CN1982921A - Ink-jetting process - Google Patents
Ink-jetting process Download PDFInfo
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- CN1982921A CN1982921A CN 200510131455 CN200510131455A CN1982921A CN 1982921 A CN1982921 A CN 1982921A CN 200510131455 CN200510131455 CN 200510131455 CN 200510131455 A CN200510131455 A CN 200510131455A CN 1982921 A CN1982921 A CN 1982921A
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Abstract
An ink-jet process includes providing a base plate, carrying out an ink-jet process to spray a size on surface of said base plate, heating original position of spraying for directly heating size just sprayed on surface of said base plate and furthermore for controlling shape and position of said size.
Description
Technical field
The present invention relates to a kind of ink-jetting process, relate in particular to a kind of ink-jetting process that utilizes heated light sources.
Background technology
Flourish along with electronics and information industry, LCD (liquid crystal display, LCD) the range of application and the market demand are also constantly enlarging, from small sized product, as electronic sphygmomanometer, to the portable information product, as PDA(Personal Digital Assistant), notebook (notebook), to such an extent as to future is the business-like big view display of possibility very, all can see LCD and be widely used on it.Because the structure of LCD is very compact, have the advantage of the few and radiationless pollution of power consumption simultaneously again, therefore be widely used on the above-mentioned civilian and information products.
Thin Film Transistor-LCD consist essentially of a thin-film transistor array base-plate, a colored filter (color filter) substrate and be filled in thin-film transistor array base-plate and colored filter substrate between liquid crystal material.Wherein, thin-film transistor array base-plate also comprises a transparency carrier (transparentsubstrate), a glass substrate for example, have many thin film transistor (TFT), the pixel electrode (pixel electrode) of array, the sweep trace (scan line) that is positioned at Different Plane and data lines (data line) of being arranged on it, and cooperate with electronic components such as suitable electric capacity, connection pads, drive liquid crystal pixel, and then beautiful image is enriched in generation.Colored filter substrate then also comprises a transparency carrier, has the colored filter and a public electrode (common electrode) of many arrayed on it.
In the manufacturing process of existing Thin Film Transistor-LCD, general using multiple tracks photoetching process (PEP) is to form required pixel electrode, sweep trace and the data line of thin-film transistor array base-plate.Making three steps such as coating, gap contraposition exposure and developing process that existing colored filter substrate then mainly comprises R, G, the photic resist of B three primary colors.Yet tradition is carried out the material utilization rate of the coating process of the photic resist-coating of three primary colors and is only had an appointment 1～2%, and colored filter substrate must be gone through repeatedly technology such as photoetching, cleaning.In addition, thin-film transistor array base-plate more need cooperate technologies such as the deposition of making pixel electrode, sweep trace and data line, photoetching, etching, cleaning, and then increases transparency carrier and the damage of art pattern CAD and the chance that contacts with chemical solvent.In order to improve this shortcoming, industry begins to utilize the ink-jetting process method to improve the existing shortcoming of utilizing multiple tracks technology to make Thin Film Transistor-LCD at present.
Please refer to Fig. 1, Fig. 1 is the method synoptic diagram of existing ink-jetting process.As shown in Figure 1, at first provide a glass substrate 26, for example a colored filter substrate then utilizes an ink-jet apparatus 20, comes to make on glass substrate 26 required color filter patterns.Wherein ink-jet apparatus 20 comprises an at least one ink gun (hereinafter to be referred as shower nozzle) 22 and a control board (figure does not show), glass substrate 26 surfaces then comprise a black matrix" 28, are used for improving the contrast of Thin Film Transistor-LCD and block the lightproof part of thin film transistor (TFT), sweep trace and the data line of thin-film transistor array base-plate.Demand according to different process and product sprays a colored photoresist slurry 24 between the black matrix" 28 on glass substrate 26 surfaces then.Again glass substrate 26 is moved to a high-temperature annealing furnace subsequently and carry out a hardening process, coat the slurry 24 on glass substrate 26 surfaces with sclerosis.
As seen by above-mentioned, traditional ink-jet application method mainly comprises two-stage process: at first utilize shower nozzle 22 directly glass substrate 26 to be carried out ink-jet application, treat that whole surface glass substrate 26 has been coated with after, then move to a high-temperature annealing furnace (curing) technology of hardening again.Because as desire when glass substrate 26 carries out ink-jet application, just directly utilize heating plate large tracts of land type of heating such as (hot plate) to come glass substrate 26 is carried out heat baking (hot baking), then too high temperature not only can influence shower nozzle 22 and cause the ink-jet outlet to block in the process chamber, cause that ink-jetting pattern is not of uniform size to be caused, and the time that can make each ink-jet application pattern be heated is also inhomogeneous.Therefore traditional ink-jet application and hardening process need carry out in two stages, and then increase the time of technology.
