JP2009003169A - Display panel, and method for manufacturing display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display panel, capable of suppressing deterioration in a display part that includes an organic EL layer, and to provide a method for manufacturing display device. <P>SOLUTION: The display device 1 is equipped with the display panel 2 and a wiring substrate 3. The display panel 2 includes a display substrate 5, a sealing plate 6, a sealing agent 7, a display part 8 for displaying images, a drying agent 9, a heat insulating plate 10, and an adhesive 11. The display part 8 is formed on the display substrate 5, and includes an anode electrode 15, an organic EL layer 16, and a cathode electrode 17. Air is sealed in a heat preventing space 12 enclosed by the display substrate 5, the heat insulating plate 10 and the adhesive 11. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a display panel in which a wiring substrate is soldered to a display substrate, and a method for manufacturing a display device.

  A display panel provided with a liquid crystal layer, an organic EL layer, and the like is known.

For example, in a display panel including an organic EL layer, a pair of glass substrates is sealed, and a display unit is provided inside the pair of glass substrates (see Patent Document 1). The display unit is for forming an image, and is provided on one of the substrates. The display unit includes an organic EL layer capable of emitting light sandwiched between a pair of electrodes. Conventionally, in such a display panel, in order to control the display unit, an IC chip is connected to an end of an electrode extending from the display unit to the outside via an ACF (anisotropic conductive tape) or the like. Or the structure to which a flexible wiring is connected was common.
JP 2001-93664 A

  In recent years, these display panels have been miniaturized and are often mounted together with other components on a wiring board. As described above, when the display panel is mounted on the wiring board, a process of introducing the display panel into a solder reflow apparatus or the like and mounting the display panel on the wiring board is performed.

  However, when the display panel is introduced into the solder reflow apparatus in this manner, not only the part joined by the solder but also other parts such as the display part are heated. For this reason, there exists a subject that the organic electroluminescent layer, liquid crystal layer, etc. which are weak to the heat provided in the display part deteriorate.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a display panel and a display device manufacturing method capable of suppressing deterioration of a display unit including an organic EL layer.

  In order to achieve the above object, the invention according to claim 1 is directed to a display substrate, a display unit for displaying an image formed on one surface of the display substrate, and the other surface of the display substrate. And a heat insulating plate bonded via an adhesive at a position facing the display portion, and a heat insulating space surrounded by the display substrate, the heat insulating plate, and the adhesive is hermetically sealed. It is a display panel.

  The invention according to claim 2 is a display substrate, a display unit for displaying an image formed on one surface of the display substrate, a sealing member covering the display unit, and the sealing member A first heat insulating plate bonded via a first adhesive at a position facing the display section on the outer surface of the sealing member, the sealing member, the first heat insulating plate, and the first adhesive The display panel is characterized in that the first heat-insulating space surrounded by is sealed.

  Further, the invention described in claim 3 includes a second heat insulating plate bonded via a second adhesive at a position facing the display portion on the other surface of the display substrate, and the display substrate The display panel according to claim 2, wherein a second heat insulating space surrounded by the second heat insulating plate and the second adhesive is sealed.

  The invention according to claim 4 is the display panel according to any one of claims 1 to 3, wherein air is sealed in the heat-insulating space.

  The invention according to claim 5 is the display panel according to any one of claims 1 to 3, wherein the heat-insulating space is a vacuum.

  The invention according to claim 6 is the display panel according to any one of claims 1 to 5, wherein the heat insulating plate is made of a material capable of transmitting light.

  According to a seventh aspect of the present invention, there is provided a display portion forming step for forming a display portion for displaying an image on one surface of the display substrate, and a heat insulating plate via an adhesive on the other surface of the display substrate. A heat insulating space forming step for sealing the heat insulating space surrounded by the display substrate, the heat insulating plate, and the adhesive, and a soldering step for soldering the wiring substrate to the display substrate. This is a method for manufacturing a display device.

