CN209265138U - Back light for display device - Google Patents

Abstract

One embodiment of the utility model is related to a kind of back light for display device, and the back light for display device includes: flexible printed circuit board；Light emitting diode lines, the light emitting diode lines are mounted on the flexible printed circuit board；Photoconductive layer, the photoconductive layer has the opposite first surface and second surface connected by edge, wherein light of the marginal reception from the light emitting diode lines；And chassis, the chassis extends around the periphery of the photoconductive layer, wherein the chassis has first part adjacent and being attached to the flexible printed circuit board with the light emitting diode lines, and wherein the chassis has the second part extended above the light emitting diode lines.

Description

Back light for display device

Technical field

The utility model relates generally to the electronic equipment with display, and more particularly, to the display with backlight Device.

Background technique

Electronic equipment (such as computer and cellular phone) has display.The one of such as organic light emitting diode display A little displays have the pixel array for generating light.In such display, backlight is not needed, because pixel itself generates Light.Other displays include passive pixel, the changeable letter that user is shown by light quantity that display transmits of the passive pixel Breath.Passive pixel itself does not generate light, and it is often desirable to provide backlight for the display with passive pixel.Passive pixel can It is formed by the liquid crystal material layer formed between two electrode layers and two polarizer layers.

In a kind of exemplary backlit component for display, it is distributed using light guide plate by light source (such as light-emitting diodes Pipe light source) generate backlight.Reflector can be formed below light guide plate to improve backlight efficiency.

Conventional backlight assembly may cause visible artifact, may be unstable, and may occupy in electronic equipment Undesirable big quantity space.

Accordingly, it is desirable to be able to provide the display with improved backlight.

Summary of the invention

Display can have the pixel array for showing image for viewer.The pixel array can be by such as colour filter Layer, liquid crystal layer, tft layer, upper polarizer layer and lower polarizer layer display layer formed.

Back light unit can be used to generate the back lighting for being used for display.Back lighting may pass through polarizer, film Transistor layer, liquid crystal layer and color-filter layer.Back light unit can have light emitting diode lines, be mounted on flexible printed circuit board And it emits light into photoconductive layer.

Back light unit may include the chassis extended around the periphery of photoconductive layer.Chassis can have first part and second Point, first part is mounted on flexible printed circuit board adjacent to light emitting diode lines, and second part is above light emitting diode lines Extend.Chassis can have different cross section shapes compared to the remaining edge of chassis along from the adjacent edge of light emitting diode Shape.

Reflector layer could attach to the lower surface of photoconductive layer.Heat dissipating layer could attach to lower surface and the flexibility print of reflector layer The lower surface of printed circuit board.Heat dissipating layer may include the stone being plugged between first polymer carrier film and second polymer carrier film Ink sheet.The width of heat dissipating layer is smaller than the width of reflector layer, to mitigate the corrugation of reflector layer.Strip of glue can be by heat dissipating layer Edge be attached to flexible printed circuit board.First adhesive patch and second adhesive patch can be by corresponding the first of heat dissipating layer Corner and the second corner are attached to reflector layer.

The lower surface of photoconductive layer can be attached to flexible printed circuit board by multiple adhesive patch.Patterned adhesive phase It can be formed above the upper surface of light emitting diode lines and photoconductive layer.Patterned adhesive phase can have protrusion, each Protrusion extends on the corresponding adhesive patch in multiple adhesive patch.

According to embodiment, a kind of display backlight is provided comprising flexible printed circuit board is mounted on flexible printing Light emitting diode lines on circuit board have the photoconductive layer of the opposite first surface and second surface connected by edge, side Edge receives the light from light emitting diode lines, and the chassis extended around the periphery of photoconductive layer, and chassis has and light-emitting diodes Pipe row is adjacent and is attached to the first part of flexible printed circuit board, and chassis has top extension on a light emitting diode Second part.

According to another embodiment, each light emitting diode of light emitting diode lines is soldered to flexible print circuit Plate.

According to another embodiment, display backlight includes: multiple adhesive patch, and multiple adhesive patch is by light The first surface of conducting shell is attached to flexible printed circuit board and patterned adhesive phase, the patterned adhesive phase shape At above the second surface of light emitting diode lines and photoconductive layer.

According to another embodiment, patterned adhesive phase has multiple protrusions, and multiple protrusions Each protrusion it is Chong Die with the individual adhesive patch in multiple adhesive patch.

According to another embodiment, display backlight includes the first optical film being formed on photoconductive layer and is formed in this The second optical film on first optical film, a part of the first optical film are Chong Die with patterned adhesive phase.

According to another embodiment, the first optical film is diffuser layers, and the second optical film is brightness enhancement film.

According to another embodiment, display backlight includes additional adhesive layers, which is attached to The upper surface of two optical films and the upper surface of chassis.

According to another embodiment, additional adhesive layers include being plugged on the first pressure sensitive adhesive layer and second pressure-sensitive viscous Polymer film between mixture layer and the notch in the first pressure sensitive adhesive layer.

According to another embodiment, the first varistor layer is attached to the upper surface of the second optical film and the upper surface of chassis.

According to another embodiment, the second varistor layer is attached to the upper surface of the second optical film and the upper surface of chassis.

According to another embodiment, display backlight include formed in the notch of the first pressure sensitive adhesive layer it is additional Polymer film.

According to another embodiment, it is pressure-sensitive viscous that the notch in the first pressure sensitive adhesive layer extends only partially through first Mixture layer, and additional polymer film is directly attached to the first pressure sensitive adhesive layer in notch.