In addition, existing ink-jetting process also can can't effectively be controlled slurry and is sprayed at size on the glass substrate because of need carry out two stage technology, and then cause the situation of slurry overflow to take place, therefore Jap.P. JP08-29776 just discloses the surface tension that a kind of utilization interpolation porous silicide (silica) increases colored photoresist slurry, with surface tension and the contact angle between effective control slurry and glass substrate, and then improve this type of problem.But this method not only increases processing step and manufacturing cost, and reduces the transmittance of Thin Film Transistor-LCD, nor is suitable for any material that can the ink-jetting style coating such as other polyimide (polyimide), elargol or liquid crystal fully.
Summary of the invention
Therefore fundamental purpose of the present invention is to provide a kind of ink-jetting process method of improvement, to improve the problems such as size and shape of existing ink-jetting process because of causing slurry overflow and heterogeneous slurry to form in two stages.
According to claim of the present invention, disclose a kind of ink-jetting process.One substrate at first is provided, carries out an ink-jet step then, to spray a slurry to this substrate surface.Then original position (in-situ) is carried out a spot heating step, directly this slurry that just is sprayed into this substrate surface being heated, and then controls the shape and the position of this slurry.
Because the present invention sprays a slurry at shower nozzle and utilizes a heated light sources and cooperate an optical focusing system that the slurry that just is sprayed at this glass baseplate surface is carried out spot heating in glass substrate, therefore can effectively control the heat time heating time and the heated perimeter of slurry.In addition, heated light sources of the present invention also can be carried out same moved further with shower nozzle, and then guarantee to cause problems such as slurry overflow, shower nozzle obstruction and uneven slurry size and shape to improve existing ink-jetting process method because of need carry out two-stage process by the size and shape that follow-up slurry forms.
Description of drawings
Fig. 1 is the method synoptic diagram of the existing ink-jetting process of explanation.
Fig. 2 is an explanation ink-jetting process method synoptic diagram of the present invention.
Fig. 3 is the block schematic diagram of explanation ink-jetting process equipment of the present invention.
The main element symbol description
20 ink-jet apparatus, 22 shower nozzles
24 slurries, 26 glass substrates
28 black matrix"s, 60 ink-jet apparatus
62 shower nozzles, 64 slurries
66 glass substrates, 68 heated light sources
70 black matrix"s, 82 ink-jet systems
84 optical systems, 86 light-source systems
88 synchronous arrangement for detecting 90 computer controls
Embodiment
Please refer to Fig. 2, Fig. 2 is an ink-jetting process method synoptic diagram of the present invention.One glass substrate 66 at first is provided, and for example a colored filter substrate then utilizes an ink-jet apparatus 60, comes to make on glass substrate 66 required color filter patterns.Wherein ink-jet apparatus 60 comprises that at least one shower nozzle 62 and is used for supplying with slurry and controls the control board (figure do not show) of shower nozzle 62 moving directions, glass substrate 66 surfaces then are provided with a black matrix" 70 in addition, are used for improving the contrast of Thin Film Transistor-LCD and block the lightproof part of thin film transistor (TFT), sweep trace and the data line of thin-film transistor array base-plate.According to the demand of different process and product, utilize shower nozzle 62 sprayings one colored photoresist slurry 64 then to glass substrate 66 surfaces.
As shown in Figure 2, spraying slurry 64 in glass substrate 66, the present invention provides a heated light sources 68 of being made up of infrared light (IR), ultraviolet light (UV) or LASER Light Source (Laser) earlier, utilize an optical system (figure does not show) that the light beam that heated light sources 68 is provided is assembled then, in order to the slurry 64 that just is sprayed at glass substrate 66 surfaces is carried out spot heating.In other words, because heated light sources 68 can control its heated perimeter by this optical focusing system, so the present invention can carry out spot heating to the slurry 64 that is sprayed at glass substrate 66 surfaces and control heat time heating time of each heated perimeter.In addition, when glass substrate 66 moved to next zone and carries out ink-jet, heated light sources 64 was carried out same moved further with shower nozzle 62 with respect to glass substrate 66, all heats under the identical time to guarantee each spot heating scope.