  The invention according to claim 8 is the method for manufacturing a display device according to claim 7, further comprising a heat insulating plate removing step of removing the heat insulating plate after the soldering step. .

  The invention described in claim 9 includes a display part forming step of forming a display part for displaying an image on one surface of the display substrate, and a sealing process of sealing the display part with a sealing member. A first heat insulating plate is bonded to an outer surface of the sealing member facing the display substrate via a first adhesive, and the display substrate, the first heat insulating plate, and the first adhesive A method for manufacturing a display device, comprising: a first heat-insulating space forming step for sealing a first heat-insulating space surrounded by a soldering step; and a soldering step for soldering a wiring board to the display substrate.

  In the invention according to claim 10, before the soldering step, a second heat insulating plate is adhered to the other surface of the display substrate via a second adhesive, and the display substrate and the display substrate are bonded to each other. The method for manufacturing a display device according to claim 9, further comprising a second heat insulation space forming step of sealing the second heat insulation space surrounded by the second heat insulation plate and the second adhesive. It is.

  In addition, the invention according to claim 11 includes a heat insulation plate removing step of removing at least one of the first heat insulation plate and the second heat insulation plate after the soldering step. The method of manufacturing a display device according to claim 10.

  According to the present invention, since the heat insulating space surrounded by the display substrate or the sealing member, the adhesive, and the heat insulating plate is sealed, the wiring substrate and the display substrate are heated and soldered by a solder reflow device or the like. Even in this case, the heat conduction to the display portion can be delayed by the heat insulating space. Thereby, since heat transmitted to the display unit by the end of heating of solder reflow can be reduced, deterioration of the display unit having an organic EL layer, a liquid crystal layer, or the like can be suppressed.

(First embodiment)
Hereinafter, a first embodiment in which the present invention is applied to a display device including a display panel having an organic EL layer will be described with reference to the drawings. FIG. 1 is a cross-sectional view of the display device according to the first embodiment. XYZ shown in FIG. 1 is defined as an XYZ direction. In the Y direction, the upward direction on the paper is the + Y direction.

  As shown in FIG. 1, the display device 1 according to the first embodiment includes a display panel 2 and a wiring board 3.

  The display panel 2 includes a display substrate 5, a sealing plate 6, a sealing agent 7, a display unit 8, a desiccant 9, a heat insulating plate (corresponding to the heat insulating plate of claim 1) 10, and an adhesive 11. And.

  The display substrate 5 is for supporting the display unit 8. The display substrate 5 is made of a glass substrate that can transmit light. The display substrate 5 is formed in a rectangular shape larger than the sealing plate 6 so that a part is exposed. The wiring substrate 3 is soldered and mounted on the end portion 5 a of the display substrate 5 exposed from the sealing plate 6.

  The sealing plate 6 is for sealing a region where the display unit 8 is formed together with the display substrate 5. The sealing plate 6 is made of a glass plate. The sealing plate 6 is substantially the same in length in the Y direction as the display substrate 5, but is formed in a rectangular shape whose length in the X direction is shorter than that of the display substrate 5 in order to expose the end 5 a of the display substrate 5. Has been. In addition, you may comprise the sealing plate 6 with a metal plate.

  The sealing agent 7 is for sealing the display substrate 5 and the sealing plate 6 together. The sealing agent 7 is made of an ultraviolet irradiation resin and is provided so as to surround the outer periphery of the display unit 8. Thereby, the region surrounded by the display substrate 5, the sealing plate 6, and the sealing agent 7 is sealed. As a result, moisture and oxygen are prevented from entering the display unit 8 from the outside, and deterioration of the display unit 8 is suppressed. The region sealed with the display substrate 5, the sealing plate 6 and the sealing agent 7 is filled with nitrogen.

  The display unit 8 is for displaying an image, and is formed on the surface of the display substrate 5 on the + Z direction side. The display unit 8 includes a plurality of anode electrodes 15, an organic EL layer 16, a plurality of cathode electrodes 17, and an insulating film 18.

