JP2003086362A - Display device and its manufacturing method, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image display device in which deterioration of the organic electroluminescence element due to heat is suppressed, and freedom of layout of the picture element is high, and the numerical aperture can be improved. SOLUTION: A heat radiating region 27 including a heat conduction layer 28 is formed on the organic electroluminescent element 13 through a protection layer 26. A first and a second plugs 31, 32 as a connection point are formed at the position apart from the organic electroluminescent element 13. By positioning a plurality of holes 18A, 18B of the flexible printed-circuit board 18 and the first and second plugs 31, 32, and melting a solder in the plural holes 18A, 18B, electric connection parts 18E are formed, and the flexible printed-circuit board and the first and second plugs 31, 32 are connected. The melting heat of the solder is dispersed through the heat conduction layer 28 as shown by the arrow mark B. Since the heat radiating region 27 includes a heat insulation layer 29, the melting heat of the solder is first cut off by the heat insulation layer 29.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a display device, and more particularly to
An organic EL (Electrifier) equipped with an organic electroluminescence device containing an organic compound that emits light when a current is injected
oluminescence) Display. The present invention also relates to a method for manufacturing the display device and electronic equipment using the display device.

[0002]

2. Description of the Related Art Conventionally, as a display device, a stationary cathode ray tube, that is, a CRT (Cathode) is used.
Ray Tube) devices and flat panel displays to meet the demands of portable and thin products. CRTs are currently widely used because they have high brightness and good color reproducibility, but problems such as large occupied capacity, heavy weight, and large power consumption have been pointed out. On the other hand, a flat panel display is lightweight and has a higher luminous efficiency than a cathode ray tube, and is expected as a screen display for computers and televisions. Currently, as a flat panel display, an active matrix driving type liquid crystal display (LCD; Liquid Crystal Display) has been commercialized. This LCD is a type of display which receives light from the outside (backlight) and does not emit light by itself, and has a narrow viewing angle, and because it is not a self-luminous type, it consumes the backlight in a dark environment. It has been pointed out that there are problems such as high power consumption and insufficient response performance for high-definition and high-speed video signals that are expected to be put to practical use in the future.

As a display capable of solving such various problems, an organic EL display using an organic light emitting material which emits light when an electric current is injected has been attracting attention in recent years. This organic EL display is a self-luminous flat panel display that does not require a backlight, and has an advantage that a display having a wide viewing angle, which is peculiar to the self-luminous display, can be realized. In addition, it is possible to further reduce the power consumption because only the necessary pixels need to be turned on.
It is considered to have sufficient response performance for the above-mentioned high-definition and high-speed video signal.

Since the organic EL display has the above-mentioned advantages, the liquid crystal display has been mainly developed for the flat panel display use, which has been the mainstream. In recent years, due to advances in light-emitting materials,
Organic EL devices are being achieved with higher efficiency, longer life and full color, and are being put to practical use as displays.

As an element constituting an organic EL display, a strip-shaped electrode layer (anode) made of a transparent conductive film is formed on a transparent substrate, and an organic electroluminescent layer and an organic electroluminescent layer are formed so as to intersect with the transparent electrode layer. There is known an organic electroluminescent device having a structure in which a strip-shaped electrode layer (cathode) made of a metal thin film is formed and an organic electroluminescent layer is sandwiched between a transparent electrode layer and a metal electrode layer. In this organic electroluminescent device, the transparent electrode layer and the metal electrode layer form a matrix structure,
A pixel is made to emit light by applying a voltage between the selected transparent electrode layer and the selected metal electrode layer and applying a current to the organic electroluminescent layer.

At the ends of the transparent electrode layer and the metal electrode layer,
Driving IC (Integrat for applying voltage between both electrodes
An ed circuit (integrated circuit), a drive circuit board on which a drive IC is mounted, or a flexible printed wiring board for external connection is electrically connected. Conventionally, this electrical connection is made via an ACF (Anisotropic Conductive Film) which can handle a fine pitch and is easy to handle. The ACF is obtained by dispersing conductive particles such as metal particles such as nickel (Ni) and solder and carbon particles into an adhesive (binder) such as a thermosetting resin, and molding the sheet into a sheet having a thickness of about 20 μm.
When joining the ACFs, first, the ACFs are temporarily pressure-bonded, then the substrates to be joined are aligned, and the temperature is set to 200 to 250 ° C.
At this temperature for 20 to 30 minutes, a pressure of 20 to 30 kg / cm ² is applied for main pressure bonding (bonding).

[0007]

However, the temperature that the organic compound constituting the organic electroluminescent device can withstand is about 80 ° C. As mentioned above, 20 is required for ACF bonding.
Since it is necessary to apply a high temperature of 0 to 250 ° C. for 20 to 30 minutes, the organic electroluminescent element may be deteriorated by the heat at the time of bonding. For this reason, joining was not possible in the vicinity of the organic electroluminescent element.