It should be noted that, ink-jetting process method of the present invention also not only is confined to the technology of the color filter patterns of above-mentioned colored filter substrate, generally speaking, look the demand of different process and product, the present invention can be applied in the various technology of colored filter substrate and thin-film transistor array base-plate, and is sprayed at slurry on the glass substrate and can comprises any material that can the ink-jetting style coating such as colored photoresist, black matrix", polyimide (polyimide), elargol, palladium oxide (PdO) or liquid crystal.
In addition, and for example before described, because the present invention allocates with slurry 64 visual different product demands and technological design that ink-jetting style was sprayed, so the present invention's different heating light source 68 of can arranging in pairs or groups again heats at different slurries 64.For instance, according to a preferred embodiment of the invention, the best slurry that utilizes ultraviolet light to heat comprises that colorama causes resist, polyimide and liquid crystal; The best slurry that utilizes infrared light to heat comprises liquid metal, polyimide and elargol; The best slurry that utilizes laser to heat then comprises elargol.Wherein, the polyimide (polyimide) that generally is used for making alignment film can utilize two kinds of heated light sources such as infrared light and ultraviolet light to heat, and elargol and palladium oxide also can utilize two kinds of heated light sources such as infrared light and laser to heat.
Generally speaking, because glass substrate 66 surfaces have less tension force and adhesion, so when slurry 64 was sprayed on the glass substrate 66, the shape of slurry 64 just can be wayward.Therefore the present invention promptly utilizes previous described heated light sources 68 local to being sprayed at after slurry 64 on the glass substrate 66 carries out short annealing, just can effectively control the shape and the position of the slurry 64 on the glass substrate 66, and the present invention also can utilize the mode of this while and spot heating, be applied to the technology of different slurries, and then realize the effect of different technology conditions.For instance, the present invention can make colored photoresist be difficult for overflow when the colored photoresist of spraying, or can control size and the thickness that silver metal is shaped when the spraying elargol, and carries out the curing of each liquid crystal cells (cell) when the spraying liquid crystal simultaneously.
Please refer to Fig. 3, Fig. 3 is the block schematic diagram of ink-jetting process equipment of the present invention.As shown in Figure 3, ink-jetting process equipment of the present invention comprises that an ink-jet system 82, is used for the optical system 84, that focuses on of heating light beam is provided light-source system 86, the one synchronous arrangement for detecting 88 and the computer control 90 of various heated light sources.Wherein, ink-jet system 82 comprises that at least one shower nozzle and is used for holding and provides the control board of slurry to shower nozzle.Therefore when ink-jet system 82 sprayings one slurry is on a glass substrate, light-source system 86 just can provide a heated light sources of being made up of infrared light (IR), ultraviolet light (UV) or LASER Light Source (Laser), and this heated light sources is focused on by optical system 84, heat the slurry that is sprayed at glass substrate real-time then and part, with shape and the position of controlling this slurry.In addition, when heated light sources heats this slurry, the user can utilize synchronous arrangement for detecting 88 to make the heated light sources of light-source system 86 and the shower nozzle of ink-jet system 82 carry out same moved further with computer control 90, when guaranteeing that glass substrate moves, heated light sources can heat the slurry that is sprayed on the glass substrate under the identical time, and then effectively controls the shape and the position of slurry.
Than the existing method of utilizing ink-jetting process, the present invention sprays a slurry at shower nozzle and utilizes a heated light sources and cooperate an optical focusing system that the slurry that just is sprayed at this glass baseplate surface is carried out spot heating in glass substrate, therefore can effectively control the heat time heating time and the heated perimeter of slurry.In addition, heated light sources of the present invention also can be carried out same moved further with shower nozzle, and then guarantee to cause problems such as slurry overflow, shower nozzle obstruction and uneven slurry size and shape to improve existing ink-jetting process method because of need carry out two-stage process by the size and shape that follow-up slurry forms.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (11)
1. an ink-jetting process comprises the following steps:
One substrate is provided;
Carry out an ink-jet step, to spray a slurry to this substrate surface; And
Original position is carried out a spot heating step, directly this slurry that just is sprayed into this substrate surface being heated, and then controls the shape and the position of this slurry.
2. ink-jetting process as claimed in claim 1, wherein this substrate comprises a thin-film transistor array base-plate or a colored filter substrate.
3. ink-jetting process as claimed in claim 2, wherein this colored filter substrate surface also comprises a black matrix".