According to another embodiment, additional adhesive layers include piece of tape and second adhesive tape, piece of tape Including the polymer film being plugged between the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer, piece of tape include across Notch, polymer film and the second pressure sensitive adhesive layer of first pressure sensitive adhesive layer, second adhesive tape are filled in piece of tape Notch.

According to another embodiment, additional adhesive layers include piece of tape and second adhesive tape, piece of tape Including the polymer film being plugged between the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer, piece of tape includes passing through Notch, polymer film and the second pressure sensitive adhesive layer of first pressure sensitive adhesive layer, second adhesive tape are formed in above notch simultaneously And piece of tape is attached on the opposite side of notch.

According to another embodiment, display backlight include be plugged on the first optical film with patterned adhesives layer weight Spacer between folded part and additional adhesive layers.

According to another embodiment, display backlight includes the reflector layer below the first surface of photoconductive layer, And it is attached to the heat dissipating layer of flexible printed circuit board and reflector layer.

According to another embodiment, display backlight includes the adhesive that heat dissipating layer is attached to flexible printed circuit board Item, and heat dissipating layer is attached to the first adhesive patch and second adhesive patch of reflector layer.

According to another embodiment, display backlight includes opalescent adhesives layer, opalescent adhesives layer attachment To the lower surface of heat dissipating layer and the side surface of chassis.

According to another embodiment, there are two light emitting regions for each light emitting diode tool.

According to another embodiment, display backlight includes the first pad, the second pad on flexible printed circuit board It is Chong Die with the first pad, the second pad and third pad with the first light emitting diode of third pad, light emitting diode lines, and It plants between pad between the first pad and the second pad and the first light emitting diode is connected to the first of flexible printed circuit board and glue Adhesive patches, and be plugged between the second pad and third pad and the first light emitting diode is attached to flexible printing electricity The third pad of road plate.

According to another embodiment, the edge of the photoconductive layer is the first edge of the photoconductive layer, wherein institute Photoconductive layer is stated with the second edge opposite with the first edge, wherein the photoconductive layer has opposite third edge and the Four edges, wherein the photoconductive layer has first between the first edge and the third edge of the photoconductive layer Fillet, the second fillet between the first edge and the 4th edge of the photoconductive layer are located at the photoconductive layer The second edge and the third edge between third fillet, and positioned at the photoconductive layer the second edge with The 4th fillet between 4th edge, and wherein the photoconductive layer includes the second edge along the photoconductive layer Receiving sensor element recess.

According to embodiment, a kind of display backlight is provided comprising flexible printed circuit board is mounted on flexible printing electricity Light emitting diode lines on the plate of road, at least the first pad and the second pad on flexible printed circuit board, light emitting diode lines First light emitting diode is Chong Die with the first pad and the second pad, and the first light emitting diode is attached to flexible printed circuit board First adhesive patch, and the photoconductive layer with the opposite first surface and second surface connected by edge, the side Edge receives the light from light emitting diode lines.

According to another embodiment, first adhesive patch is plugged on the first pad and on flexible printed circuit board Between two pads.

According to embodiment, a kind of display backlight is provided comprising flexible printed circuit board is mounted on flexible printing electricity Light emitting diode lines on the plate of road have the photoconductive layer of the opposite first surface and second surface connected by edge, described Light of the marginal reception from light emitting diode lines, positioned at photoconductive layer first surface below and with the first width reflector Layer, is attached to the heat dissipating layer of reflector layer and flexible printed circuit board, and the heat dissipating layer is wide with second less than the first width Heat dissipating layer, is attached to the strip of glue of flexible printed circuit board, and heat dissipating layer is attached to the first of reflector layer and is glued by degree Adhesive patches and second adhesive patch.

According to another embodiment, heat dissipating layer includes being plugged between first polymer film and second polymer film Graphite linings.

According to another embodiment, heat dissipating layer include connected by opposite third edge and the 4th edge it is opposite First edge and second edge, strip of glue are formed along the first edge of heat dissipating layer, first adhesive patch formed therein In first corner of the heat dissipating layer that two edges and third edge are met, second adhesive patch second edge formed therein and the In second corner of the heat dissipating layer that four edges are met.

According to another embodiment, the edge of the photoconductive layer is the first edge of the photoconductive layer, wherein institute Photoconductive layer is stated with the second edge opposite with the first edge, wherein the photoconductive layer has opposite third edge and the Four edges, wherein the photoconductive layer has the first circle between the first edge and the third edge of the photoconductive layer Angle, the second fillet between the first edge and the 4th edge of the photoconductive layer, described in the photoconductive layer Third fillet between second edge and the third edge, and the second edge and the described 4th in the photoconductive layer The 4th fillet between edge, and wherein the photoconductive layer includes the recess along the second edge of the photoconductive layer.

According to embodiment, a kind of display backlight is provided comprising flexible printed circuit board is mounted on flexible printing electricity Light emitting diode lines on the plate of road have the photoconductive layer of the opposite first surface and second surface connected by edge, described The first surface of photoconductive layer is attached to multiple bondings of flexible printed circuit board by light of the marginal reception from light emitting diode lines Agent patch, and it is formed in the patterned adhesive phase above the second surface of light emitting diode lines and photoconductive layer, the figure The adhesive phase of case has multiple protrusions, and each protrusion in the multiple protrusion and multiple bondings Individual adhesive patch overlapping in agent patch.

