上在該第二封膠層160與該上蓋體150之接缝 處仍會有部分的水氣與氧氣會滲透進該封裝結構内，使得 該陽極導線120a或該陰極導線120b導線受到侵蝕，而導致 有機發光顯示裝置電路發生燒毀或短路之情形。 【發明内容】 本發明之主要目的係在提供一種有機發光顯示裝置之封 裝方法及結構，俾能降低或避免導線因為環境中水氣與氧 氣導致劣化’減彡導線燒毀或短路，提高顯示品質，延長 使用壽命’並降低不良品損失之成本。 該有機發光顯示裝置包含形成於—基板上之―發光區及 -導線區，該導線區包含複數之陽極導線及複數個陰極導 線》 月之封裝方法包含以下步驟：首先，覆蓋—絕緣材 2於該導線區之部分區域，以包覆該陽極導線或該陰極 導線’再覆蓋-第-封黟層於該絕緣材料層上；接著覆蓋 -上蓋體於該第—封膠層及該發光區之上；最後覆蓋一第 二封膝層於該絕緣材料層上及該導線區未被覆蓋之區域上[Technical Field] The present invention relates to a packaging method and structure, and more particularly to a method and structure for packaging an organic light emitting device (OLED). [Prior Art] At present, a common technique for an organic light-emitting display device is to apply a film-on-chip (COF) device and a glass substrate to be displayed. This technology directly drives the driving 1C on the film, and the COF is a kind of The technology of driving ic's Flip Chip Bonding on a flexible printed circuit (FPC) board substrate, that is, the driver IC and its electronic components can be directly fixed on the film, eliminating the need for conventional The printed circuit board achieves the goal of being lighter, thinner and shorter. Another common technique of the organic light-emitting display device is to apply the chip on glass (C0G) technology to the glass substrate with the display circuit, and the driving 1C is directly disposed on the glass substrate. The advantage of this technology is The overall package density and weight reduction of the supplier make the display panel lighter and thinner, and the use of materials can be reduced to reduce production costs. However, the organic light-emitting display device often causes erosion of the wires in the wire region, which causes the circuit to burn out or short-circuit, so that the light-emitting region of the organic light-emitting display device is not abnormal, such as an abnormal bright line or an abnormal dark line. . 1(4) is a top plan view showing a package structure of a conventional organic light-emitting display device. The organic light-emitting display device 10 includes a light-emitting region 110 and a wire region 120 formed on a substrate (4). The light-emitting area 110 includes a plurality of anode lines and a plurality of cathode lines (not shown in detail) stacked on the substrate 1 and has a cover 150 and a substrate 1 to seal the lines in the light-emitting area 110. Within the space. The wire region 120 includes a plurality of anode wires i2a connected to the anode wires and a plurality of cathode wires 120b connected to the cathode wires, which are respectively stacked on the substrate 1 outside the light-emitting region 110. Figure 1 (b) is a cross-sectional view of the package structure of the organic light-emitting display device of Figure 1 (a) taken along line a - A. The organic light-emitting display device of the COF or COG mode is generally packaged by first covering a first sealant layer 140 on the substrate 1 of the lead-out region 12 of the light-emitting region 11 Then, an upper cover 150 is covered on the first sealant layer 14 and the light-emitting area 110. Finally, a second sealant layer 16 is covered on the substrate 100 of the lead region 12〇. However, in practice, some moisture and oxygen will still penetrate into the package structure at the joint between the second sealant layer 160 and the upper cover 150, so that the anode lead 120a or the cathode lead 120b is exposed. Erosion, which causes the organic light-emitting display device circuit to burn or short circuit. SUMMARY OF THE INVENTION The main object of the present invention