Under the circumstances, the same applicant as the present applicant has previously proposed a display device which solves the above-mentioned problems and enables electrical connection in the vicinity of the organic electroluminescent element (Japanese Patent Application No. 2000-2000). -368663). In this display device, a conductive metal film is provided on the substrate at a position that does not overlap the organic electroluminescent device, while a plurality of holes are formed in the flexible printed wiring board and a conductive connecting portion is provided around the holes. Once formed, the conductive metal film on the substrate and the multiple holes of the flexible printed wiring board are aligned, solder balls are put into these holes and melted by laser light. The metal film and the flexible printed wiring board are electrically connected.

However, in the above structure, heat is concentrated around the melted solder balls, and this heat may deteriorate the organic electroluminescent layer, and thus the organic electroluminescent element. In order to avoid this, it is necessary to take measures such as separating the joint portion between the substrate and the flexible printed wiring board from the organic electroluminescent element sufficiently, which may impose restrictions on the pixel layout inside the display, specifically, decrease in aperture ratio. Problems can occur.

The present invention has been made in view of the above problems, and an object thereof is to suppress deterioration of an organic electroluminescent device due to heat, have a high degree of freedom in pixel layout, and improve an aperture ratio. An object is to provide a device, a manufacturing method thereof, and an electronic device.

[0011]

A display device according to the present invention has a structure in which a substrate, a first electrode layer, an organic electroluminescent layer, and a second electrode layer are arranged in this order on the substrate. The organic electroluminescent device has a heat dissipating region that is provided on the opposite side of the substrate of the organic electroluminescent device, and includes a heat dissipation layer including at least one heat conducting layer, and a heat dissipating region that is formed outside the organic electroluminescent device. A conductive first plug that penetrates the region and reaches the first electrode layer, and is formed at a position outside the organic electroluminescent element, penetrates the heat dissipation region, and reaches the second electrode layer. A conductive second plug, a wiring board having a plurality of holes having a conductive film formed on the peripheral and inner peripheral surfaces at positions corresponding to the first and second plugs, and a plurality of holes of the wiring board, respectively. In, the conductive film of the wiring board and the first or A second plug is obtained and an electrical connection formed by electrically connecting.

A method of manufacturing a display device according to the present invention comprises a step of forming an organic electroluminescent device having a first electrode layer, an organic electroluminescent layer and a second electrode layer on a substrate, and an organic electroluminescent element. Forming a heat-dissipating region including at least one heat-conducting layer on the side opposite to the substrate of the electroluminescent device, and penetrating the heat-dissipating region and forming a first electrode layer at a position apart from the organic electroluminescent device. A step of forming a conductive first plug that reaches, and a step of forming a conductive second plug that penetrates the heat dissipation region and reaches the second electrode layer at a position apart from the organic electroluminescent element After aligning a wiring board having a plurality of holes having conductive films formed on the peripheral edge and the inner peripheral surface at positions corresponding to the first and second plugs with the board, a conductive material is placed in each of the plurality of holes. Filling process,
The method further includes the step of forming an electrical connection portion by heating and melting a conductive material, and connecting the conductive film of the wiring board and the first plug or the second plug.

The electronic device according to the present invention includes a display device, and the display device includes a substrate, a first electrode layer, an organic electroluminescent layer, and a second electrode layer on the substrate. An organic electroluminescent device having a structure arranged in this order, a heat dissipation region provided on the opposite side of the substrate of the organic electroluminescent device, including at least one heat conducting layer, and a position separated from the organic electroluminescent device. While being formed, it penetrates the heat-dissipating region and is formed at a position apart from the conductive first plug that reaches the first electrode layer and the organic electroluminescent element, and penetrates the heat-dissipating region, A conductive second plug reaching the second electrode layer, and a wiring board having a plurality of holes in which a conductive film is formed on a peripheral edge and an inner peripheral surface at positions corresponding to the first and second plugs, Wiring in each of the multiple holes on the wiring board It is obtained by a electrical connection formed by electrically connecting the conductive film and the first or second plug plate.

In the display device or the method of manufacturing the same according to the present invention, an organic electroluminescent element formed on a substrate, and a wiring substrate electrically connected to the first and second electrode layers of the organic electroluminescent element. Since a heat-dissipating region including at least one heat-conducting layer is provided between the two, heat generated in the manufacturing process or applied from the outside, or heat generated in the organic electroluminescent element during the operation of the display device, etc. It is possible to disperse through the heat conducting layer without concentrating at one point. Therefore, the heat transmitted to the organic electroluminescent layer of the organic electroluminescent element is significantly reduced, the adverse effect of the heat on the organic electroluminescent layer is suppressed, and the deterioration of the organic electroluminescent element can be prevented.

In the electronic device according to the present invention, since the display device according to the present invention is used, the adverse effect of heat on the organic electroluminescent layer can be reduced, and the deterioration of the organic electroluminescent element can be prevented.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 6 shows the overall structure of an electronic device according to an embodiment of the present invention. Electronic device 1 shown in FIG.
Specifically, 0 is used, for example, as a television receiver. The electronic device 10 includes a display device 11. The display device 11 is specifically an organic EL (Electroluminescence) display including an organic electroluminescent element. The display device 11 has a substrate 12 made of, for example, transparent glass or plastic in the visible light region inside an outer case 11A. The substrate 12 also serves as a surface (face plate) for taking out light, and the user can see the displayed image from the front surface 12A side of the substrate 12.