According to another embodiment, the multiple protrusion includes first group of protrusion and second group of protrusion Point, first group of protrusion is plugged between the adjacent LED of light emitting diode lines and second group of protrusion Part is respectively since the intermediate of the corresponding light emitting diode of light emitting diode lines extends.

Detailed description of the invention

Fig. 1 is the schematic diagram according to the example electronic device with display of embodiment.

Fig. 2 is the cross-sectional side view according to the illustrative display in the electronic equipment of embodiment.

Fig. 3 is the top view according to the illustrative display of embodiment.

Fig. 4 is the perspective view according to the illustrative backing structure with fillet and recess of embodiment.

Fig. 5 be according to embodiment do not include light source backing structure edge on illustrative backing structure it is transversal Surface side view.

Fig. 6 is the cross section of the illustrative backing structure on the edge according to the backing structure including light source of embodiment Side view.

Fig. 7 is how to show heat dissipating layer relative to reflector according to the rearview of the illustrative heat dissipating layer of embodiment Layer has reduced width.

Fig. 8 is to illustrate how to pattern on heat dissipating layer viscous according to the top view of the illustrative heat dissipating layer of embodiment Mixture.

Fig. 9 is to be illustrated how according to the top view of the illustrative backing structure of embodiment in light emitting diode and light Patterned adhesives on the upper surface of conducting shell and the lower surface of photoconductive layer.

Figure 10 is that the light emitting diode, which has, is plugged on phase according to the top view of the exemplary light emitting diode of embodiment Adhesive patch between adjacent pad.

Figure 11 is to show the illustrative backing structure of the arrangement for light emitting diode matrix according to embodiment to bow View.

Figure 12 is to show shining from light emitting diode according to the top view of the illustrative backing structure of embodiment How the light in region can emit an angle to fill the fillet of photoconductive layer.

Figure 13 is the cross-sectional side with the illustrative endless rubber belt across its all layers of notch according to embodiment View.

Figure 14 is the cross-sectional side according to the illustrative endless rubber belt with the notch for extending only through one layer of embodiment View.

Figure 15 is the cross according to the illustrative endless rubber belt of second endless rubber belt with filling notch of embodiment Side cross-sectional view.

Figure 16 is the illustrative endless rubber belt with the second piece endless rubber belt Chong Die with notch according to embodiment Cross-sectional side view.

Figure 17 is the example with the notch and the extra play being formed in notch that extend only through one layer according to embodiment The cross-sectional side view of the property shown endless rubber belt.

Specific embodiment

The example electronic device that may be provided with the type of display is shown in Fig. 1.As shown in Figure 1, electronic equipment 10 There can be control circuit 16.Control circuit 16 may include the storage and processing circuit for the operation of holding equipment 10.The storage It may include storage device with processing circuit, such as hard disk drive storage devices, nonvolatile memory are (for example, be configured as Form the flash memories or other electric programmable read-only memory of solid state drive), volatile memory (for example, it is static or Dynamic random access memory), etc..Processing circuit in control circuit 16 can be used for controlling the operation of equipment 10.The processing Circuit can based on one or more microprocessor, microcontroller, digital signal processor, baseband processor, Power Management Unit, Audio chip, specific integrated circuit etc..

Input-output circuit such as input/output unit 12 in equipment 10 can be used for allowing to provide data to equipment 10, and allow data from device 10 being provided to external equipment.Input/output unit 12 may include button, control stick, rolling Wheel, touch tablet, keypad, keyboard, microphone, loudspeaker, audio-frequency generator, vibrator, camera, sensor, light emitting diode With other positioning indicators, data port etc..User can control equipment 10 by providing order via input/output unit 12 Operation and can be used the output resource of input/output unit 12 come from 10 receiving status information of equipment and other output.

Input-output equipment 12 may include one or more displays, such as display 14.Display 14 can be including Touch-screen display or display 14 for acquiring the touch sensor of touch input from the user can be unwise to touching Sense.The touch sensor of display 14 can be based on capacitive touch sensor electrode array, acoustic touch sensor structure, resistance Property touch component, the touch sensor arrangement based on power, based on the touch sensor of light or other suitable touch sensor cloth It sets.

Control circuit 16 can be used to come runs software on device 10, such as operating system code and application program.It is setting During standby 10 operation, the software operated in control circuit 16 can show image on display 14.

Equipment 10 can be tablet computer, laptop computer, desktop computer, TV, cellular phone, media play Device, watch device or other wearable electronics or other suitable electronic equipments.

The display 14 of equipment 10 includes pixel array.Pixel array can be by liquid crystal display (LCD) component or other conjunctions Suitable display device structure is formed.The configuration based on liquid crystal display device structure is described as example sometimes herein.

Display overlay can cover the surface of display 14 or the display layer of such as color-filter layer, tft layer Or the other parts of display can be used as the outermost layer (or close to outermost layer) in display 14.Outermost display layer can be by Transparent glass sheet, clarity plastic layer or other transparent components are formed.

The cross-sectional side view of the exemplary arrangement of the display 14 of equipment 10 is shown in Fig. 2.As shown in Fig. 2, display Device 14 may include back light unit, such as generating the back light unit 42 (sometimes referred to as backlight or backing structure) of backlight 44.? During operation, backlight 44 propagates (in the orientation of Fig. 2 on Z-dimension straight up) outward and passes through the picture in display layer 46 Plain structure.This is illuminated as caused by the pixel for any image of user's viewing.For example, backlight 44 can illuminate display layer 46 On the image watched on direction 50 by viewer 48.