is to provide a packaging method and structure of an organic light-emitting display device, which can reduce or avoid the deterioration of the wire due to moisture and oxygen in the environment, and reduce the burnt or short circuit of the wire to improve the display quality. Extend the service life' and reduce the cost of defective products. The organic light-emitting display device comprises a light-emitting region and a wire region formed on a substrate, the wire region comprising a plurality of anode wires and a plurality of cathode wires. The packaging method of the month comprises the following steps: First, the covering-insulating material 2 is a portion of the wire region to cover the anode wire or the cathode wire 're-covering-first sealing layer on the insulating material layer; then covering the upper cover body to the first sealing layer and the light emitting region Finally covering a second knee layer on the insulating material layer and the uncovered area of the wire area
’以保護在該第-封膠層外導線區之該陽極導線或該陰極 導線不受外界水氣或氧氣的侵蝕。 藉由本發明之有機發光顯示裝置封裝方法產生之封裝結 構此夠凡全阻絕外在的水氣與氧氣對顯示裝置鄰接發光 區之部份導線產生侵#。，若該第二封膠層與該上蓋體之 接縫處有部分的水氣與氧氣滲透進入該封裝結構内由於 有該絕緣材料層包覆該陽極導線或該陰極導線，使得導線 可免於受到侵蝕，進而使有機發光顯示裝置電路不會發生 燒毀或短路之情形。The anode lead or the cathode lead that protects the outer lead region of the first sealant layer is not eroded by external moisture or oxygen. The package structure produced by the method of packaging the organic light-emitting display device of the present invention is sufficient to completely block the external moisture and oxygen from invading a part of the wires adjacent to the light-emitting region of the display device. If a portion of the moisture and oxygen permeate into the package structure at the joint between the second sealant layer and the upper cover body, the lead wire may be protected from the anode wire or the cathode wire by the insulating material layer. It is eroded, so that the circuit of the organic light-emitting display device does not burn or short-circuit.
【實施方式】 圖2(a)係本發明第一實施例之有機發光顯示裝置封裝結 構之俯視示意圖，該有機發光顯示裝置封裝結構2〇包含形 成於一基板200之上之一發光區21〇及一導線區22〇。該發光 區210内包含複數個疊置於該基板2〇〇上之陽極線及複數個 陰極線（圖未示），並有上蓋體25〇與基板2〇〇將發光區21〇内 線路密封於一空間内。該導線區22〇包含複數個連接該陽極 線之陽極導線220a及複數個連接該陰極線之陰極導線220b ’係分別疊置於該發光區21〇外之基板200上。該陽極導線 ^^735 220a及該陰極導線22仳共同匯集在該基板2⑼之同一邊。 圖2(b)係圖2(a)有機發光顯示裝置封裝結構沿B — B剖面 "面圖。該封裝結構係以一封裝方法來實現，該方法 之步驟如下： 首先’覆蓋一絕緣材料層230於該導線區220之部分區域 ’以包覆該陽極導線220a或該陰極導線220b。覆蓋方式為 對該陽極導線22〇a或陰極導線22〇1)實施蒸鍍、濺鍍、浸鍍 喷霧、噴印、網印、滾筒、旋轉塗佈或手動塗抹等方式 包覆絕緣材料以隔絕陽極導線或陰極導線與大氣的接觸。 使用之絕緣材料以滿足下列數值為較佳實施條件：（1)吸水 率<0.15% ; (2)常溫絕緣阻抗>10ΐ3Ω ; (3)熱變形溫度>2〇〇 C，（4)厚度介於Ο.ΐμπι〜imm。該絕緣材料層23〇之材料可 選自二氧化石夕（Si02)、二氧化鈦（Ti02)、氮化石夕（si3N4)、環 氧樹脂（Epoxy)、不飽和聚酯樹脂、陶磁材料、塑鋼材料、 鐵氟龍（Teflon)、聚亞醯胺（Poly-Imide)、及鄰甲盼樹脂 (Novolac)等抗氧化絕緣材料。該絕緣材料係以物理黏附或 化學共價鍵鍵結或光化學反應硬化方式成膜覆蓋於該陽極 導線220a或陰極導線220b上。 接著再覆蓋一第一封膠層240於該絕緣材料層230上，以及 該發光區210及該絕緣材料層230之間之導線區220上。該第 一封膠層240之材料於本實施例為紫外光固化樹脂（UV膠）。 再覆蓋一上蓋體250於該第一封膠層240及該發光區21〇 之上。因該第一封膠層240能緊密黏著接合該上蓋體25〇與 該基板200 ’從而使得該發光區210位於一密封之空間内。 -8- 1325735 最後覆蓋一第二封膠層260於該絕緣材料層23〇上及該導線 H22G之未被覆蓋區域。該第二封膠層26q能黏著接合該上 蓋體250之邊緣區域’以保護在第一封膠層24〇外導線區22〇 之該陽極導線220a或該陰極導線2通不受外界水氣或氧氣 的侵姓。該第二封移層260之材料可選自㈣膠（Silic〇ne) * 或紫外光固化樹脂（UV膠）。 . 藉由本發明之有機發光顯示裝置封裝方法產生之封裝結 • 構，此夠70全阻絕外在的水氣與氧氣對顯示裝置的外部導 線產生侵蝕。若該第二封膠層26〇與該上蓋體25〇之接縫處 有部分的水氣與氧氣滲透進入該封裝結構内，由於有該絕 緣材料層230包覆該陽極導線220a或該陰極導線220b，使得 導線可免於党到侵蝕，進而使有機發光顯示裝置電路不會 發生燒毀或短路之情形。 圖3(a)〜3(d)係本發明之不同實施例中之絕緣材料層覆蓋 於該導線區之俯視圖。 • 如圖3(a)所示，該基板200上覆蓋一絕緣材料層231於導線 區220之部分區域，該單一區塊之絕緣材料層23丨包覆該陽 極導線220a。 如圖3(b)所示，該基板200上覆蓋一絕緣材料層232於導 線區220之部分區域，並向左右延伸包覆該陽極導線22〇a及 陰極導線220b，即以單一區塊之絕緣材料層232包覆該陽極 導線220a及陰極導線220b。 如圖3(c)所示，該基板2〇〇上覆蓋一絕緣材料層233於導線 區220之部分區域。