FIG. 1 is an enlarged exploded perspective view of a part of the display device 11 seen from the back surface 12B side of the substrate 12. Board 12
A plurality of drive circuit boards 17 on which drive ICs 16 for driving the organic electroluminescent elements 13 are mounted are provided on the back surface 12B side of the. Substrate 12 and drive circuit board 17
Are electrically connected to each of the above through the flexible printed wiring board 18. In this way, one substrate 12
By providing a plurality of drive circuit boards 17 for
There are advantages that the wiring is shortened to prevent a voltage drop due to wiring resistance, and replacement and maintenance of the drive circuit board 17 or the drive IC 16 are facilitated. Here, the flexible printed wiring board is a feature that corresponds to the "wiring board" according to this invention.

As shown in FIG. 2, a plurality of organic electroluminescent elements 13 are formed on the back surface 12B of the substrate 12 over the entire surface.
That is, the pixels (light emitting points) 14 are two-dimensionally arranged and formed. Circular connection points 15 are provided at regular intervals for each line in the gap between the pixels 14. A square alignment mark 12C, for example, is provided at the end of the substrate 12.

A plurality of holes (not shown in FIG. 2; see FIGS. 3 and 4) are formed in the flexible printed wiring board 18 shown in FIG. 1 corresponding to the connection points 15. Details of the plurality of holes will be described later. further,
Although not shown on the flexible printed wiring board 18,
Alignment marks corresponding to the alignment marks 12C on the substrate 12 are formed, and the flexible printed wiring board 1 is formed by using these alignment marks.
The holes 8 and the connection points 15 on the substrate 12 can be aligned and joined by solder, for example, as described below. The flexible printed wiring board 18
And the drive circuit board 17 are electrically connected by the connector 17A.
Is done through. The drive circuit boards 17 are electrically connected to each other by another flexible printed wiring board 19 via the connector 17B.

The organic electroluminescent device 13 is shown in FIGS.
As shown in FIG. 5, it is formed on the back surface 12B of the substrate 12 with the substrate-side protective layer 21 interposed therebetween. The organic electroluminescent device 13 shown in FIGS. 3 and 4 has connection points 15 at two peripheral positions, for example, located at the upper left corner in FIG.
Corresponding to the pixel 14 having Organic electroluminescent device 1
As shown in FIG. 2, 3 has no connection point 15 in the periphery (for example, pixel 1 near the center of FIG. 2).
4) or the one in which the connection point 15 is provided at one place on the periphery (for example, the pixel 14 in the lower left corner of FIG. 2).

As the substrate 12, a substrate made of glass or plastic which is transparent in the visible light region is used as described above. In the case of a glass substrate, for example, soda glass,
Alkali-free glass or quartz glass is used.
On the other hand, in the case of a plastic substrate, for example, polycarbonate (PC), fluoropolyimide (PI), acrylic resin (PMMA), polyethylene terephthalate (PE)
T), polyarylate (PAR), polyether sulfone (PES), polyether nitrile (PEN), cyclo-olefin resin, etc. can be used.

The substrate-side protective layer 21 is transparent in the visible light region, and in the present embodiment, it is made of, for example, silicon oxynitride (SiO 2).
N). The substrate-side protective layer 21 also includes
It has a function as a passivation for preventing moisture, oxygen, and the like from entering the organic electroluminescence element 13 and preventing the deterioration of the organic electroluminescence element 13. It is desirable that the substrate-side protective layer 21 be provided with antireflection properties. This is to prevent the light generated in the organic electroluminescent device 13 from being reflected by the substrate 12 and improve the light transmittance of the substrate 12. A protective layer similar to the substrate-side protective layer 21 may be provided on the surface 12A of the substrate 12.

The organic electroluminescent device 13 includes the first electrode layer 2
2 has a structure in which an organic electroluminescent layer 23 and a second electrode layer 24 are laminated, and the intersection of the first electrode 22 and the second electrode 24 is a pixel (light emitting point) 14. Equivalent to. First
The electrode layer 22 has a large work function from the vacuum level in order to efficiently inject holes into the hole transport layer, and the substrate 1
In order to extract light from the side of 2, it is desirable that it is transparent in the visible light region. As a material of such a first electrode layer 22, specifically, indium tin oxide (ITO; Indi
um Tin Oxide), tin oxide (SnO ₂ ), zinc oxide (Z
nO). In particular, it is preferable to use ITO from the viewpoint of productivity and controllability.

The first electrode layers 22 are formed in a stripe shape in a plan view, and the first electrode layers 2 adjacent to each other are formed.
The two layers are insulated from each other by the insulating layer 25. The insulating layer 25 also has a function of preventing a short circuit between the first electrode layer 22 and the second electrode layer 24. In the present embodiment, since the insulating layer 25 is made of silicon nitride (SiN), not only electrical insulation but also barrier properties against moisture and oxygen can be expected.