Display layer 46 is mountable in such as Undercarriage structure of plastics Undercarriage structure and/or metal Undercarriage structure, to be formed For installing display module in shell in apparatus 10 or display layer 46 can be directly mounted at electronics for equipment 10 In device housings (for example, by the way that display layer 46 to be stacked in the depressed section in metal or plastic shell).Display layer 46 can It forms liquid crystal display or can be used to form other kinds of display.

In the configuration for forming liquid crystal display using display layer 46, display layer 46 may include liquid crystal layer such as liquid crystal layer 52.Liquid crystal layer 52 can be sandwiched between display layer such as display layer 58 and 56.Layer 56 and 58 can be plugged on lower polarizer layer 60 Between upper polarizer layer 54.

Layer 58 and 56 can be formed by the glassy layer or plastic layer of transparent substrate layer such as light transmission.Layer 56 and 58 can be for layer such as Tft layer and/or color-filter layer.Conductive trace, color filter element, transistor and other circuits and structure can be formed On the substrate of layer 58 and 56 (for example, forming tft layer and/or color-filter layer).It can also be by tactile sensor electrode It is integrated in layer such as layer 58 and 56 and/or tactile sensor electrode can be formed on other substrates.

For exemplary configuration, layer 58 can be to include based on thin film transistor (TFT) and associated electrode (pixel electrode) The tft layer of pixel circuit array, the associated electrode are used to apply electric field to liquid crystal layer 52 and thus by image Display is on display 14.Layer 56 can be to include for providing the color filter element for showing the ability of color image for display 14 The color-filter layer of array.If desired, layer 58 can be color-filter layer and layer 56 can be tft layer.It can also be used wherein The configuration that color filter element is combined with the thin-film transistor structure on public substrate layer.

During the operation of display 14 in apparatus 10, can be used control circuit (for example, one on printed circuit or Multiple integrated circuits) generate the information that will be shown on display 14 (for example, display data).Information to be shown can make Display driver integrated circuit such as circuit 62A or 62B is transferred into signal path, the signal path is such as by rigidity Or the signal path that the conductive metal trace in flexible print circuit such as printed circuit 64 is formed (as example).It is such as integrated The flexible print circuit of the integrated circuit of circuit 62A and/or such as flexible print circuit 64 could attach in lug area 66 Substrate 58 (as example).

Backing structure 42 may include photoconductive layer such as photoconductive layer 78.Photoconductive layer 78 can be formed by transparent material, such as transparent Glass or plastics.During the operation of backing structure 42, light source such as light source 72 can produce light 74.Light source 72, which can be, for example to shine Diode array (for example, a series of light emitting diodes being arranged in rows, extend in the page in the orientation of Fig. 2).It shines Diode array may be mounted to rigidity or flexible print circuit.Printed circuit may be affixed to the adjacent layer in electronic equipment.At certain In a little embodiments, printed circuit may be affixed to the part of photoconductive layer 78.

Light 74 from light source 72 can be coupled to the original in the edge surface 76 of photoconductive layer 78 and due to total internal reflection Reason can be distributed on entire photoconductive layer 78 in X and Y dimension.Photoconductive layer 78 may include scattering characteristics structure, such as pit, convex It rises, groove or ridge, help light outgoing photoconductive layer 78 are used as backlight 44.These feature structures can be located at the upper surface of photoconductive layer 78 And/or on opposite lower surface.In the case where an exemplary configuration, the first surface of such as lower surface of photoconductive layer 78 has There is raised design, and the opposite second surface of the upper surface of such as photoconductive layer 78 has pattern (the sometimes referred to as biconvex of ridge Lens, lentoid or lenticular ridge).Light source 72 can be located at any desired edge of photoconductive layer 78.

The light 74 scattered in the Z-direction of direction from photoconductive layer 78 can be used as the backlight 44 of display 14.The light 74 scattered downwards It can be reflected in an upward direction by reflector 80.Reflector 80 can be formed by catoptric arrangement, such as coated with by alternately High refractive index and low-refraction inorganic or organic layer formed dielectric mirror plastic base layer.Reflector 80 can be by reflecting material Material such as white plastic or other glossy material layers are formed.

In order to improve the backlight performance of backing structure 42, backing structure 42 may include optical film 70.Optical film 70 may include Diffuser layers are used to help homogenizing backlight 44, to reduce hot spot.Optical film 70 may also include the brightness for collimated back 44 Enhance film.Optical film 70 can be Chong Die with the other structures in the back light unit 42 of such as photoconductive layer 78 and reflector 80.For example, such as Fruit photoconductive layer 78 has rectangle occupied area in the X-Y plane of Fig. 2, and optical film 70 and reflector 80 can respectively have matched Rectangle occupied area.Optical film 70 may include that may be formed at display for enhancing the compensation film observed off axis or compensation film In 14 polarizer layer or in display 14 elsewhere.

