1317608 九、發明說明： 【發明所屬之技術領域】 . 本發明涉及一種電路板及使用其的感光裝置。 【先前技術】 目前，大多數便攜式電子設備，如：筆記型電腦、個人數 位助理（personal digital assistant，PDA)等，均具有 lcd (1 iquid crystal display)面板，該種面板通常使用放電燈 馨 （discharge lamp)或其他類型的燈管作為背光源。因此，LCD 面板需要一換流器（Inverter )來點亮其内部之燈管，同時利 用一感光模組感測環境亮度，維持和調節LCD面板之亮度，使 _其亮度隨著環境亮度的變化而變化，節省電源能量。 ' 通常，不同廠商之感光模組具有不同之特性，故其所對應 之換流器電路結構亦不相同。因此，換流器生產廠商需要依照 不同廠商的感光模組分別設計電路板佈線，這不僅增加了電路 籲板設計的複雜性，而且當其中一廠商感光模組缺貨的情況下無 法快速用另一廠商之感光模組替換，需要重新設計電路佈線結 構，增加成本的同時，延遲產品量產與出貨時間。 【發明内容】 有鑑於此’需k供一種電路板’可適用安裝不同種類之感 光模組，而無需改變電路佈局。 還需提供一種感光裝置，其可應用不同種類之感光模組， 而無需重新設計電路佈局。 6 1317608 一種電路板，可適用於安裝不同種類之感光模組’包括一 感光區域以及複數銲塾。該等銲墊設置於該感光區域週圍，用 於電性連接一感光模組於其上。 一種感光裝置，包括一電路板以及一感光模組。其中，電 路板可適用於安裝不同種類之感光模組，其包括一感光區域以 及複數銲墊。其中，該等銲墊設置於該感光區域週圍，感光模 組與該等銲塾之部分電性連接以設置於該電路板上。 • 本發明之電路板具有複數銲墊，可在不改變電路板佈局的 情況下’安裝不同類型之感光模組。 '【實施方式】 圖1所示係本發明一實施方式中電路板1之平面示意圖。 、本實施方式中’電路板1包括一感光區域12以及複數銲墊 (Pads)。該等銲墊設置於該感光區域12週圍，且至少分為兩 種類塑10、11。其中，銲墊10設置於該感光區域12之一相對 參兩侧；銲整11设置於該感光區域12之另一相對兩侧。本實施 方式中，感光區域12係一開孔，用於光線入射。本發明其他 實施方式中，該感光區域12可以為一透光區域，例如：一導 光枉、<透光玻璃等。 同時參閱圖2與圖3，圖2所示為本發明圖i所示電路板 工之一應用示意圖，以及圖3所示為一實施方式之感光裝置之 側祝圖’該感光裝置係由圖2之電路板1與一感光模組20組 合而成。 7 1317608 本實施方式中，感光模組20相對於開孔12設置於電路板 1上，並與電路板1電性連接。該感光模組20包括一塑封膠體 • 21、一晶片22、一晶片載板23以及至少一對引腳24。其中， 該等引腳24之個數與電路板1上之銲墊1〇之個數相對應。部 分該等引腳24與其對應之銲墊10電性相連，而部分該等引腳 24用於將感光模組20固定於電路板1上。晶片載板23用於承 載晶片22於其上，晶片22透過該等引腳24與電路板1相連。 φ其中，塑封膠體21包括一上侧塑封膠體21A與一下側塑封膠 體21B ’分別對稱位於該晶片載板23之上下兩侧。在本實施 方式中，位於晶片載板23上方之塑封膠體21定義為上側塑封 -膠體21A’位於晶片載板23的下方且在晶片載板23與電路板 1之間之塑封膠體21定義為下侧塑封膠體21B，其與上侧塑封 膠體21A位置相反。且，晶片22被下側塑封膠體21B所包覆。 本實施方式中，上侧塑封膠體21A與下側塑封膠體21B係一 •體成型為塑封膠體21’且塑封膠體21之材質為透光材質。且， 晶片22亦與開孔12相對應，用於透過該開孔12感測環境亮 度。本實施方式中，感光模組20係一背面感光元件，晶片载 板23係一印刷電路板（PCB)。且，該等引腳24與該等銲墊 10可透過具有導電性連接介質接合。 同時參閱圖4與圖5，圖4所示為本發明圖1所示電路板 1之另一應用示意圖，以及圖5所示係本發明另一實施方式之 感光裝置之側視圖，該感光裝置係由圖4之電路板1與另一感 8 1317608 光模組30組合而成。 . 本實施方式中，感光模組30相對於開孔12設置於電路板 * 1上，並與電路板1電性連接。該感光模組30包括一塑封膠體 31、一晶片32、一晶片載板33以及至少一對銲墊34。該等銲 墊34對稱設置於晶片載板33之外側’且與電路板1之銲墊1:L 相對應。其中，每一銲墊34包括一上側銲墊34A與一下側銲 墊34B。本實施方式中，晶片載板33透過該等下側銲塾34B 春與電路板1之銲墊11電性相連，用於承載晶片32。且，該等 下側銲墊34B亦與晶片載板33另一侧表面之上侧銲墊34A藉 .由一導電層35電性連接。其中，塑封謬體31係一下側塑封朦 體，位於晶片載板33的下方且在晶片載板33與電路板1之間。 因此，晶片32被塑封膠體31所包覆。同樣，本實施方式中， 塑封膠體31之材質為透光材質。本實施方式中，由於感光模 組30利用表面粘貼技術（SMT )透過與銲塾11電性相連，故， 籲塑封膠體31可嵌入電路板1之開孔12内。同樣，晶片載板33 亦可以係一 PCB，且，導電層35係該PCB上之錢銅箔。 由此可見’感光模組20、30具有完全不同之封裝結構， 且，圖1所示之電路板1佈局既可以適用感光模組2〇，又可以 適用感光模組30 ’而無需重新設計。本發明之實施方式中，開 孔12的大小在兼顧感光模組20、30大小的同時，還需要考量 感光範圍及角度的影響。又’開孔12之形狀可依據不同需求 而設計，不侷限於本發明所採用之形狀。 1317608 圖6所示係本發明另一實施方式之電路板2示意圖。其 .中’電路板4包括一感光區域42與複數同種類犁之銲墊40， :且該等銲墊40亦設置於該感光區域42之週圍。本實施方式 中，該等銲墊40對稱設置於該感光區域42之任，相對側。同 樣’該感光區域42係一開孔。本發明其他實施方式中，該感 光區域42亦可係一透光區域。 同時參閱圖7與圖8，圖7所示為本發明圖6所示電路板 _ 4之一應用示意圖，以及圖8所示為本發明圖6所示電路板4 之另一應用示意圖。 . 本實施方式中，應用圖7所示之電路板4之感光模組係與 感光模組20相似之元件，且該感光模組具有與電路板4之銲 墊40相對應數量之銲墊。圖7所示電路板4與感光模組之組 裝·侧視圖與圖3類似，在此不再資述。 同樣’圖8與圖7所示之電路板4之應用系意圖相似，區 鲁別在於圖7所示之電路板4之銲墊40完全與〆感光模組之銲 墊焊接，而圖8所示之電路板4之銲墊40部分與一感光模組 之銲墊焊接。換言之，與圖7、圖8相組裝之感光元件係為同 種類型之元件，區別係兩種感光元件具有不同數量之引腳。 本發明其他實施方式中，圖1所示電路板i上之銲墊1〇、 11數量不侷限其所示，可根據實際情況而設定。同時，圖7 與圖6中所示之銲墊40亦可係其他同種類型之銲墊。 綜上所述’本發明之電路板具有至少一種類型之複數銲 1317608 塾，可在不改變電路板佈局的情況下，適用安裝不同類型之感 光模虹。 * 絲上所述，本發明符合發明專利要件，爰依法提出專利申 月准以上所述者僅為本發明之較佳實施例，舉凡熟悉本案 技*之人士，在爰依本案發明精神所作之等效修飾或變化，皆 應包含於以下之申請專利範圍内。 【圖式簡單說明】 ♦圖1所示係本發明—實施方式中電路板之示意圖； -圖2所示係本發明圖1所示之電路板之-應用示意圖； 圖3所示係本發明-實施方式之感光裝置之侧視圖； -圖4所示係本發明圖1所示之電路板之另-應用示意圖； 圖5所示係本發明另一實施方式之感光裝置之侧視圖； 圖6所示係本發明另—實施方式之電路板示意圖； 圖7所示係本發關6所示之電路板之—應用示意圖；以及 肇圖8所不係本發明圖6所示之電路板之另—應用示意圖。 【主要元件符號說明】 電路板 1、4 銲墊 10、11、40、41、34A、34B 感光區域 12、42 感光模組. 20、30 - 載板 23、33 塑封膠體 21A、21B、31 11 321317608 晶片 22 導電層 351317608 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a circuit board and a photosensitive device using the same. [Prior Art] At present, most portable electronic devices, such as notebook computers, personal digital assistants (PDAs), etc., have lcd (1 iquid crystal display) panels, which usually use discharge lamps ( Discharge lamp or other type of lamp as a backlight. Therefore, the LCD panel needs an inverter to illuminate its internal lamp, and uses a photosensitive module to sense the brightness of the environment, maintain and adjust the brightness of the LCD panel, and make its brightness change with the brightness of the environment. And change, saving power energy. 