The organic electroluminescent layer 23 is the first electrode layer 22.
From the side of, for example, an organic compound layer in which a hole transport layer, a light emitting layer, and an electron transport layer are laminated. The hole transport layer transports holes injected from the first electrode layer 22 to the light emitting layer, while the electron transport layer transports electrons injected from the second electrode layer 24 to the light emitting layer. In the light emitting layer, when a voltage is applied between the second electrode layer 24 and the first electrode layer 22, electrons and holes are injected from the second electrode layer 24 and the first electrode layer 22, respectively. Further, it is a region where these electrons and holes are recombined. The light emitting layer is made of a material having a high luminous efficiency, for example, an organic material such as a low molecular weight fluorescent dye, a fluorescent polymer, and a metal complex. As described above, the organic electroluminescent layer 23 has a laminated structure of a plurality of layers made of materials having different carrier transporting properties, so that carrier injection efficiency from the first electrode layer 22 and the second electrode layer 24 is high. And the carrier recombination efficiency can be improved. The organic electroluminescent layer 23 is not limited to the above-mentioned three-layer structure, and for example, by doping the hole transport layer or the electron transport layer with a light emitting material, the organic light emitting layer 23 has a light emitting layer also serving as the hole transport layer and an electron transport layer. It may have a layer structure or a two-layer structure of a hole transport layer and a light emitting layer also serving as an electron transport layer.

The second electrode layer 24 is preferably made of a material having a small work function from the vacuum level in order to efficiently inject electrons. Specific examples include aluminum (Al), indium (In), magnesium (Mg), silver (Ag), calcium (Ca), barium (Ba), and lithium (Li). These metals may be used alone, or may be used as alloys with other metals with increased stability.

The entire surface of the organic electroluminescent device 13 is covered with a protective layer 26. The protective layer 26 seals the organic electroluminescent device 13 and shuts off oxygen and moisture in order to prevent deterioration of the organic electroluminescent device 13 and ensure operational reliability. Therefore, the protective layer 26 needs to be made of a material capable of maintaining hermeticity. Specifically, for example, silicon oxide (SiO _x ), silicon nitride (SiN _x ), aluminum oxide (Al
₂ O ₃ ) and aluminum nitride (AlN).
In the present embodiment, for example, silicon oxynitride (SiON)
Are using.

In the present embodiment, a heat dissipation area 27 is further provided on the surface of the protective layer 26. The heat dissipation area 27 includes at least one heat conduction layer 28, as will be described later. As a result, the heat dissipation area 27
Does not concentrate the heat generated in the manufacturing process of the display device 11 or applied from the outside, or the heat generated in the organic electroluminescent element 13 during the operation of the display device 11 via one point through the heat conduction layer 28. It can be dispersed. Above this heat dissipation area 27,
The flexible printed wiring board 18 is bonded via the adhesive 30. As the adhesive 30, for example, an acrylic adhesive can be used.

In the protective layer 26 and the heat dissipation area 27, a first plug 31 and a second plug 32 are formed as the above-mentioned connection points 15 at positions outside the organic electroluminescent element 13. The first plug 31 has a protective layer 2
6 and the heat dissipation area 27 are penetrated, one end reaches the first electrode layer 22, and the other end is formed with a first electrode pad 31A penetrating the adhesive 30. In addition, the second plug 32 penetrates the protective layer 26 and the heat dissipation area 27,
One end reaches the second electrode layer 24, and the other end has a second electrode pad 32A penetrating the adhesive 30. The first and second plugs 31, 32 are made of nickel (N
i), and the first and second electrode pads 31A and 32A are made of, for example, gold (Au). The first and second electrode pads 31A, 32A
May be made of solder or copper (Cu) instead of gold, or nickel plated with gold.

Further, the flexible printed wiring board 18 has a plurality of holes 18A, 18 corresponding to the first plug 31 and the second plug 32 as the connection points 15.
B is formed. These multiple holes 18A, 18B
Conductive films 18C and 18D made of, for example, copper, silver (Ag), or carbon are provided on the peripheral edge and the inner peripheral surface of. An electrical connection portion 18E made of a conductive material such as solder is formed in the plurality of holes 18A and 18B, whereby the flexible printed wiring board 18 and the first and second plugs as the connection points 15 are formed. 31,
32 is joined. The solder used for the electrical connection portion 18E is preferably lead-free solder.

Next, the structure and operation of the heat dissipation area will be described in more detail. As described above, the heat dissipation area 27 includes the heat conductive layer 28, and the heat generated in the manufacturing process of the display device 11 or the heat applied from the outside, or the organic electroluminescent device 1 during the operation of the display device 11.
It is possible to dissipate the heat generated in the inside 3 through the heat conduction layer 28. Here, the electrical connection portion 18E
The heat dissipation area 2
The operation of No. 7 will be described by comparing FIG. 3 and FIG.

