1323799 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種喷墨製程，尤指一種利用加熱光源之 喷墨製程。 【先前技術】 隨著電子資訊產業的蓬勃發展，液晶顯示器（liquid crystal display, LCD)的應用範圍以及市場需求也不斷在擴 大’從小型產品，如電子血壓計，到可攜帶式資訊產品， 如個人數位助理（PDA)、筆記型電腦（notebook)，以至於未 來非常可能商業化的大晝面顯示器，均可見到液晶顯示器 被廣泛應用於其上。由於液晶顯示器的結構非常輕薄短 小’同時又具有耗電量少以及無·輻射污染的優點，因此被 廣泛應用在上述民生及資訊產品上。 薄膜電晶體液晶顯示器基本上包含有一薄膜電晶體陣 列基板、一彩色濾光片（color filter)基板、以及填充於薄膜 電晶體陣列基板與彩色濾光片基板之間的液晶材料。其 中，薄膜電晶體陣列基板另包含有一透明基板(transparent substrate)，例如一玻璃基板，其上具有許多排列成陣列的 薄膜電晶體、像素電極(pixel electrode)、位於不同平面的 掃摇線(scan line)與資料線(data Hne)，並配合以適當的電 谷、連接墊等電子元件，來驅動液晶像素，進而產生豐富 1323799 亮麗的圖像。而彩色濾光片基板則另包含有一透明基板， 其上具有許多陣列排列的彩色濾光片及一共用電極 (common electrode) ° 在習知薄膜電晶體液晶顯示器之製作過程中，一般係利 用多道黃光暨蝕刻製程(PEP)以形成薄膜電晶體陣列基板 所需之像素電極、掃瞄線以及資料線。而在製作習知彩色 濾光片基板則主要包含有R、G、B三原色光阻的塗佈、間 • 隙對位曝光、以及顯影製程等三步驟。然而，傳統進行三 原色光阻塗佈的塗佈製程之材料使用率只有約1〜2%，而且 彩色濾光片基板須歷經多次黃光、清洗等製程。此外，薄 膜電晶體陣列基板更需配合製作像素電極、掃瞄線以及資 料線之沉積、黃光、独刻、清洗等製程，進而增加透明基 板及製程圖案的損傷以及與化學溶劑接觸的機會。為了改 善此缺點，目前業界開始利用喷墨製程方法來改善習知利 φ 用多道製程來製作薄膜電晶體液晶顯示器之缺點。 請參照第1圖，第1圖為習知喷墨製程之方法示意圖。 如第1圖所示，首先提供一玻璃基板26，例如一彩色濾光 片基板，接著利用一喷墨設備20，來於玻璃基板26上製 : 作所需之彩色濾光片圖案。其中喷墨設備20包含有至少一 喷墨頭（以下簡稱喷頭）22以及一控制機台（圖未示），而玻璃 基板26表面則包含有一黑色矩陣28，用來提高薄膜電晶 丄 ju/yy 體液晶顯=器的對比度並遮擋薄膜電晶體陣列基板之薄膜 '電B曰體掃咏線以及資料線的不透光部分。然後依照不同 •製程與產品的需求喷塗一彩色光阻毁料Μ於玻璃基板％ 表面之黑色矩陣28之間。隨後再將玻璃基板26移至一高 溫退火爐進行一硬化製程，以硬化塗佈於玻璃基板％表面 之漿料24。 由上述可見，傳統嗔墨塗佈法主要包含有兩階段製程： 參首先利用噴頭22直接對玻璃基板26進行喷墨塗佈，迨整 面玻璃基板26塗佈完後’接著再移至一高溫退火爐進行硬 •化(curing)製程。因為如欲在玻璃基板％進行喷墨塗佈時， ，便直接利用加熱板(hot Plate)等A面積加熱方式來對玻璃 基板26進行熱烘烤(hotbaking)，則製程室内過高的溫度不 但會影響噴碩22而造成噴墨出口阻塞，導致喷墨圖案大小 不一致，而且也會使得每一個喷墨塗佈圖案受熱的時間也 • 不均勻。因此傳統喷墨塗佈與硬化製程需分兩階段進行， 進而增加製程的時間。 除此之外’習知喷墨製程亦會因需進行兩階段的製程而 無法有效控制漿料噴塗於玻璃基板上的尺寸，進而導致浆 : 料溢流的情況發生，因此曰本專利JP08-29776便揭露一種 利用添加多孔矽化物（silica)來增加彩色光阻漿料的表面張 力’以有效控制漿料與域璃基板間的表面張力及接觸角， 1323799 進而改善此等問題。但是這種方法不但增加製程步驟與製 造成本，並降低薄膜電晶體液晶顯示器之透光率，而且也 不完全適用其他聚亞醯胺（polyimide)、銀膠或液晶等任何 可以喷墨方式塗佈的材料。 【發明内容】 因此本發明之主要目的在於提供一種改良之喷墨製程 方法，以改善習知喷墨製程因需分兩階段進行而造成漿料 • 溢流與不均勻漿料形成之尺寸與形狀等問題。 根據本發明之申請專利範圍，係揭露一種喷墨製程。首 先提供一基板，然後進行一喷墨步驟，以喷塗一漿料至該 基板表面。接著即時(in-situ)進行一局部加熱步驟，以直接 對剛嗔塗至該基板表面之該聚料進行加熱，進而控制該聚 料之形狀與位置。 由於本發明係於喷頭喷塗一漿料於玻璃基板的同時利 用一加熱光源並配合一光學聚焦系統對剛喷塗於該玻璃基 板表面之漿料進行局部加熱，因此可有效控制漿料之加熱 時間與加熱範圍。除此之外，本發明之加熱光源亦可與喷 -頭進行同步移動，進而確保後續漿料形成之尺寸與形狀， 以改善習知喷墨製程方:法因需進行兩階段製程而造成漿料 溢流、噴頭堵塞以及不均勻之漿料尺寸與形狀等問題。 ⑧ 8 1323799 範圍均在相同的時間下進行加熱。 值得注意的是，本發明之喷墨製程方法並不僅侷限於上 < · 述之彩色濾光片基板之彩色濾光片圖案的製程，一般而 言，視不同製程與產品的的需求，本發明可以應用在彩色 濾光片基板與薄膜電晶體陣列基板的各式製程中，而且喷 塗於玻璃基板上的漿料可包含有彩色光阻、黑色矩陣、聚 亞醯胺(polyimide)、銀膠、氧化把(PdO)或液晶等任何可以 • 喷墨方式塗佈的材料。 此外，又如先前所述，由於本發明以喷墨方式所喷塗之 漿料64可視不同產品需求與製程設計來進行調配，因此本 發明又可搭配不同加熱光渾68來針對不同漿料64進行加 熱。舉例來說，根據本發明之最佳實施例，利用紫外光來 進行加熱之最佳漿料包含有彩色光阻、聚亞醯胺以及液 • 晶；利用紅外光來進行加熱之最佳聚料包含有液態金屬、 聚亞醯胺以及銀膠；而利用雷射光來進行加熱之最佳漿料 則包含有銀膠。其中，一般用來製作配向膜之聚亞醯胺可 利用紅外光與紫外光等兩種加熱光源來進行加熱，而銀膠 及氧化鈀亦可利用紅外光與雷射光等兩種加熱光原來進行 - 加熱。 一般而言，由於玻璃基板66表面具有較小的張力及附 1323799 82之喷頭進行同步移動，以確保玻璃基板移動時，加熱光 源可於相同的時間下對嘴塗於玻璃基板上的漿料進行加 熱，進而有效控制漿料之形狀與位置。 相較於習知利用喷墨製程方法，本發明係於喷頭喷塗一 漿料於玻璃基板的同時利用一加熱光源並配合一光學聚焦 系統對剛喷塗於該玻璃基板表面之漿料進行局部加熱，因 此可有效控制漿料之加熱時間與加熱範圍。除此之外，本 • 發明之加熱光源亦可與喷頭進行同步移動，進而確保後續 漿料形成之尺寸與形狀，以改善習知啧墨製程方法因需進 行兩階段製程而造成漿料溢流、喷頭堵塞以及不均勻之漿 料尺寸與形狀等問題。 以上所述僅為本發明之較佳實施例，凡依本發明申請 專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖為習知噴墨製程:之方法示意圖。 第2圖為本發明之噴墨製程方法示意圖。 第3圖為本發明嗔墨製程設備之方塊示意圖。 【主要元件符號說明】 20 噴墨設備 22 喷頭 1323799 24 漿料 26 玻璃基板 28 黑色矩陣 60 喷墨設備 62 喷頭 64 漿料 66 玻璃基板 68 .