'In general, the sensing modules of different manufacturers have different characteristics, so the corresponding converter circuit structure is also different. Therefore, converter manufacturers need to design circuit board layout according to different manufacturers' photosensitive modules, which not only increases the complexity of the circuit board design, but also cannot quickly use another one when one of the manufacturers' sensor modules is out of stock. Replacement of a sensor module by a manufacturer requires redesigning the circuit layout structure, increasing the cost, and delaying product mass production and shipment time. SUMMARY OF THE INVENTION In view of the above, it is desirable to install different types of light sensing modules without changing the circuit layout. There is also a need to provide a photosensitive device that can apply different types of photosensitive modules without redesigning the circuit layout. 6 1317608 A circuit board that can be used to mount different types of photosensitive modules' including a photosensitive area and a plurality of soldering pads. The pads are disposed around the photosensitive region for electrically connecting a photosensitive module thereon. A photosensitive device includes a circuit board and a photosensitive module. Among them, the circuit board can be applied to install different types of photosensitive modules, including a photosensitive area and a plurality of pads. The solder pads are disposed around the photosensitive region, and the photosensitive module is electrically connected to the solder pads to be disposed on the circuit board. • The circuit board of the present invention has a plurality of pads that can be mounted with different types of photosensitive modules without changing the layout of the board. [Embodiment] Fig. 1 is a plan view showing a circuit board 1 in an embodiment of the present invention. In the present embodiment, the circuit board 1 includes a photosensitive region 12 and a plurality of pads (Pads). The pads are disposed around the photosensitive region 12 and are divided into at least two types of plastics 10, 11. The solder pad 10 is disposed on one of the opposite sides of the photosensitive region 12; the soldering 11 is disposed on the other opposite sides of the photosensitive region 12. In the present embodiment, the photosensitive region 12 is an opening for light incidence. In other embodiments of the present invention, the photosensitive region 12 may be a light transmissive region, such as a light guide, a light transmissive glass, or the like. 2 and FIG. 3, FIG. 2 is a schematic view showing one application of the circuit board shown in FIG. 1, and FIG. 3 is a side view of the photosensitive device according to an embodiment. The circuit board 1 of 2 is combined with a photosensitive module 20. 