Fig. 3 is the top view of a part of display 14, shows how display 14 can have the shape in display layer 46 At pixel array 90.Pixel 90 can have the color filter element of different colours, such as red color filter elements R, green color Device element G and blue color filter elements B.Pixel 90 can be arranged in rows and columns, and can form the active region AA of display 14. It the boundary of active region AA can be slightly on the inside of the boundary of photoconductive layer 78, to ensure there is no visible hot spot in display 14 (that is, obviously not brighter than peripheral region for the region of the back lighting of display 14).For example, the boundary 92 of active region AA 76 distance 82 of lower edge of photoconductive layer 78 can be deviateed.It is generally desirable to minimize the size of distance 82, so that effective for what is given Area size, display 14 are as compact as possible.However, the not Ying Tai little of distance 82, to ensure to have enough light to mix.Particularly, Distance 82 should be sufficiently large to allow the light 74 emitted from light emitting diode 72 homogenization enough for use as back lighting.Distance 82 It is commonly necessary, to ensure that the light from light emitting diode 72 is sufficiently mixed.Therefore, distance 82 can be described as mixing distance sometimes 82.When light 74 initially emits from each light emitting diode 72, light 74 concentrates on the exit of light emitting diode 72, and does not deposit It is in the space between light emitting diode 72.Light 74 propagated in optical plate 78 it is remote enough after (that is, passing through foot in light 74 After enough big mixing distances 82), light 74 will smoothly be distributed along dimension X and will no longer concentrate on corresponding single luminous two The near exit of pole pipe 72.

The rectangular shape of photoconductive layer 78 and active region AA are only illustrative in Fig. 3.If desired, photoconductive layer 78 and/ Or active region AA can have non-rectangular shape (for example, the shape with one or more bending parts).It is such to show Such as shown in Fig. 4.As shown in figure 4, backing structure 42 (including photoconductive layer 78) can have fillet, such as fillet 94.Backlight knot Structure 42 may also include the recess of such as recess 96 (for example, to accommodate the other assemblies in electronic equipment 10, such as sensor portion Part).The detailed cross-sectional of backing structure 42 is shown in Fig. 5 and Fig. 6.Particularly, Fig. 5 is the backlight that the line 98 in Fig. 4 intercepts The cross-sectional side view of structure 42.Fig. 6 is the cross-sectional side view for the backing structure 42 that the line 97 in Fig. 4 intercepts.

As shown in figure 5, backing structure 42 includes the reflector 80 of photoconductive layer 78 with the lower surface for being attached to photoconductive layer.Optics Film 70-1 and 70-2 can be placed on the upper surface of photoconductive layer.Optical film 70-1 can be brightness enhancement film (BEF) or other needed for The optical film of type.The optics of type needed for optical film 70-2 can be diffuser layers (being used to help homogenizing backlight) or another kind Film.

Backing structure 42 also includes chassis 102.Chassis 102 can be plastics chassis (sometimes referred to as p chassis), support display Other layers (for example, layer and/or display layer 46 in backing structure 42) in device.Chassis 102 can surround the periphery of photoconductive layer 78 Extend, there is central opening, wherein photoconductive layer is located in the opening (for example, chassis 102 can be ring-shaped).If desired, Chassis 102 can be formed by two or more materials.As Fig. 5 example in, chassis 102 by molded plastics 102-1 the first note The second injection with molded plastics 102-2 is penetrated to be formed.First injection of molded plastics can have the second injection than molded plastics Deeper color (for example, plastics 102-1 can be black and plastics 102-2 can be white).The second injection of molded plastics 102-2 It can be positioned on the adjacent edges of photoconductive layer 78, so that the second injection of molded plastics reflects light back into photoconductive layer.The example is only Illustrative, and if desired, chassis 102 can be formed by single dielectric substance.

Adhesive phase 104 could attach to the top surface of chassis 102 and the top surface of optical film 70-1.Adhesive phase 104 can Extend around the periphery of photoconductive layer 78, and there can be central opening (for example, adhesive phase 104 can be ring-shaped).Therefore, it glues Mixture layer 104 can be described as endless rubber belt sometimes.If desired, backing structure 42 can be attached to display layer 46 by endless rubber belt 104. The lower surface of chassis 102 can be attached to reflector layer 80 by another adhesive phase 106.Adhesive phase 104 and 106 can be pressure-sensitive viscous The adhesive phase of mixture layer or any other required type.

It does not include that three edges of the backing structure 42 of light emitting diode 72 can have the cross section of type shown in Fig. 5. For example, seeing Fig. 3, light emitting diode 72 is positioned along the lower edge of photoconductive layer.The lower edge of backing structure has and backing structure The different arrangement in its excess-three edge.Its excess-three edge of backing structure can have the arrangement of type shown in Fig. 2.

Fig. 6 is the cross-sectional side view of the lower edge of backing structure, and wherein light source emits light into photoconductive layer.Such as Fig. 6 Shown, the part of backing structure further includes photoconductive layer 78, the reflector layer 80 for attaching to photoconductive layer lower surface, attaches to light guide The optical film and such as brightness enhancement film for the upper surface for attaching to optical film 70-2 of such as diffuser layers 70-2 of layer upper surface The optical film of 70-1.However, it may include light source 72 to be emitted through the light 74 of the edge surface 76 of photoconductive layer in the Y direction.

Light source 72, which can be, arranges rows of light emitting diode along the edge surface 76 of photoconductive layer.Each light emitting diode 72 It is mountable on such as printed circuit board of flexible printed circuit board 108.Flexible printed circuit board 108 can be by polyimide piece Or the printed circuit that other flexible polymer skins are formed.Flexible printed circuit board 108 (sometimes referred to as flexible print circuit 108 or Printed circuit 108) it may include patterned metallization traces, for transmitting signal between the component on flexible printed circuit board.It is soft Property printed circuit board 108 may include engagement pad 110 (sometimes referred to as pad 110).Pad 110 can be formed in flexible print circuit Conduction (for example, metal) pad on the upper surface of plate 108.Light emitting diode 72 can be couple to pad 110 by solder 112.Often A light emitting diode (sometimes referred to as LED package) can have one or more associated pads.Solder can will shine Diode electrically and mechanically arrives flexible printed circuit board 108.