  The anode electrode 15 is for supplying holes to the organic EL layer 16. The plurality of anode electrodes 15 are transparent electrodes that can transmit light made of ITO. The anode electrode 15 is formed on the surface on the + Z direction side of the display substrate 5. The anode electrode 15 is formed in a straight line extending in the X direction. An end 15 a in the + X direction of the anode electrode 15 extends to the outside of the sealing agent 7 and is exposed on the end 5 a of the display substrate 5. A wiring (not shown) of the wiring board 3 is electrically connected to the end 15a of the anode electrode 15 via solder. The anode electrode 15 may be made of IZO or the like instead of ITO.

The plurality of organic EL layers 16 are for emitting light to be irradiated to the outside in the −Z direction. The organic EL layer 16 has a structure in which a plurality of organic layers made of trisaluminum (Alq ₃ ) or the like are stacked. The organic EL layer 16 is formed in a dot shape between the anode electrode 15 and the cathode electrode 17. Each organic EL layer 16 is disposed at a position where the anode electrode 15 and the cathode electrode 17 intersect. That is, the organic EL layer 16 is arranged in a matrix. The organic EL layer 16 includes a phosphor that can emit any one of red, green, and blue colors. Thus, when a voltage is applied to the organic EL layer 16 via the anode electrode 15 and the cathode electrode 17, the organic EL layer 16 emits light. The emitted light is converted into light of a predetermined color by the phosphor and irradiated to the outside.

  The cathode electrode 17 is for supplying electrons to the organic EL layer 16. The plurality of cathode electrodes 17 are made of metal electrodes such as aluminum and are formed on the upper surfaces of the organic EL layer 16 and the insulating film 18. The cathode electrode 17 is formed in a straight line extending in the Y direction and orthogonal to the anode electrode 15. Furthermore, the end portion of the cathode electrode 17 in the Y direction is bent in the + X direction and extends to the lower surface of the wiring board 3 and is electrically connected to the wiring of the wiring board 3 through solder.

The insulating film 18 is for electrically insulating the anode electrode 15 and the cathode electrode 17 and is made of SiO ₂ .

  The desiccant 9 is for absorbing and drying moisture inside the display unit 8 after the display substrate 5 and the sealing plate 6 are sealed. Thereby, it is suppressed that the display part 8 deteriorates with a water | moisture content.

  The heat insulating plate 10 is for delaying heat conduction to the display unit 8 including the organic EL layer 16 in a soldering process described later. The heat insulating plate 10 is made of a glass plate that can transmit light. The heat insulating plate 10 is bonded to the surface on the −Z direction side of the display substrate 5 with an adhesive 11 at a predetermined interval from the display substrate 5. The heat insulating plate 10 is provided at a position facing the display unit 8. Here, the heat insulating plate 10 may be provided so as to face a part of the display unit 8, but is preferably provided so as to face at least a region where the organic EL layer 16 is formed. The adhesive 11 is made of an ultraviolet curable resin. The adhesive 11 is formed on the inner surface of the outer peripheral portion of the heat insulating plate 10 in the same rectangular shape as the sealing agent 7 in plan view. As a result, a sealed heat insulating space (corresponding to the heat insulating space of claim 1) 12 is formed in a region surrounded by the heat insulating plate 10, the adhesive 11 and the display substrate 5. Air is sealed in the heat insulating space 12.

  The wiring substrate 3 is for transmitting an external signal to the organic EL layer 16 via the anode electrode 15 and the cathode electrode 17. The wiring board 3 is made of a glass epoxy board having copper wiring printed on the surface.

  Next, the operation of the display device 1 described above will be described.

  First, when a voltage is applied from the wiring board 3 to any one of the anode electrode 15 and the cathode electrode 17, holes are supplied to the organic EL layer 16 through the anode electrode 15 to which the voltage is applied, and the voltage is Electrons are supplied to the organic EL layer 16 through the applied cathode electrode 17. The holes and electrons supplied to the organic EL layer 16 recombine to emit light. The light emitted from the organic EL layer 16 sequentially passes through the anode electrode 15, the display substrate 5, and the heat insulating plate 10 and is irradiated to the outside. As a result, an image is displayed by the plurality of organic EL layers 16 that emit light.