該絕緣材料層233包含三個不相連接之 1325735 區塊233a、233b及233c，絕緣材料層區塊233b包覆該陽極 導線220a，絕緣材料層區塊233a及233c分別包覆兩側該陰 極導線220b。 如圖3(d)所示，該基板200上覆蓋一單一區塊之絕緣材料 層234於導線區220之部分區域，除向左右延伸包覆該陽極 導線220a及陰極導線220b外，更向該基板200之兩側向上延 伸包覆該陰極導線220b。 圖4(a)係本發明第二實施例之有機發光顯示裝置之基板 400俯視示意圖，該有機發光顯示裝置包含形成於一基板 400之上之一發光區410及一導線區420。發光區410内包含 複數個疊置於該基板400上之陽極線及複數個陰極線（圖未 示）。該導線區420包含複數個連接該陽極線之陽極導線 420a及複數個連接該陰極線之陰極導線420b，係疊置於該 發光區410外之基板400上。與圖3(a)不同的是該陽極導線 420a及陰極導線420b分別匯集在該基板400之相鄰邊。 圖4(b)所示係覆蓋一絕緣材料層430於於圖4(a)中該導線 區420之部分區域之俯視圖，圖4(b)所示該絕緣材料層430 分別包覆該陽極導線420a及該陰極導線420b。 圖5所示係圖3(b)-3(d)中該絕緣材料層230包覆該陽極導 線220a及陰極導線220b之剖面圖。該陽極導線220a之材料 為導電玻璃氧化銦錫（indium tin oxide ; ITO)，該陰極導線 220b之材料為導電玻璃氧化銦錫220bl上佈有金屬層220b2 以增加導電電流。 不論有機發光顯示裝置之相對應驅動1C係採薄膜覆晶封 -10- 1325735 - 裝（C0F)或玻璃覆晶封裝（COG)之方式與該有機發光顯示 • 裝置之基板接合’均適用本發明實施例之有機發光顯示裝 置之封裝方法及結構。 本發明之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 者離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本發明之 φ 替換及修飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1(a)係習知之有機發光顯示裝置封裝結構之俯視示意 圖， 圖10)係圖1 (a)有機發光顯示裝置封裝結構之剖面圖； 圖2(a)係本發明第一實施例之有機發光顯示裝置封裝結 構之俯視示意圖； 圖2(b)係圖2(a)有機發光顯示裝置封裝結構之剖面圖； • 圖3(a)〜3(d)係本發明之不同實施例中之絕緣材料層覆蓋 於該導線區之俯視圖； 圖4(a)係係本發明第二實施例之有機發光顯示裝置之基 板俯視示意圖； 圖4(b)所示係絕緣材料層覆蓋於圖4(a)中該導線區之俯 視圖；以及 圖5所示係圖3(b)_3(d)中該絕緣材料層包覆該陽極導線 及陰極導線之剖面圖。 【主要元件符號說明】 1325735 10、20有機發光顯示裝 100基板 120導線區 120b陰極導線 150上蓋體 200基板 220導線區 220b陰極導線2 is a top plan view of a package structure of an organic light emitting display device according to a first embodiment of the present invention. The package structure 2 of the organic light emitting display device includes a light emitting region 21 formed on a substrate 200. And a wire area 22 〇. The light-emitting region 210 includes a plurality of anode wires and a plurality of cathode wires (not shown) stacked on the substrate 2, and the upper cover 25 and the substrate 2 are sealed on the inner region of the light-emitting region 21 Within a space. The wire region 22A includes a plurality of anode wires 220a connected to the anode wires and a plurality of cathode wires 220b' connected to the cathode wires, respectively, stacked on the substrate 200 outside the light-emitting region 21b. The anode lead ^^735 220a and the cathode lead 22 are collectively collected on the same side of the substrate 2 (9). 2(b) is a cross-sectional view of the package structure of the organic light-emitting display device of FIG. 2(a) taken along line B-B. The package structure is implemented by a packaging method. The method has the following steps: First, a portion of the insulating material layer 230 is overlaid on a portion of the wire region 220 to cover the anode wire 220a or the cathode wire 220b. The covering method is that the anode wire 22a or the cathode wire 22〇1) is coated with an insulating material by evaporation, sputtering, immersion spraying, printing, screen printing, roller, spin coating or manual application. Insulate the anode or cathode wires from contact with the atmosphere. The insulating material used is preferably in the following conditions: (1) water absorption rate <0.15%; (2) room temperature insulation resistance > 10 ΐ 3 Ω; (3) heat distortion temperature > 2 〇〇 C, (4) The thickness is between Ο.