加熱光源 70 黑色矩陣 82 喷墨系統 84 光學系統 86 光源系統 88 同步偵測裝置 90 電腦控制器 13 ⑧1323799 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to an ink jet process, and more particularly to an ink jet process using a heat source. [Prior Art] With the rapid development of the electronic information industry, the application range and market demand of liquid crystal display (LCD) are constantly expanding. From small products, such as electronic blood pressure monitors, to portable information products, such as Personal digital assistants (PDAs), notebooks, and even large-format displays that are likely to be commercialized in the future, can be seen that liquid crystal displays are widely used. Since the structure of the liquid crystal display is very thin and short, and at the same time, it has the advantages of low power consumption and no radiation pollution, it is widely used in the above-mentioned people's livelihood and information products. The thin film transistor liquid crystal display basically comprises a thin film transistor array substrate, a color filter substrate, and a liquid crystal material filled between the thin film transistor array substrate and the color filter substrate. The thin film transistor array substrate further comprises a transparent substrate, such as a glass substrate, having a plurality of thin film transistors arranged in an array, a pixel electrode, and a sweep line located at different planes (scan) Line) and data line (data Hne), together with appropriate electronic valleys, connection pads and other electronic components to drive the liquid crystal pixels, resulting in a rich image of 1323799. The color filter substrate further includes a transparent substrate having a plurality of color filters arranged in an array and a common electrode. In the fabrication process of the conventional thin film transistor liquid crystal display, the system generally utilizes many The yellow light and etching process (PEP) is used to form the pixel electrode, the scan line and the data line required for the thin film transistor array substrate. In the conventional color filter substrate, the three main steps of R, G, and B primary color photoresist coating, gap alignment exposure, and development process are included. However, the material usage rate of the conventional three-primary photoresist coating process is only about 1 to 2%, and the color filter substrate has to undergo a plurality of processes such as yellow light and cleaning. In addition, the thin film transistor array substrate needs to be combined with the process of depositing pixel electrodes, scanning lines and data lines, yellow light, etching, cleaning, etc., thereby increasing the damage of the transparent substrate and the process pattern and the opportunity to contact with the chemical solvent. In order to improve this shortcoming, the industry has begun to use the inkjet process method to improve the shortcomings of the thin film transistor liquid crystal display by the multi-channel process. Please refer to FIG. 1 , which is a schematic diagram of a conventional inkjet process. As shown in Fig. 1, a glass substrate 26, such as a color filter substrate, is first provided, and then an ink jet device 20 is used to form a desired color filter pattern on the glass substrate 26. The inkjet device 20 includes at least one inkjet head (hereinafter referred to as a showerhead) 22 and a control machine (not shown), and the surface of the glass substrate 26 includes a black matrix 28 for improving the thickness of the thin film. /yy The contrast