  Next, a method for manufacturing the display device according to the first embodiment will be described with reference to the drawings. 2 to 5 are schematic side views in each manufacturing process of the display device according to the first embodiment.

  First, as shown in FIG. 2, a display unit 8 for displaying an image is formed on one surface of the display substrate 5 (display unit forming step). Specifically, as shown in FIG. 1, after forming an ITO film on the display substrate 5 by sputtering, patterning is performed to form an anode electrode 15 made of a transparent electrode. Thereafter, an insulating film 18 is formed so as to cover a part of the anode electrode 15. Next, a plurality of dot-like organic EL layers 16 are formed on the anode electrode 15 in a matrix by a vapor deposition method or a coating method. Thereafter, a cathode electrode 17 made of aluminum is formed on the organic EL layer 16 and the insulating film 18 by an electron beam evaporation method, a resistance heating evaporation method, a sputtering method, or the like. Thereby, the display unit 8 is formed.

  Next, a desiccant 9 is provided at the center of the sealing plate 6, and a sealing agent 7 made of an ultraviolet curable resin is applied to the outer periphery of the sealing plate 6. Thereafter, as shown in FIG. 3, the sealing plate 6 is placed on the display substrate 5 so that the surface on which the sealing agent 7 is applied is on the display substrate 5 side. Then, the sealing agent 7 is cured by irradiating the sealing agent 7 with ultraviolet rays, and the display substrate 5 and the sealing plate 6 are sealed.

  Next, an adhesive 11 made of an ultraviolet curable resin is applied to the outer peripheral portion of one surface of the heat insulating plate 10. After that, as shown in FIG. 4, the display substrate 5 is placed on the heat insulating plate 10 via the adhesive 11 in the atmospheric pressure. In this state, the heat insulating plate 10 is bonded to the surface on the −Z direction side of the display substrate 5 by irradiating the adhesive 11 with ultraviolet rays. Thereby, the heat insulating space 12 (see FIG. 1) surrounded by the display substrate 5, the heat insulating plate 10, and the adhesive 11 is sealed (heat insulating space forming step). As a result, air in and out of the heat insulating space 12 is prevented. Thereby, the display panel 2 is completed.

  Next, as shown in FIG. 5, the display panel 2 and the wiring board 3 are placed in a solder reflow apparatus (not shown) in a state where the wiring board 3 is placed at a predetermined position of the end portion 5a of the display board 5 via solder. ). Note that other electronic components are also placed on the wiring board 3 introduced into the solder reflow apparatus. Then, after preheating inside the solder reflow apparatus, the solder is melted by heating to about 270 °. Thereby, the wiring of the wiring board 3 is soldered and electrically connected to the end 15a of the anode electrode 15, the end of the cathode electrode 17 and other electronic components (soldering step). Here, since air with low thermal conductivity is sealed in the heat insulating space 12, heat conduction to the organic EL layer 16 of the display unit 8 can be delayed.

  Thereby, the display device 1 is completed.

  As described above, in the display device 1 according to the first embodiment, the heat insulating space 12 in which air having low thermal conductivity is sealed is formed by the heat insulating plate 10 bonded to the display substrate 5. Even if the display panel 2 is heated by the apparatus, the conduction of heat to the display unit 8 having the organic EL layer 16 can be delayed. Thereby, since the heat conducted to the organic EL layer 16 can be reduced before the heating by the solder reflow apparatus is completed, it is possible to suppress the organic EL layer 16 from rising to the glass transition temperature. As a result, it is possible to suppress the organic EL layer 16 from being deteriorated by heat.

  In addition, by configuring the heat insulating plate 10 with a glass substrate that can transmit light, it is possible to suppress a decrease in light emitted from the organic EL layer 16 while exhibiting the above-described effects.