It is attached to except flexible printed circuit board 108 except through solder 112, light emitting diode 72 can pass through adhesive phase 114 are attached to photoconductive layer 78.As shown in fig. 6, adhesive phase 114 is located on the upper surface of light emitting diode 72 and in photoconductive layer Extend on 78 upper surface.A part of adhesive phase 114 is plugged between photoconductive layer 78 and optical film 70-2.Adhesive phase 114 can be the adhesive phase of pressure sensitive adhesive layer or any other required type.

Flexible printed circuit board 108 is couple to light emitting diode by solder 112.Flexible printed circuit board 108 can also lead to It crosses additional adhesive layers and is couple to photoconductive layer 78.As shown in fig. 6, flexible printed circuit board 108 may include coating 118 (sometimes referred to as For coating) and the adhesive phase 116 that is attached between photoconductive layer 78 and coating 118.If desired, coating 118 can be omitted, and And photoconductive layer 78 can be directly connected to flexible printed circuit board by adhesive phase 116.Adhesive phase 116 can be pressure sensitive adhesive layer Or the adhesive phase of any other required type.Flexible printed circuit board 108 can also pass through the adhesive of such as adhesive phase 120 Layer is attached to chassis 102.Adhesive phase 120 can be the adhesive phase of pressure sensitive adhesive layer or any other required type.

Chassis shown in chassis and Fig. 5 in Fig. 6 is identical chassis.However, chassis 102 is in the following of backing structure There is the cross section different from other three edges of backing structure on edge.As shown in fig. 6, chassis 102 has overhang 122, the main part 124 far from chassis extends.The main part 124 of chassis is positioned and is attached adjacent to light emitting diode 72 To flexible printed circuit board 108.Overhang 122 (sometimes referred to as extension or protrusion) prolongs above light emitting diode 72 It stretches.Overhang increases the surface area of the upper surface of chassis 102, allows (not increase with the more large access area of endless rubber belt 104 Add the width of the inactive regions of display).It may be said that chassis 102 has L shape along the lower edge of backlight.

Endless rubber belt 104 attaches between the upper surface of optical film 70-1 and the upper surface of chassis 102.Such as spacer 126 spacer (sometimes referred to as spacer structure 126) may include between optical film 70-2 and endless rubber belt 104, to help to subtract Bending in few endless rubber belt.Spacer can also provide additional surface for the endless rubber belt to be attached, to increase endless rubber belt It is attached intensity.Spacer 126 can be formed by any desired material.

During the operation of equipment 10, light emitting diode and other component in equipment generate heat.It can wrap in a device It includes heat dissipating layer and generates hot spot to spread heat in equipment 10 (this may cause visible artifact).Fig. 6 is shown Example, wherein backing structure 42 includes heat dissipating layer 128, to spread the heat issued from the component of such as light emitting diode 72 etc. In the example of fig. 6, heat dissipating layer 128 is located in X/Y plane and laterally spreads heat in dimension X and Y.Heat dissipating layer 128 can The additional conducting-heat elements (for example, plate in metal shell) being optionally couple in equipment 10 are to carry out additional heat dissipation.Heat dissipating layer 128 can be formed by any suitable material with high thermal conductivity, therefore can be used for radiating.It can be used to form heat dissipating layer 128 The example of material includes metal (for example, combination of copper, other metals or copper and other metals), carbon nanotube, graphite or has The other materials of high thermal conductivity.If desired, heat dissipating layer 128 can be by two or more different types of heat-conducting layers (for example, attached Connect the layers of copper etc. in graphite linings) it is formed.Polymer support film can also be in (for example, to support graphite linings) doped layer 128.One In a illustrative examples, heat dissipating layer 128 includes the graphite linings being plugged between two polymer support films.

Heat dissipating layer 128 can be attached to the lower surface of flexible print circuit 108 by adhesive phase 130.Adhesive phase 130 can It is the adhesive phase of pressure sensitive adhesive layer or any other required type.Backing structure 42 may also include one or more additional viscous Mixture layer, such as adhesive phase 132, are directly attached to reflector layer 80 for heat dissipating layer 128.Adhesive phase 132 can be pressure-sensitive The adhesive phase of adhesive phase or any other required type.

Backing structure 42 may also include shading rubber belt 134 (sometimes referred to as opalescent adhesives layer 134).Shading rubber belt 134 It can be formed by opaque material, shading rubber belt is allowed to stop stray light.In addition, shading rubber belt can be helped chassis 102 and soft Property printed circuit board 108 keeps together.As shown in fig. 6, shading rubber belt 134 is coupled in side surface and the heat dissipating layer of chassis 102 Between 128 lower surface.This can help to for printed circuit board 108 and chassis 102 being fixed on their desired positions (in addition to resistance It keeps off except stray light).

As discussed in connection with FIG. 6, the heat dissipating layer (128) in backing structure 42 can be directly attached to reflector layer 80.It is risen at certain temperatures however, the difference of the thermal conductivity of reflector layer 80 and heat dissipating layer 128 may cause reflector layer 80 Wrinkle.These folds in reflector layer 80 may cause visible artifact in shown light.