ΐμπι~imm. The material of the insulating material layer 23 can be selected from the group consisting of SiO2 (SiO2), Titanium Dioxide (Ti02), Nitride Xibium (si3N4), Epoxy (Epoxy), unsaturated polyester resin, ceramic material, plastic steel material, Anti-oxidation insulating materials such as Teflon, Poly-Imide, and Novolac. The insulating material is formed on the anode lead 220a or the cathode lead 220b by physical adhesion or chemical covalent bonding or photochemical reaction hardening. Then, a first sealant layer 240 is overlaid on the insulating material layer 230, and the wiring region 220 between the light-emitting region 210 and the insulating material layer 230. The material of the first adhesive layer 240 is a UV curable resin (UV adhesive) in this embodiment. An upper cover body 250 is further disposed on the first sealant layer 240 and the light-emitting area 21A. The first sealing layer 240 can be closely adhered to the upper cover 25 and the substrate 200' such that the light-emitting area 210 is located in a sealed space. -8- 1325735 finally covers a second sealant layer 260 on the insulating material layer 23 and the uncovered area of the wire H22G. The second sealant layer 26q can be adhesively bonded to the edge region of the upper cover body 250 to protect the anode lead 220a or the cathode lead 2 of the first sealant layer 24 from the outside of the lead layer 220 from external moisture or The invasion of oxygen. The material of the second sealing layer 260 may be selected from (4) gel (Silic) or UV curable resin (UV glue). The package structure produced by the organic light emitting display device encapsulation method of the present invention is sufficient to prevent external moisture and oxygen from eroding the external wires of the display device. If a portion of the moisture and oxygen permeate into the package structure between the second sealant layer 26 and the seam of the upper cover body 25, the anode wire 220a or the cathode wire is covered by the insulating material layer 230. 220b, the wire can be prevented from being eroded by the party, so that the circuit of the organic light-emitting display device does not burn or short-circuit. 3(a) to 3(d) are plan views of the insulating material layer in different embodiments of the present invention covering the wire region. As shown in FIG. 3(a), the substrate 200 is covered with a layer 231 of insulating material in a portion of the wire region 220, and the insulating layer 23 of the single block covers the anode wire 220a. As shown in FIG. 3(b), the substrate 200 is covered with a layer 232 of insulating material in a portion of the wire region 220, and extends to the left and right to cover the anode wire 22a and the cathode wire 220b, that is, a single block. The insulating material layer 232 covers the anode lead 220a and the cathode lead 220b. As shown in FIG. 3(c), the substrate 2 is covered with a layer of insulating material 233 in a portion of the wire region 220. The insulating material layer 233 includes three unconnected 1325735 blocks 233a, 233b, and 233c. The insulating material layer block 233b covers the anode lead 220a, and the insulating material layer blocks 233a and 233c respectively cover the cathode lead. 220b. As shown in FIG. 3(d), the substrate 200 is covered with a single block of insulating material layer 234 in a portion of the wire region 220, except that the anode wire 220a and the cathode wire 220b are covered to the left and right. The two sides of the substrate 200 extend upward to cover the cathode wire 220b. 4(a) is a top plan view of a substrate 400 of an organic light emitting display device according to a second embodiment of the present invention. The organic light emitting display device includes a light emitting region 410 and a wire region 420 formed on a substrate 400. The light-emitting area 410 includes a plurality of anode lines and a plurality of cathode lines (not shown) stacked on the substrate 400. The wire region 420 includes a plurality of anode wires 420a connected to the anode wires and a plurality of cathode wires 420b connected to the cathode wires, and is stacked on the substrate 400 outside the light-emitting region 410. Different from Fig. 3(a), the anode lead 420a and the cathode lead 420b are respectively collected on adjacent sides of the substrate 400. 