7 1317608 In the embodiment, the photosensitive module 20 is disposed on the circuit board 1 with respect to the opening 12, and is electrically connected to the circuit board 1. The photosensitive module 20 includes a molding compound 21, a wafer 22, a wafer carrier 23, and at least one pair of pins 24. The number of the pins 24 corresponds to the number of pads 1 on the circuit board 1. Some of the pins 24 are electrically connected to their corresponding pads 10, and some of the pins 24 are used to fix the photosensitive module 20 to the circuit board 1. The wafer carrier 23 is used to carry the wafer 22 thereon, through which the wafer 22 is connected to the circuit board 1. φ wherein the molding compound 21 comprises an upper side molding compound 21A and a lower side molding compound 21B' symmetrically located on the upper and lower sides of the wafer carrier 23, respectively. In the present embodiment, the molding compound 21 located above the wafer carrier 23 is defined as the upper molding-colloid 21A' located below the wafer carrier 23 and the molding compound 21 between the wafer carrier 23 and the circuit board 1 is defined as The side molding encapsulant 21B is opposite in position to the upper side molding compound 21A. Further, the wafer 22 is covered by the lower side molding compound 21B. In the present embodiment, the upper plastic encapsulant 21A and the lower plastic encapsulant 21B are integrally formed into a plastic encapsulant 21' and the plastic encapsulant 21 is made of a light transmissive material. Moreover, the wafer 22 also corresponds to the opening 12 for sensing the ambient brightness through the opening 12. In the present embodiment, the photosensitive module 20 is a back photosensitive element, and the wafer carrier 23 is a printed circuit board (PCB). Moreover, the pins 24 are bonded to the pads 10 via a conductive connection medium. 4 and FIG. 5, FIG. 4 is a schematic view showing another application of the circuit board 1 shown in FIG. 1 of the present invention, and FIG. 5 is a side view of the photosensitive device according to another embodiment of the present invention. It is composed of the circuit board 1 of FIG. 4 and another optical module 30 1317608. In the embodiment, the photosensitive module 30 is disposed on the circuit board *1 with respect to the opening 12, and is electrically connected to the circuit board 1. The photosensitive module 30 includes a molding compound 31, a wafer 32, a wafer carrier 33, and at least one pair of pads 34. The pads 34 are symmetrically disposed on the outer side of the wafer carrier 33 and correspond to the pads 1:L of the board 1. Each of the pads 34 includes an upper pad 34A and a lower pad 34B. In the present embodiment, the wafer carrier 33 is electrically connected to the pad 11 of the circuit board 1 through the lower side pads 34B for carrying the wafer 32. Moreover, the lower pads 34B are also electrically connected to the upper pads 34A of the other side surface of the wafer carrier 33 by a conductive layer 35. The molded body 31 is a lower side molded body, located below the wafer carrier 33 and between the wafer carrier 33 and the circuit board 1. Therefore, the wafer 32 is covered by the molding compound 31. Similarly, in the present embodiment, the material of the plastic seal 31 is a light-transmitting material. In the present embodiment, since the photosensitive module 30 is electrically connected to the soldering pad 11 by surface bonding technology (SMT), the plastic sealing body 31 can be embedded in the opening 12 of the circuit board 1. Similarly, the wafer carrier 33 can also be a PCB, and the conductive layer 35 is a copper foil on the PCB. It can be seen that the photosensitive modules 20, 30 have completely different package structures, and the layout of the circuit board 1 shown in Fig. 1 can be applied to both the photosensitive module 2 and the photosensitive module 30' without redesigning. In the embodiment of the present invention, the size of the opening 12 is equal to the size of the photosensitive modules 20 and 30, and the influence of the photosensitive range and the angle is also considered. Further, the shape of the opening 12 can be designed according to different needs, and is not limited to the shape adopted by the present invention. 