The heat of melting of the solder which is heated and melted when forming the electrical connection portion 18E is first concentrated at one point around the electrical connection portion 18E, but the heat dissipation area 27 is not provided in FIG. In the above configuration, as indicated by arrow A,
This concentrated heat is all caused by the first and second plugs 31,
Organic electroluminescent layer 2 of organic electroluminescent element 13 via 32
3 is reached, which may deteriorate the organic electroluminescent device 13. On the other hand, in the present embodiment,
Since the heat dissipation area 27 including the heat conduction layer 28 is provided, the heat concentrated at one point around the electrical connection portion 18E is the first and second plugs 31 as shown by the arrow B in FIG. ，
While being transmitted to the organic electroluminescent device 13 via 32, it is transmitted to the heat conduction layer 28 and is dispersed via the heat conduction layer 28. Therefore, as shown by the arrow C in FIG.
Since the heat transmitted to the organic electroluminescent element is significantly reduced, the adverse effect of the heat on the organic electroluminescent layer 23 of the organic electroluminescent element 13 is reduced, and the deterioration of the organic electroluminescent element 13 can be prevented.

Further, in the heat dissipation area 27 of the present embodiment, as shown in FIGS. 3 and 4, a heat insulating layer 29 is provided on the heat conducting layer 28. In this case, the heat of melting of the solder when forming the electrical connection portion 18E is first determined by the heat insulating layer 2
Blocked by 9. Then, only the surplus heat that is not blocked by the heat insulating layer 29 is dispersed in the heat conducting layer 28, and the organic electroluminescent layer 2 of the organic electroluminescent element 13 is dispersed.
The heat transferred to 3 can be further reduced.

The heat conducting layer 28 and the heat insulating layer 29 as described above.
Is composed of, for example, a polymer. More preferably, the heat conduction layer 28 is made of metal, aluminum nitride (Al
N), DLC (Diamond Like Carbon) or boron nitride (BN), and the heat insulating layer 29 is made of polyimide or polysulfone. Further, in the peripheral portion of the substrate 12, as shown in FIGS. 3 and 4, the peripheral portion 28A of the heat conduction layer 28 is exposed by a method of molding the heat insulating layer 29 to be slightly smaller than the substrate 12, It is therefore highly desirable to be able to release the heat dispersed in the heat conducting layer 28.

The thickness of the heat conducting layer 28 and the heat insulating layer 29 in the heat dissipation area 27 can be set to, for example, about 100 nm to 1 mm, but not limited to this, and the material of the organic electroluminescent layer 23 and the like. It may be appropriately set in consideration of the film thickness of the protective layer 26 and the like.

The position where the heat dissipation area 27 is provided is preferably between the protective layer 26 and the flexible printed wiring board 18, as shown in FIGS. This is because less heat is transferred to the protective layer 26, and the range of materials for the protective layer 26 can be selected. However,
The heat dissipation area 27 may be provided between the organic electroluminescent element 13 and the protective layer 26, as shown in FIG. 7.

The display device 11 and the electronic device 10 having such a configuration can be manufactured as follows.

First, the substrate side protective layer 21 made of, for example, silicon oxynitride is formed on the substrate 12 by, for example, reactive high frequency sputtering. Next, the first electrode layer 22 made of, for example, ITO is formed by, for example, reactive DC sputtering.

The organic electroluminescent layer 23 is formed on the first electrode layer 22. The organic electroluminescent layer 23 is formed by depositing a hole transport layer, a light emitting layer, and an electron transport layer in this order by, for example, a vacuum vapor deposition method. The hole transport layer is formed of, for example, 4,4 ′, 4 ″ -tris (3-methylphenylphenylamino) triphenylamine (m-MTDAT).
It is formed by depositing A). The light emitting layer is formed, for example, by depositing bis [(N-naphthyl) -N-phenyl] benzidine (α-NPD). Then, the electron transport layer is formed by forming a film of 8-quinolinol aluminum complex (Alq), for example.

Then, a second layer made of, for example, an Al--Li alloy is formed on the organic electroluminescent layer 23 by, for example, a vacuum vapor deposition method.
The electrode layer 24 is formed. In this way, the organic electroluminescent element 13 is manufactured. Further, a protective layer 26 made of, for example, silicon oxynitride is formed by, for example, reactive high frequency sputtering to cover the organic electroluminescent element 13.

On the protective layer 26, a heat conducting layer 28 and a heat insulating layer 29 are sequentially formed as a heat dissipation area 27. First, the heat conduction layer 28 made of metal, aluminum nitride, DLC or boron nitride is formed by, for example, vacuum deposition or sputtering, and then the heat insulation layer 29 made of polyimide or polysulfone is formed. Further, an adhesive 30 for adhering the flexible printed wiring board 18 is applied on the heat insulating layer 29.

Here, the protective layer 26, the heat conducting layer 28 and the heat insulating layer 29 of the heat dissipation area 27, and the adhesive 30 are penetrated to reach the first or second electrode 22, 24 by, for example, a dry etching method. Form a contact hole. Nickel is buried in the contact hole by, for example, sputtering or vapor deposition to form the first plug 31 and the second plug 32. Gold is also embedded at the tips of the first plug 31 and the second plug 32 by sputtering or vapor deposition to form electrode pads 31A and 32A.