After Fig. 7 shows the heat dissipating layer 128 and reflector layer 80 reduced in the corrugated arrangement in reflector layer 80 View.As shown in fig. 7, reflector layer 80 can have width 136.Width 136 can be any desired distance (for example, in 60 Hes Between 70 millimeters, between 50 and 100 millimeters, between 65 and 70 millimeters, less than 100 millimeters, be greater than 40 millimeters etc.).Heat dissipation Layer 128 can have the width 138 less than width 136.Width 138 can be any desired distance (for example, 55 and 65 millimeters it Between, between 50 and 100 millimeters, between 55 and 60 millimeters, less than 100 millimeters, be greater than 40 millimeters etc.).Each of heat dissipating layer Edge can separate the distance of such as distance 140 with the edge of reflector layer.Distance 140 can be identical on every side of heat dissipating layer, Or it can be different on every side of heat dissipating layer.Distance 140 can be any desired distance (for example, between 2 and 10 millimeters, Between 3 and 5 millimeters, less than 20 millimeters, be greater than 1 millimeter etc.).Have between the edge of heat dissipating layer and the edge of reflector layer Gap 140 can prevent the corrugation of reflector layer, to improve display performance.The length 142 of heat dissipating layer 128 can be any desired Length (for example, between 50 and 100 millimeters, between 25 and 200 millimeters, less than 100 millimeters, less than 200 millimeters, be greater than 40 millimeters, be greater than 10 millimeters etc.).

Heat dissipating layer 128 is attached to the adhesive of other backing structures (for example, reflector layer and flexible printed circuit board) Position can also influence the corrugation of reflector layer.As previously as shown in connection with fig. 6, adhesive phase 130 can be by the upper surface of heat dissipating layer It is attached to the lower surface of flexible printed circuit board.The upper surface of heat dissipating layer can be attached to reflector layer by additional adhesive layers 132 Lower surface.Fig. 8 shows the arrangement of the corrugated adhesive phase 130 and 132 for minimizing reflector layer.

Fig. 8 is the top view of heat dissipating layer 128 and corresponding adhesive phase.As shown in figure 8, heat dissipating layer 128 and flexible printing Adhesive phase 130 between circuit board (108) can be formed as band along the lower edge of heat dissipating layer 128.Two independent bondings Oxidant layer 132 may be formed between heat dissipating layer 128 and reflector layer (80).One of adhesive phase 132 is attached to heat dissipating layer The upper left corner, and one of adhesive phase 132 is attached to the upper right corner of heat dissipating layer.In other words, heat dissipating layer, which has, passes through phase Pair third edge and the 4th edge connection opposite first edge and second edge.First adhesive item is along heat dissipating layer First edge forms and heat dissipating layer is attached to flexible printed circuit board.Heat dissipating layer is attached to the first adhesive of reflector layer In the corner for the heat dissipating layer that patch is formed in the second edge of heat dissipating layer and third edge is met.Heat dissipating layer is attached to reflector In the corner for the heat dissipating layer that the second adhesive patch of layer is formed in the second edge of heat dissipating layer and the 4th edge is met.

As previously as shown in connection with fig. 6, the upper surface of light emitting diode 72 can be attached to photoconductive layer 78 by adhesive phase 114 Upper surface, and the lower surface of photoconductive layer 78 can be attached to flexible printed circuit board 108 by adhesive phase 116.Fig. 9 be show it is viscous Mixture layer 114 and 116 by how patterned top view.The pattern of adhesive shown in Fig. 9 can help to optimize the machinery of backlight Characteristic and optical characteristics.

As shown in figure 9, light emitting diode 72 is mountable on flexible print circuit 108.Adhesive phase 114 may be formed at hair On the upper surface of optical diode 72.Each light emitting diode can have there are two corresponding luminous component.Adhesive phase can have slotting Set the protrusion 144 between every group of adjacent luminous component in the light emitting diode.For example, first group of protrusion 144-1 Positioned at the centre of each light emitting diode.Second group of protrusion 144-2 is between each pair of adjacent light emitting diode.First Each protrusion in group is combined with the protrusion in second group to limit the hair with wherein one of light emitting diode The adhesive free area that light partially overlaps.The protrusion of adhesive phase 114 can extend simultaneously above the upper surface of photoconductive layer 78 It is in contact with it.

Adhesive phase 116 may include multiple adhesive patch (sometimes referred to as adhesive island).Each adhesive patch 116 are coupled between the lower surface of photoconductive layer 78 and flexible printed circuit board 108.As shown in figure 9, each adhesive patch 116 Also Chong Die with the complementary protuberance part 144 of adhesive phase 114.In other words, it for each adhesive patch 116, can draw flat Row passes through the adhesive patch and corresponding protrusion 144 in the line of Z axis, the line.The example is only illustrative, and such as Fruit needs that other adhesives can be used to arrange.

As discussed in connection with FIG. 6, solder 112 can be used to be attached to flexible printed circuit board for light emitting diode 72 108.Figure 10 is the top view for showing light emitting diode and how being attached to flexible printed circuit board.As shown in Figure 10, given hair Optical diode 72 can be Chong Die with three pads 110.If desired, each pad can have one or more recesses luminous to improve The alignment of diode.Each pad can have the corresponding solder being attached between pad and light emitting diode.