(Second Embodiment)
Next, a second embodiment in which a part of the first embodiment described above is changed will be described with reference to the drawings. FIG. 6 is a cross-sectional view of a display device according to the second embodiment. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment, and description is abbreviate | omitted.

  As shown in FIG. 6, the display device 1 </ b> A includes a display panel 2 </ b> A and a wiring board 3. The display panel 2A includes a display substrate 5, a display unit 8, a heat insulating plate (corresponding to the second heat insulating plate of claim 3), an adhesive 11, a sealing member 21, and a heat insulating plate (claim 2). 10A) and an adhesive 11A. The heat insulating space 12 corresponds to the second heat insulating space of claim 3.

  The sealing member 21 is for suppressing deterioration of the display unit 8 due to moisture or physical damage. The sealing member 21 is made of an insulating material. The sealing member 21 includes substantially the entire display portion 8 excluding the end portion 15a of the anode electrode 15 and the end portion of the cathode electrode 17, at least the display portion 8 in the region where the organic EL layer 16 is formed. It is formed to cover.

  The heat insulating plate 10 </ b> A is for suppressing heat transmitted to the display unit 8. The heat insulating plate 10A is made of a glass plate that can transmit light. The heat insulating plate 10A is bonded to the outer surface of the sealing member 21 on the + Z direction side and facing the display unit 8 via an adhesive 11A. The heat insulating plate 10A may be provided so as to face a part of the display unit 8, but is preferably provided so as to face at least a region where the organic EL layer 16 is formed. The adhesive 11A is made of an ultraviolet curable resin. As a result, a sealed heat insulating space (corresponding to the first heat insulating space of claim 2) 12A is formed in a region surrounded by the sealing member 21, the heat insulating plate 10A, and the adhesive 11A. Air is sealed in the heat insulating space 12A.

  Since the operation for image display of the display device 1A according to the second embodiment is substantially the same as that of the display device 1 of the first embodiment, the description thereof is omitted.

  Next, a method for manufacturing the display device according to the second embodiment will be described with reference to the drawings. 7 to 10 are schematic side views in each manufacturing process of the display device according to the second embodiment.

  First, as shown in FIG. 7, the display unit 8 is formed on one surface of the display substrate 5 as in the first embodiment (display unit forming step). Thereafter, a sealing member 21 made of an insulating material is formed so as to cover the outer surface of the display unit 8, and the display unit 8 is sealed with the sealing member 21 (sealing process).

  Next, as shown in FIG. 8, as in the first embodiment, the heat insulating plate 10 is bonded to the display substrate 5 with the adhesive 11 to seal the heat insulating space 12 (second heat insulating space forming step).

  Next, an adhesive 11A made of an ultraviolet curable resin is applied to the outer peripheral portion of one surface of the heat insulating plate 10A. Thereafter, as shown in FIG. 9, the heat insulating plate 10A is placed on the outer surface of the sealing member 21 on the + Z direction side through the adhesive 11A under atmospheric pressure. Next, by irradiating the adhesive 11 </ b> A with ultraviolet rays, the heat insulating plate 10 </ b> A is bonded to a position facing the display unit 8 on the outer surface of the sealing member 21 on the + Z direction side. Thereby, the heat insulating space 12A (see FIG. 6) surrounded by the sealing member 21, the heat insulating plate 10A, and the adhesive 11A is sealed (first heat insulating space forming step). As a result, the entry and exit of air in the heat insulating space 12A is prevented. Thereby, the display panel 2A is completed.

  Next, as shown in FIG. 10, the display panel 2 </ b> A is introduced into the solder reflow apparatus with the wiring substrate 3 placed on a predetermined position on the end portion 5 a of the display substrate 5 via solder. Then, in the solder reflow apparatus, the wiring of the wiring board 3 is soldered and electrically connected to the end 15a of the anode electrode 15 and the end of the cathode electrode 17 (soldering process). Here, since air with low thermal conductivity is sealed in the heat insulating spaces 12 and 12A, the conduction of heat to the organic EL layer 16 of the display unit 8 can be delayed.