Finally, the flexible printed wiring board 18
Is aligned with the substrate 12, and a solder ball, for example, as a conductive substance is put into the plurality of holes 18A and 18B of the flexible printed wiring board 18 and melted by laser light.
As a result, the electrical connection portion 18E made of solder is formed in the plurality of holes 18A, 18B, and the flexible printed wiring board 18 and the first and second plugs 31, 32 are electrically connected. Thereafter, the flexible printed wiring board 18 is adhered using an adhesive agent 30, and as shown in FIG. 1, the drive circuit board 17 on which the driving IC 16 is mounted is connected to the flexible printed wiring board 18 via the connector 17A. To do. The display device 11 thus completed
Is stored in the outer case 11A as shown in FIG.
The electronic device 10 is completed.

In this organic electroluminescence device 10, a predetermined voltage is applied between the first electrode layer 22 and the second electrode layer 24, so that the first electrode layer 22 and the second electrode layer Holes and electrons are injected from 24, respectively. These holes and electrons are transported to the light emitting layer through the hole transporting layer and the electron transporting layer, and recombine with each other to generate light emission, and this light is emitted in a direction perpendicular to the main surface of the substrate 12. It is taken out (to the surface 12A side).

As described above, according to this embodiment, at least one heat conduction layer 2 is formed on the organic electroluminescence device 13.
Since the heat-dissipating region 27 including 8 is provided, heat generated in the manufacturing process of the display device 11 or applied from the outside, or the organic electroluminescent element 1 during operation of the display device 11 is provided.
It is possible to disperse the heat generated in the inside of 3 or the like through the heat conduction layer 28 of the heat dissipation area 27 without concentrating it at one point. For example, the heat of melting of the solder when forming the electrical connection portion 18E is not concentrated at one point around the electrical connection portion 18E but is dispersed through the heat conductive layer 28, and the heat transmitted to the organic electroluminescent element 13 is dispersed. It can be significantly reduced. As described above, by providing the heat dissipation area 27, the adverse effect of heat on the organic electroluminescent layer 23 of the organic electroluminescent element 13 is reduced, and the deterioration of the organic electroluminescent element 13 can be prevented. Therefore, in this display device 11, the degree of freedom in pixel layout is increased, and the aperture ratio can be improved.

Further, in the present embodiment, the heat conducting layer 28
Since the heat insulating layer 29 is provided on the heat insulating layer 29, for example, the heat of melting of the solder is first blocked by the heat insulating layer 29.
Only the excess heat that is not blocked by the heat conduction layer 28
Since it is dispersed inside, heat transferred to the organic electroluminescent layer 23 of the organic electroluminescent element 13 can be further reduced.

Further, in this embodiment, the heat dissipation area 27
Since the position where the protective layer 26 is provided is between the protective layer 26 and the flexible printed wiring board 18, heat transferred to the protective layer 26 is reduced, and the range of selection of the material of the protective layer 26 is widened.

In addition, in the present embodiment, the heat conducting layer 28
And the heat insulating layer 29 is made of, for example, a polymer,
More preferably, the heat conducting layer 28 is made of metal, aluminum nitride (AlN), DLC or boron nitride (BN), and the heat insulating layer 29 is made of polyimide or polysulfone. As described above, the heat conducting layer 28 and the heat insulating layer 29 are composed of commonly available general materials, and the film forming method may be a general method such as vapor deposition or sputtering in vacuum. it can.

Further, in the present embodiment, since the peripheral portion of the heat conducting layer 28 is exposed at the peripheral portion of the substrate 12,
The heat dispersed in the heat conduction layer 28 can be released, and the deterioration of the organic electroluminescence device can be effectively prevented.

Although the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made. For example, in the above-described embodiment, the heat dissipation area 27 has the heat insulating layer 29 on the heat conducting layer 28.
The case of having a two-layer structure in which the above is laminated has been described. However, for example, as shown in FIG. 8, a two-layer structure in which the heat insulating layer 29 is provided below the heat conducting layer 28 is also possible. Further, the purpose of the heat dissipation area 27 can be achieved even if the heat insulating layer 29 is omitted and the heat conducting layer 28 is formed as a single layer structure.

Further, for example, as shown in FIG. 9, a three-layer structure in which the heat conducting layer 28 is sandwiched by two heat insulating layers 29A and 29B is also possible. The modification example of the structure of the heat dissipation area 27 is not limited to that shown in FIGS. 8 and 9, and, for example, the heat conduction layer 28 and the heat insulation layer 29 are laminated on each other as long as the thickness of the display device 11 is not affected. A multilayer structure is also possible. It is also possible to provide the heat dissipation area 27 not only between the protective layer 26 and the flexible printed wiring board 18 but also between the organic electroluminescent element 13 and the protective layer 26.

