TWI319082B - - Google Patents

Info

Publication number
TWI319082B
TWI319082B TW095115216A TW95115216A TWI319082B TW I319082 B TWI319082 B TW I319082B TW 095115216 A TW095115216 A TW 095115216A TW 95115216 A TW95115216 A TW 95115216A TW I319082 B TWI319082 B TW I319082B
Authority
TW
Taiwan
Application number
TW095115216A
Other versions
TW200641329A (en
Inventor
Takeshi Endo
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200641329A publication Critical patent/TW200641329A/zh
Application granted granted Critical
Publication of TWI319082B publication Critical patent/TWI319082B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
TW095115216A 2005-05-13 2006-04-28 Overlay measurement apparatus TW200641329A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005140753A JP4635711B2 (ja) 2005-05-13 2005-05-13 重ね合わせ測定装置

Publications (2)

Publication Number Publication Date
TW200641329A TW200641329A (en) 2006-12-01
TWI319082B true TWI319082B (zh) 2010-01-01

Family

ID=37493796

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115216A TW200641329A (en) 2005-05-13 2006-04-28 Overlay measurement apparatus

Country Status (3)

Country Link
US (1) US7428063B2 (zh)
JP (1) JP4635711B2 (zh)
TW (1) TW200641329A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4792833B2 (ja) * 2005-06-24 2011-10-12 株式会社ニコン 重ね合わせ測定装置
TW200928880A (en) * 2007-12-21 2009-07-01 Pixart Imaging Inc Displacement detection apparatus and method
JP6002480B2 (ja) * 2012-07-06 2016-10-05 株式会社日立ハイテクノロジーズ オーバーレイ誤差測定装置、及びパターン測定をコンピューターに実行させるコンピュータープログラム
WO2014052811A1 (en) * 2012-09-28 2014-04-03 Rudolph Technologies, Inc. Inspection of substrates using calibration and imaging
KR102094974B1 (ko) * 2013-03-08 2020-03-30 삼성전자주식회사 오버레이 계측 방법
CN107148597B (zh) 2014-08-29 2020-05-01 Asml荷兰有限公司 度量方法、目标和衬底
IL256196B (en) 2015-06-17 2022-07-01 Asml Netherlands Bv Prescription selection based on inter-prescription composition
US20170052458A1 (en) * 2015-08-21 2017-02-23 Globalfoundries Inc. Diffractive overlay mark
US11118903B2 (en) * 2018-10-17 2021-09-14 Kla Corporation Efficient illumination shaping for scatterometry overlay

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348104A (ja) * 1989-07-17 1991-03-01 Nippon Telegr & Teleph Corp <Ntt> 重ね合せ偏差測定方法およびその測定装置
JP3814982B2 (ja) 1997-10-06 2006-08-30 株式会社ニコン 重ね合わせ精度測定方法及び測定機
JP2001272208A (ja) * 2000-03-27 2001-10-05 Toshiba Corp 重ね合わせずれ検査装置、重ね合わせずれ検査用マークおよび重ね合わせずれ検査方法
US6724479B2 (en) * 2001-09-28 2004-04-20 Infineon Technologies Ag Method for overlay metrology of low contrast features
JP2003124104A (ja) * 2001-10-18 2003-04-25 Nikon Corp 位置検出装置、露光装置、および露光方法
US6716559B2 (en) * 2001-12-13 2004-04-06 International Business Machines Corporation Method and system for determining overlay tolerance
JP3967935B2 (ja) * 2002-02-25 2007-08-29 株式会社日立製作所 合わせ精度計測装置及びその方法
DE10227304A1 (de) * 2002-06-19 2004-01-15 Infineon Technologies Ag Verfahren zum Belichten eines Halbleiterwafers in einem Belichtungsapparat
US7170604B2 (en) * 2002-07-03 2007-01-30 Tokyo Electron Limited Overlay metrology method and apparatus using more than one grating per measurement direction
JP4300802B2 (ja) * 2003-01-06 2009-07-22 株式会社ニコン マーク位置検出装置、マーク位置検出方法、重ね合わせ測定装置、および、重ね合わせ測定方法
JP4442130B2 (ja) * 2003-07-07 2010-03-31 株式会社ニコン 重ね合わせ測定装置および方法

Also Published As

Publication number Publication date
JP2006317306A (ja) 2006-11-24
JP4635711B2 (ja) 2011-02-23
TW200641329A (en) 2006-12-01
US20060274312A1 (en) 2006-12-07
US7428063B2 (en) 2008-09-23

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