of the liquid crystal display and block the film 'electric B body broom line of the thin film transistor array substrate and the opaque portion of the data line. Then, according to different process and product requirements, a color photoresist is sprayed between the black matrix 28 on the surface of the glass substrate. Subsequently, the glass substrate 26 is moved to a high temperature annealing furnace for a hardening process to harden the slurry 24 coated on the % surface of the glass substrate. It can be seen from the above that the conventional ink coating method mainly comprises a two-stage process: First, the glass substrate 26 is directly ink-jet coated by the shower head 22, and after the entire surface glass substrate 26 is coated, it is then moved to a high temperature. The annealing furnace is subjected to a curing process. When it is desired to perform inkjet coating on a glass substrate%, the glass substrate 26 is directly hotbaated by an A-area heating method such as a hot plate, and the excessively high temperature in the process chamber is not only high. It will affect the blasting 22 and cause the ink jet outlet to block, resulting in inconsistent ink jet pattern size, and also making each inkjet coating pattern heated and non-uniform. Therefore, the conventional inkjet coating and hardening process needs to be carried out in two stages, thereby increasing the process time. In addition, the conventional inkjet process will not be able to effectively control the size of the slurry sprayed on the glass substrate due to the two-stage process, which will lead to the overflow of the slurry: therefore, JP08- 29776 discloses the use of a porous ceramic to increase the surface tension of a color photoresist paste to effectively control the surface tension and contact angle between the slurry and the domain substrate, and 1323799 further improves the problem. However, this method not only increases the process steps and manufacturing costs, but also reduces the light transmittance of the thin film transistor liquid crystal display, and is not fully applicable to any other inkjet coating such as polyimide, silver paste or liquid crystal. s material. SUMMARY OF THE INVENTION It is therefore a primary object of the present invention to provide an improved ink jet process for improving the size and shape of slurry overflow and uneven slurry formation in a conventional two-stage process. And other issues. An inkjet process is disclosed in accordance with the scope of the invention. A substrate is first provided and then an ink jetting step is performed to spray a slurry onto the surface of the substrate. A partial heating step is then performed in-situ to directly heat the polymer coated onto the surface of the substrate to control the shape and location of the polymer. The invention can effectively control the slurry by spraying a slurry on the glass substrate while using a heating source and an optical focusing system to locally heat the slurry just sprayed on the surface of the glass substrate. Heating time and heating range. In addition, the heating source of the present invention can also be moved synchronously with the spray head to ensure the size and shape of the subsequent slurry formation, so as to improve the conventional inkjet process: the method requires a two-stage process to cause the slurry. Problems such as material overflow, nozzle clogging, and uneven slurry size and shape. 