In the above embodiment, the electronic device 10 is used.
As described above, the case of the television receiver including the display device 11 has been described, but the present invention can also be applied to other electronic devices including the display device 11. For example, from mobile phones, PDAs (Personal Digital Assistants), personal digital assistants such as laptop computers, desktop computers, and other small devices, to single-line display types used to display train and flight schedules, etc. It can be considered to be applied to various types of information display devices up to medium and large size, and ultra-large size information / display devices used in streets and concert venues.

[0054]

As described above, the display device according to any one of claims 1 to 7 or claim 8
According to the method of manufacturing a display device according to any one of claims 12 to 12, on a side opposite to the substrate of the organic electroluminescent element,
Since the heat dissipation area including at least one heat conduction layer is provided, the heat generated in the manufacturing process of the display device or applied from the outside, or the heat generated in the organic electroluminescent element during the operation of the display device. Can be dispersed through the heat conduction layer in the heat dissipation region without concentrating at one point. For example, the heat of fusion of the conductive material when forming the electrical connection is not concentrated at one point around the electrical connection, but is dispersed through the heat conduction layer, and the heat transferred to the organic electroluminescent device is significantly reduced. Can be made. As described above, by providing the heat-dissipating region, the adverse effect of heat on the organic electroluminescent layer of the organic electroluminescent element can be reduced, and the deterioration of the organic electroluminescent element can be prevented. Therefore,
In this display device, the degree of freedom in pixel layout is increased, and the aperture ratio can be improved.

Particularly, according to the display device of claim 3 or 4, or the method of manufacturing the display device of claim 10 or 11, a heat conductive layer is provided in the heat dissipation region,
Since the heat-insulating layer in contact with one surface of the heat-conducting layer is included, for example, the heat of fusion of the conductive material is first blocked by the heat-insulating layer, and only the excess heat not blocked by the heat-insulating layer is heated. By being dispersed in the conductive layer, the heat transferred to the organic electroluminescent layer of the organic electroluminescent device can be further reduced.

Further, in particular, according to the display device of claim 2 or the manufacturing method of the display device of claim 9, a protective layer is further provided, and the position where the heat dissipation region is provided is set to the protective layer and the wiring. Since it is provided between the substrate and the substrate, less heat is transferred to the protective layer, and the range of materials for the protective layer can be selected.

In addition, in particular, according to the display device according to claim 5 or 6, or the display device according to claim 12, the heat conducting layer or the heat insulating layer is a commonly available material. It is composed of a certain polymer, and as the film forming method, a general method such as vapor deposition in vacuum or sputtering can be adopted.

Further, in particular, according to the display device of the seventh aspect, since the peripheral portion of the heat conducting layer is exposed at the peripheral portion of the substrate, the heat dispersed in the heat conducting layer can be released. As a result, deterioration of the organic electroluminescent device can be effectively prevented.

According to the electronic apparatus of the thirteenth aspect, since the display device of the present invention is provided, the adverse effect on the organic electroluminescent layer due to heat is reduced, and consequently the deterioration of the organic electroluminescent element can be prevented. it can.

[Brief description of drawings]

FIG. 1 is an enlarged exploded perspective view of a part of a display device according to an embodiment of the present invention viewed from the back surface side of a substrate.

FIG. 2 is a plan view showing a schematic configuration of a back surface of a substrate of the display device shown in FIG.

3 is a cross-sectional view taken along the line III-III in FIG.

FIG. 4 is a perspective view showing the organic electroluminescent device shown in FIG. 3 with a part thereof cut away.

5 is an explanatory diagram for explaining the operation of the heat dissipation region shown in FIG. 3, and is a diagram in the case where the heat dissipation region is not provided.

6 is a perspective view showing an appearance of an electronic device including the display device shown in FIG.

FIG. 7 is a cross-sectional view showing a modified example of the organic electroluminescent device shown in FIG.

FIG. 8 is a cross-sectional view showing another modification of the organic electroluminescence device shown in FIG.

9 is a cross-sectional view showing still another modified example of the organic electroluminescent device shown in FIG.

[Explanation of Codes] 10 ... Electronic device, 11 ... Display device, 11A ... Outer case, 12 ... Substrate, 12A ... Front surface, 12B ... Back surface, 12C
... Alignment mark, 13 ... Organic electroluminescent device, 1
4 ... Pixel (light emitting point), 15 ... Connection point, 16 ... Driving IC, 17 ... Driving circuit board, 17A, 17B ... Connector, 18, 19 ... Flexible printed wiring board, 18
A, 18B ... Hole, 18C, 18D ... Conductive film, 18E ... Electrical connection part, 21 ... Substrate side protective layer, 22 ... First electrode layer, 23 ... Organic electroluminescent layer, 24 ... Second electrode layer, 25
... Insulating layer, 26 ... Protective layer, 27 ... Heat dissipation area, 28 ... Heat conducting layer, 29, 29A, 29B ... Heat insulating layer, 30 ... Adhesive agent, 31 ... First plug, 31A ... First electrode pad,
32 ... Second plug, 32A ... Second electrode pad