4. ink-jetting process as claimed in claim 3, wherein this slurry is sprayed between this black matrix" on this colored filter substrate surface.
5. ink-jetting process as claimed in claim 1, wherein this slurry comprises that colorama causes resist, polyimide, elargol, palladium oxide or liquid crystal.
6. ink-jetting process as claimed in claim 1, wherein this spot heating step utilizes a heated light sources to be implemented.
7. ink-jetting process as claimed in claim 6, wherein this heated light sources comprises infrared light, ultraviolet light or LASER Light Source.
8. ink-jetting process as claimed in claim 7, wherein this heated light sources is utilized an optical system that this heated light sources is focused on and this slurry that is sprayed at this substrate surface is heated.
9. ink-jetting process as claimed in claim 6, wherein this ink-jet step utilizes an ink-jet apparatus to be implemented.
10. ink-jetting process as claimed in claim 9, wherein this ink-jet apparatus comprises at least one shower nozzle, and one is used for supplying with this slurry and controls the control board of this shower nozzle moving direction.
11. ink-jetting process as claimed in claim 10, wherein when carrying out this ink-jetting process, this heated light sources and this shower nozzle carry out same moved further with respect to this substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510131455 CN1982921A (en) | 2005-12-14 | 2005-12-14 | Ink-jetting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510131455 CN1982921A (en) | 2005-12-14 | 2005-12-14 | Ink-jetting process |
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|---|---|
| CN1982921A true CN1982921A (en) | 2007-06-20 |
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| CN 200510131455 Pending CN1982921A (en) | 2005-12-14 | 2005-12-14 | Ink-jetting process |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102378539A (en) * | 2010-08-18 | 2012-03-14 | 素塔电子科技(上海)有限公司 | Method for depositing buffer material on framework of flat-panel display |
| CN102407665A (en) * | 2010-07-30 | 2012-04-11 | 株式会社理光 | Thin film forming device and method, piezoelectric element forming method, discharge head, and device |
| CN102854655A (en) * | 2012-09-25 | 2013-01-02 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and manufacturing method thereof |
| CN103439825A (en) * | 2013-09-05 | 2013-12-11 | 深圳市华星光电技术有限公司 | Film laying device and film laying method using same |
| US8833921B2 (en) | 2010-07-30 | 2014-09-16 | Ricoh Company, Limited | Thin-film forming apparatus, thin-film forming method, piezoelectric-element forming method, droplet discharging head, and ink-jet recording apparatus |
| CN108437632A (en) * | 2017-02-16 | 2018-08-24 | 惠普赛天使公司 | Substrates coatings |
-
2005
- 2005-12-14 CN CN 200510131455 patent/CN1982921A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102407665A (en) * | 2010-07-30 | 2012-04-11 | 株式会社理光 | Thin film forming device and method, piezoelectric element forming method, discharge head, and device |
| US8833921B2 (en) | 2010-07-30 | 2014-09-16 | Ricoh Company, Limited | Thin-film forming apparatus, thin-film forming method, piezoelectric-element forming method, droplet discharging head, and ink-jet recording apparatus |
| CN102407665B (en) * | 2010-07-30 | 2015-03-04 | 株式会社理光 | Thin film forming device and method, piezoelectric element forming method, discharge head, and device |
| CN102378539A (en) * | 2010-08-18 | 2012-03-14 | 素塔电子科技(上海)有限公司 | Method for depositing buffer material on framework of flat-panel display |
| CN102378539B (en) * | 2010-08-18 | 2015-05-06 | 苏州天辅新型建材有限公司 | Method for depositing buffer material on framework of flat-panel display |
| CN102854655A (en) * | 2012-09-25 | 2013-01-02 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and manufacturing method thereof |
| WO2014047987A1 (en) * | 2012-09-25 | 2014-04-03 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and manufacturing method thereof |
| CN102854655B (en) * | 2012-09-25 | 2015-07-22 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and manufacturing method thereof |
| CN103439825A (en) * | 2013-09-05 | 2013-12-11 | 深圳市华星光电技术有限公司 | Film laying device and film laying method using same |
| WO2015032178A1 (en) * | 2013-09-05 | 2015-03-12 | 深圳市华星光电技术有限公司 | Film laying apparatus and film laying method using apparatus |
| CN108437632A (en) * | 2017-02-16 | 2018-08-24 | 惠普赛天使公司 | Substrates coatings |
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