  Thereby, the display device 1A is completed.

  As described above, in the display device 1A according to the second embodiment, the heat insulating space 12 in which air is sealed by the heat insulating plate 10 bonded to the display substrate 5 is formed. Therefore, the display device according to the first embodiment. 1 can be obtained.

  Further, in the display device 1A according to the second embodiment, since the heat insulating space 12A in which air having low thermal conductivity is sealed is formed by the heat insulating plate 10A bonded to the sealing member 21, the display panel is displayed by the solder reflow device. Even if 2A is heated, conduction of heat to the display unit 8 having the organic EL layer 16 can be delayed. Thereby, since the heat transmitted to the organic EL layer 16 can be reduced before the heating by the solder reflow apparatus is finished, it is possible to suppress the organic EL layer 16 from rising to the glass transition temperature. As a result, it is possible to further suppress the organic EL layer 16 from being deteriorated by heat.

(Third embodiment)
Next, a display device manufacturing method according to the third embodiment, in which the display device manufacturing method according to the above-described embodiment is partially changed, will be described. FIG. 11 is a cross-sectional view of a display device according to the third embodiment. In the following description, the same components as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the manufacturing method of the display device 1 </ b> B according to the third embodiment, the heat insulating plate removing process for removing the heat insulating plate 10 from the display substrate 5 is performed after the soldering process of the first embodiment described above. As a result, the heat insulating plate 10 is removed from the display substrate 5 as in the display panel 2B of the display device 1B shown in FIG. 11, so that the display device 1B can be thinned and the light emitted from the organic EL layer 16 can be reduced. More can be irradiated to the outside.

(Fourth embodiment)
Next, a display device manufacturing method according to a fourth embodiment, in which the display device manufacturing method of the above-described embodiment is partially changed, will be described. FIG. 12 is a cross-sectional view of a display device according to the fourth embodiment. In the following description, the same components as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the manufacturing method of the display device 1 </ b> C according to the fourth embodiment, the heat insulating plate removing step for removing both the heat insulating plates 10 and 10 </ b> A is performed after the soldering step in the second embodiment described above. Accordingly, the heat insulating plates 10 and 10A are removed from the display substrate 5 and the heat insulating plate 10A is removed from the sealing member 21 as in the display panel 2C of the display device 1C illustrated in FIG. Can be made thinner, and more light emitted from the organic EL layer 16 can be irradiated to the outside. In the heat insulating plate removing step, only one of the heat insulating plates 10, 10A may be removed.

  As mentioned above, although this invention was demonstrated in detail using embodiment, this invention is not limited to embodiment described in this specification. The scope of the present invention is determined by the description of the claims and the scope equivalent to the description of the claims. Hereinafter, modified embodiments in which the above-described embodiment is partially modified will be described.

  For example, in the display device 1A according to the second embodiment described above, the two heat insulating plates, the heat insulating plate 10 and the heat insulating plate 10A, are provided, but only one of the heat insulating plates may be provided.

  Moreover, although air was sealed in the heat insulation space 12 and 12A by embodiment mentioned above, you may make the inside of the heat insulation space 12 and 12A a vacuum. That is, you may seal the air below atmospheric pressure in the thermal insulation space 12 and 12A. Thereby, heat conduction to the display unit 8 having the organic EL layer 16 can be further delayed. Further, a material having a low thermal conductivity other than air may be sealed in the heat insulating space.

  Further, in the above-described embodiment, the present invention is applied to the display devices 1 to 1C including the display unit 8 having the organic EL layer 16, but the present invention is applied to other display devices, for example, a display device including a liquid crystal layer. May be applied.

  Moreover, in the above-mentioned embodiment, although the adhesives 11 and 11A were comprised with the ultraviolet curable resin, you may comprise an adhesive agent with materials other than an ultraviolet curable resin.

  In the above-described embodiment, the heat insulating plate 10 is adhered after the display portion 8 is formed on the display substrate 5. However, the display portion may be formed on the display substrate after the heat insulating plate is adhered to the display substrate.