1317608 FIG. 6 is a schematic view of a circuit board 2 according to another embodiment of the present invention. The circuit board 4 includes a photosensitive region 42 and a plurality of solder pads 40 of the same type, and the pads 40 are also disposed around the photosensitive region 42. In the present embodiment, the pads 40 are symmetrically disposed on the opposite side of the photosensitive region 42. Similarly, the photosensitive region 42 is an aperture. In other embodiments of the present invention, the photosensitive region 42 may also be a light transmissive region. 7 and FIG. 8, FIG. 7 is a schematic diagram of an application of the circuit board _4 shown in FIG. 6, and FIG. 8 is another schematic diagram of the application of the circuit board 4 of FIG. In the present embodiment, the photosensitive module of the circuit board 4 shown in FIG. 7 is similar to the photosensitive module 20, and the photosensitive module has a number of pads corresponding to the pads 40 of the circuit board 4. The assembly and side view of the circuit board 4 and the photosensitive module shown in Fig. 7 are similar to those of Fig. 3 and will not be described again. Similarly, the application of the circuit board 4 shown in FIG. 8 and FIG. 7 is similar, and the pad 4 of the circuit board 4 shown in FIG. 7 is completely soldered to the pad of the photosensitive module, and FIG. 8 The pad 40 portion of the circuit board 4 shown is soldered to the pad of a photosensitive module. In other words, the photosensitive elements assembled with Figures 7 and 8 are of the same type, with the difference that the two photosensitive elements have different numbers of pins. In other embodiments of the present invention, the number of pads 1 and 11 on the circuit board i shown in FIG. 1 is not limited, and may be set according to actual conditions. At the same time, the pads 40 shown in FIG. 7 and FIG. 6 can also be other pads of the same type. In summary, the circuit board of the present invention has at least one type of multiple solder 1317608 塾, which can be used to install different types of photosensitive modules without changing the layout of the circuit board. * As stated on the wire, the invention complies with the requirements of the invention patents, and the patents are filed according to law. The above is only the preferred embodiment of the present invention. Those who are familiar with the technology of the case are doing the same in the spirit of the invention. Equivalent modifications or variations are intended to be included in the scope of the claims below. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view of a circuit board in the present invention - an embodiment; - Figure 2 is a schematic view of the circuit board shown in Figure 1 of the present invention; - Figure 4 is a side view of a circuit board of the present invention shown in Figure 1; Figure 5 is a side view of a photosensitive device according to another embodiment of the present invention; 6 is a schematic diagram of a circuit board according to another embodiment of the present invention; FIG. 7 is a schematic diagram of an application of the circuit board shown in the present invention; and FIG. 8 is not a circuit board shown in FIG. The other - application schematic. [Main component symbol description] Circuit board 1, 4 pads 10, 11, 40, 41, 34A, 34B photosensitive area 12, 42 photosensitive module. 20, 30 - carrier 23, 33 plastic encapsulant 21A, 21B, 31 11 321317608 wafer 22 conductive layer 35
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