4(b) is a plan view showing a portion of the insulating material layer 430 in a portion of the wire region 420 in FIG. 4(a), and the insulating material layer 430 is respectively wrapped around the anode wire in FIG. 4(b). 420a and the cathode lead 420b. Figure 5 is a cross-sectional view of the insulating material layer 230 covering the anode wire 220a and the cathode wire 220b in Figures 3(b)-3(d). The material of the anode wire 220a is a conductive glass indium tin oxide (ITO). The material of the cathode wire 220b is a conductive glass indium tin oxide 220bb with a metal layer 220b2 to increase the conduction current. The present invention is applicable regardless of whether the organic light-emitting display device drives the 1C-based film-coated crystal seal-10-1325735-packed (C0F) or glass-on-chip package (COG) and the substrate of the organic light-emitting display device The packaging method and structure of the organic light emitting display device of the embodiment. The technical contents and technical features of the present invention have been disclosed as above, but those skilled in the art can still make various alternatives and modifications to the present invention based on the teachings and disclosures of the present invention. Therefore, the scope of the present invention should be construed as not limited by the scope of the invention, and the invention is intended to be construed as a BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1(a) is a top plan view showing a conventional package structure of an organic light-emitting display device, FIG. 10) is a cross-sectional view showing a package structure of the organic light-emitting display device of FIG. 1; FIG. 2(a) is a diagram FIG. 2(b) is a cross-sectional view showing the package structure of the organic light-emitting display device of FIG. 2(a); FIG. 3(a) to 3(d) are diagrams of the present invention; FIG. 4(a) is a top plan view of a substrate of an organic light emitting display device according to a second embodiment of the present invention; FIG. 4(b) is an insulating view of the substrate. The material layer covers a top view of the wire region in FIG. 4(a); and FIG. 5 is a cross-sectional view of the insulating material layer covering the anode wire and the cathode wire in FIG. 3(b)_3(d). [Main component symbol description] 1325735 10, 20 organic light-emitting display device 100 substrate 120 wire region 120b cathode wire 150 upper cover body 200 substrate 220 wire region 220b cathode wire
置封裝結構 1發光區 120a陽極導線 140第一封膠層 160第二封膠層 210發光區 220a陽極導線 2 3 0絕緣材料層 220b2金屬層 220bl導電玻璃氧化銦錫 240第一封膠層 250上蓋體 260第二封膠層 231、232、233、233a、233b、233c、234 絕緣材料層 400基板 410發光區 420導線區 420a陽極導線 420b陰極導線 430絕緣材料層Package structure 1 light-emitting region 120a anode wire 140 first sealant layer 160 second sealant layer 210 light-emitting region 220a anode wire 2 3 0 insulation material layer 220b2 metal layer 220bl conductive glass indium tin oxide 240 first sealant layer 250 cover Body 260 second sealant layer 231, 232, 233, 233a, 233b, 233c, 234 insulating material layer 400 substrate 410 light emitting region 420 wire region 420a anode wire 420b cathode wire 430 insulating material layer