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05B 33/04 H05B 33/04 33/10 33/10 33/14 33/14 A (72) Inventor Kobayashi Masato 6-735 Kitashinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Shunji Amano 6-735 Kitashinagawa, Shinagawa-ku, Tokyo Sony Corporation F-term (reference) 3K007 AB11 AB17 AB18 BA06 BB07 CA01 CB01 CC05 DA01 DB03 EB00 FA01 FA02 5C094 AA04 AA10 AA13 AA14 AA31 AA43 AA47 AA48 AA53 AA55 BA27 CA19 DA07 DA09 DA12 DA13 DB01 DB03 DB05 EA02 EA04 EA05 EB02 FA01 FA02 FB01 FB02 FB12 FB15 FB20 GB10 5G435 AA03 AA07 AA14 AA16 AA17 AA18 BB05 CC09 EE36 EE43 HH12 HH14 HH20 KK05 KK10

Claims (13)

[Claims] 1. A substrate, an organic electroluminescent device having a structure in which a first electrode layer, an organic electroluminescent layer, and a second electrode layer are arranged in this order on the substrate, and the organic electric field. While being provided on the opposite side of the substrate of the light emitting device, a heat dissipation region including at least one heat conducting layer, and formed at a position deviated from the organic electroluminescent device, penetrating the heat dissipation region, A conductive first plug that reaches the first electrode layer, and a conductive plug that is formed at a position deviated from the organic electroluminescent element, penetrates the heat dissipation region, and reaches the second electrode layer. Conductive second plug, a wiring board having a plurality of holes in which a conductive film is formed on the peripheral edge and the inner peripheral surface at positions corresponding to the first and second plugs, and a plurality of holes of the wiring board, respectively. In, the conductive film of the wiring board A display device, comprising: an electric connection part that electrically connects the first and second plugs. 2. The display device according to claim 1, further comprising a protective layer provided between the organic electroluminescent device and the heat dissipation region to protect the organic electroluminescent device. 3. The heat-dissipating region comprises a single heat-conducting layer,
The display device according to claim 1, further comprising a single heat insulating layer provided in contact with one surface of the heat conducting layer. 4. The display device according to claim 3, wherein the heat dissipation area includes another heat insulating layer provided in contact with the other surface of the heat conducting layer. 5. The display device according to claim 3, wherein the heat conducting layer or the heat insulating layer is made of a polymer. 6. The heat conducting layer is made of metal, aluminum nitride (AlN), DLC (Diamond Like Carbon) or boron nitride (BN), and the heat insulating layer is made of polyimide or polysulfone. The display device according to claim 3. 7. The display device according to claim 1, wherein a peripheral portion of the heat conducting layer is exposed at a peripheral portion of the substrate. 8. A step of forming an organic electroluminescent device having a first electrode layer, an organic electroluminescent layer, and a second electrode layer on a substrate, and the substrate of the organic electroluminescent device. Forming a heat-dissipating region including at least one heat-conducting layer on the opposite side; and conducting to penetrate the heat-dissipating region and reach the first electrode layer at a position separated from the organic electroluminescent device. And a step of forming a conductive second plug penetrating the heat dissipation region and reaching the second electrode layer at a position separated from the organic electroluminescent element. After aligning a wiring board having a plurality of holes having conductive films formed on the peripheral edge and the inner peripheral surface at positions corresponding to the first and second plugs with the board, the wiring board is electrically conductive to each of the plurality of holes. The step of filling with a volatile substance, A step of forming an electrical connection portion by heating and melting a conductive material, and connecting the conductive film of the wiring board to the first plug or the second plug. Production method. 9. A step of forming a protective layer for protecting the organic electroluminescent element is included between the step of forming the organic electroluminescent element and the step of forming the heat dissipation region. The method for manufacturing a display device according to claim 8. 10. The display device according to claim 8, wherein, in the step of forming the heat dissipation region, after forming one heat conducting layer, one heat insulating layer is formed on the heat conducting layer. Manufacturing method. 11. In the step of forming the heat dissipation area, after forming one heat insulating layer, forming a heat conducting layer on the heat insulating layer, and forming another heat insulating layer on the heat conducting layer. The method for manufacturing a display device according to claim 10, wherein: 12. The method of manufacturing a display device according to claim 10, wherein the heat conductive layer and the heat insulating layer are formed by vacuum evaporation or sputtering. 13. An electronic device including a display device, wherein the display device includes a substrate, a first electrode layer, an organic electroluminescent layer, and a second electrode layer on the substrate in this order. An organic electroluminescent element having a structure arranged, a heat dissipation area provided on the opposite side of the organic electroluminescent element from the substrate, and including a heat conducting layer of at least one layer, and a position deviated from the organic electroluminescent element And a conductive first plug that penetrates the heat dissipation region and reaches the first electrode layer, and is formed at a position away from the organic electroluminescent element, and that dissipates the heat. A conductive second plug penetrating the region and reaching the second electrode layer and a plurality of holes having a conductive film formed on the peripheral edge and the inner peripheral surface correspond to the first and second plugs. A wiring board having a position, and the wiring An electronic device in each of a plurality of holes, characterized by comprising an electrical connection part formed by electrically connecting the conductive film of the wiring board and the first or second plug plate.