8 8 1323799 The range is heated at the same time. It should be noted that the inkjet process method of the present invention is not limited to the process of color filter patterns of the color filter substrate described above. Generally, depending on the requirements of different processes and products, The invention can be applied to various processes of a color filter substrate and a thin film transistor array substrate, and the slurry sprayed on the glass substrate can comprise a color photoresist, a black matrix, a polyimide, a silver. Any material that can be coated by inkjet, such as glue, oxidized (PdO) or liquid crystal. In addition, as previously described, since the slurry 64 sprayed by the inkjet method of the present invention can be formulated according to different product requirements and process design, the present invention can be combined with different heating diaphragms 68 for different pastes. Heat up. For example, in accordance with a preferred embodiment of the present invention, an optimum slurry for heating with ultraviolet light comprises colored photoresist, polyamidamine, and liquid crystal; the optimum polymer for heating with infrared light Contains liquid metal, polyamidamine and silver glue; the best slurry for heating with laser light contains silver glue. Among them, the polyamidamine generally used for the preparation of the alignment film can be heated by two kinds of heating sources such as infrared light and ultraviolet light, and the silver glue and the palladium oxide can also be performed by using two kinds of heating light such as infrared light and laser light. - Heating. In general, since the surface of the glass substrate 66 has a small tension and the nozzles of the 1323799 82 are synchronously moved to ensure the movement of the glass substrate, the heating source can apply the paste to the glass substrate at the same time. Heating is performed to effectively control the shape and position of the slurry. Compared with the conventional inkjet process, the present invention uses a heating source and an optical focusing system to spray a slurry just sprayed on the surface of the glass substrate while spraying a slurry onto the glass substrate. Local heating, thus effectively controlling the heating time and heating range of the slurry. In addition, the heating light source of the present invention can also be moved synchronously with the nozzle to ensure the size and shape of the subsequent slurry formation, so as to improve the conventional inkjet process method due to the need for a two-stage process to cause slurry overflow. Flow, nozzle clogging, and uneven slurry size and shape issues. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional inkjet process: a method. Fig. 2 is a schematic view showing the ink jet process method of the present invention. Figure 3 is a block diagram of the inkjet process apparatus of the present invention. [Main component symbol description] 20 Inkjet device 22 Nozzle 1323799 24 Slurry 26 Glass substrate 28 Black matrix 60 Inkjet device 62 Nozzle 64 Paste 66 Glass substrate 68. Heating source 70 Black matrix 82 Inkjet system 84 Optical system 86 Light source system 88 Synchronous detection device 90 Computer controller 13 8