It is sectional drawing of the display apparatus by 1st Embodiment. It is a schematic side view in the manufacturing process of the display apparatus by 1st Embodiment. It is a schematic side view in the manufacturing process of the display apparatus by 1st Embodiment. It is a schematic side view in the manufacturing process of the display apparatus by 1st Embodiment. It is a schematic side view in the manufacturing process of the display apparatus by 1st Embodiment. It is sectional drawing of the display apparatus by 2nd Embodiment. It is a schematic side view in the manufacturing process of the display apparatus by 2nd Embodiment. It is a schematic side view in the manufacturing process of the display apparatus by 2nd Embodiment. It is a schematic side view in the manufacturing process of the display apparatus by 2nd Embodiment. It is a schematic side view in the manufacturing process of the display apparatus by 2nd Embodiment. It is sectional drawing of the display apparatus by 3rd Embodiment. It is sectional drawing of the display apparatus by 4th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1A, 1B, 1C Display apparatus 2, 2A, 2B, 2C Display panel 3 Wiring board 5 Display board 5a End part 6 Sealing board 7 Sealing agent 8 Display part 9 Desiccant 10, 10A Heat insulating board 11, 11A Adhesion Agents 12, 12A Heat-proof space 15 Anode electrode 15a End 16 Organic EL layer 17 Cathode electrode 18 Insulating film 21 Sealing member

Claims (11)

A display board;
A display unit for displaying an image formed on one surface of the display substrate;
A heat insulating plate bonded via an adhesive at a position facing the display portion on the other surface of the display substrate;
A display panel, wherein a heat insulating space surrounded by the display substrate, the heat insulating plate, and the adhesive is sealed. A display board;
A display unit for displaying an image formed on one surface of the display substrate;
A sealing member covering the display unit;
A first heat insulating plate bonded via a first adhesive at a position facing the display portion of the outer surface of the sealing member;
A display panel, wherein a first heat insulating space surrounded by the sealing member, the first heat insulating plate, and the first adhesive is sealed. A second heat insulating plate adhered via a second adhesive at a position facing the display portion on the other surface of the display substrate;
The display panel according to claim 2, wherein a second heat insulating space surrounded by the display substrate, the second heat insulating plate, and the second adhesive is sealed.   The display panel according to claim 1, wherein air is sealed in the heat insulating space.   The display panel according to claim 1, wherein the heat insulating space is a vacuum.   The display panel according to claim 1, wherein the heat insulating plate is made of a material that can transmit light. A display part forming step of forming a display part for displaying an image on one surface of the display substrate;
A heat insulating space forming step of sealing a heat insulating space surrounded by the display substrate, the heat insulating plate, and the adhesive by bonding a heat insulating plate to the other surface of the display substrate via an adhesive;
A display device manufacturing method comprising: a soldering step of soldering a wiring substrate to the display substrate.   The method for manufacturing a display device according to claim 7, further comprising a heat insulating plate removing step of removing the heat insulating plate after the soldering step. A display part forming step of forming a display part for displaying an image on one surface of the display substrate;
A sealing step of sealing the display unit with a sealing member;
A first heat insulating plate is bonded to an outer surface of the sealing member facing the display substrate via a first adhesive, and the display substrate, the first heat insulating plate, and the first adhesive are used. A first heat insulation space forming step for sealing the enclosed first heat insulation space;
A display device manufacturing method comprising: a soldering step of soldering a wiring substrate to the display substrate. Before the soldering process,
A second heat insulating plate is bonded to the other surface of the display substrate via a second adhesive, and is surrounded by the display substrate, the second heat insulating plate, and the second adhesive. The method for manufacturing a display device according to claim 9, further comprising a second heat insulating space forming step for sealing the heat insulating space.   11. The display device manufacturing method according to claim 10, further comprising a heat insulating plate removing step of removing at least one of the first heat insulating plate and the second heat insulating plate after the soldering step. Method.

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