Other than using solder between light emitting diode and engagement pad, adhesive 146 can be used for light emitting diode It is attached to flexible printed circuit board.Adhesive patch 146 (sometimes referred to as gluing patch 146) can be plugged on each pair of adjacent pad Between.Light emitting diode can be attached directly on flexible printed circuit board (for example, the pad being not inserted into) by adhesive patch. After light emitting diode is attached to pad using solder, adhesive patch (for example, bottom filler) can be added.At this In the case of kind, adhesive patch 146 can improve the mechanical strength of the attachment between light emitting diode and flexible printed circuit board.Separately Adhesive patch can be deposited on flexible printing electricity before light emitting diode is placed on flexible printed circuit board by selection of land On the plate of road.In this case, other than increasing the mechanical strength of attachment, adhesive patch can also improve light emitting diode Alignment.The adhesive (for example, contact adhesive, hotmelt etc.) of type needed for adhesive patch 146 can be any, and It can be formed by the material (for example, polymer) of any required type.

Figure 11 is showing for the light emitting diode 72 for allowing light emitting diode to emit light into the photoconductive layer 78 with fillet The top view of example property arrangement.As shown in figure 11,16 light emitting diodes can are positioned to adjacent with the lower edge of photoconductive layer 78 Row.Each light emitting diode can have there are two light emitting region.The example is exemplary only.In general, backing structure 42 can wrap Include any desired quantity light emitting diode (for example, more than eight, more than ten, more than 15, less than 20, be less than 12, be less than 30 etc.) and each light emitting diode can have any required amount of light emitting region (one, two, Three, more than three etc.).

Each light emitting diode can have width 150.Width 150 can be any desired distance (for example, at 3 and 4 millimeters Between, between 2 and 10 millimeters, be greater than 1 millimeter, less than 10 millimeters etc.).The center of adjacent LED can pass through spacing 148 separate.Spacing 148 can be any desired distance (for example, between 3 to 4 millimeters, between 2 to 10 millimeters, be greater than 1 milli Rice, less than 10 millimeters etc.).Light emitting diode matrix can have total total length 152 (for example, between 50 and 65 millimeters, 40 And between 100 millimeters, between 50 and 55 millimeters, less than 100 millimeters, be greater than 30 millimeters etc.).Light emitting diode can be positioned on bottom In opening in frame 102 (for example, a part of chassis 102 has overhang 122 shown in Fig. 6), which has width Degree 154 (for example, between 50 and 65 millimeters, between 40 and 100 millimeters, between 50 and 60 millimeters, less than 100 millimeters, it is big In 30 millimeters etc.).Chassis 102 can have maximum width 156 (for example, between 55 and 75 millimeters, between 40 and 100 millimeters, Between 60 and 70 millimeters, less than 100 millimeters, be greater than 30 millimeters etc.).

The light emitting diode arrangement of Figure 11 is only illustrative.In alternative embodiment, can have there are two 14 tools The light emitting diode of light emitting region and four light emitting diodes with single light emitting region.Two have single light emitting region Light emitting diode can be located at 14 tools, and there are two the two sides of the light emitting diode of light emitting region.

Figure 12 is the top view of the light emitting diode of light emitting diode matrix edge, and how show can emit light to fill out Fill the corner of photoconductive layer 78.As shown in figure 12, each light emitting diode 72 can have there are two light emitting region (for example, first shine Region 158 and the second light emitting region 160).In order to ensure light reaches the fillet of photoconductive layer 78, the light from light emitting region 158 can Relative to Y-axis with the transmitting of angle 162 (for example, the light cone emitted by light emitting region 158, which has, is at an angle of 158 most relative to Y-axis Outer edge).Angle 162 may be selected to ensure that light reaches all parts of photoconductive layer 78.Angle 162 can be 55 °, in 50 ° and 60 ° Between, between 54 ° and 56 °, between 40 ° and 70 °, between 30 ° and 80 °, less than 80 °, less than 60 °, less than 45 °, it is big In 30 °, be greater than 50 °, be greater than 65 ° or angle needed for any other.

Fig. 5 and Fig. 6 shows endless rubber belt 104, has the upper of the upper surface and optical film 70-1 for being attached to chassis 102 The lower surface on surface.As previously mentioned, the upper surface of endless rubber belt 104 may be connected to display layer 46 or another required equipment portion Part.In addition, endless rubber belt can extend around the periphery of photoconductive layer 78 and have central opening.If endless rubber belt 104 is complete Extend around photoconductive layer, so that sealing element is formed around entire photoconductive layer, then backing structure and display during fall event Structure may be susceptible to damage (because if then air has nowhere to run for compression, but deforming the layer in equipment).It therefore, can be in ring Opening is formed in shape adhesive tape 104, as shown in figure 13.

Figure 13 is the cross-sectional side view of endless rubber belt 104, and endless rubber belt 104 has across its all layers of notch 164. As shown, endless rubber belt 104 is formed by polymer film 168, the polymer film 168 is plugged on adhesive phase 166-1 (example Such as, the adhesive of type needed for contact adhesive or another kind) and lower adhesive phase 166-2 (for example, contact adhesive or another The adhesive of type needed for kind) between.In Figure 13, notch 164 passes through all layers of endless rubber belt.It is preventing by endless rubber belt While damage caused by the sealing element of formation, the notch 164 in Figure 13 may cause visible during the operation of display Artifact.The alternative embodiment of notch 164 is shown in Figure 14-Figure 16, it is visible without causing to provide opening for air Artifact.

In the cross-sectional side view of Figure 14, endless rubber belt 104 again have be plugged on pressure sensitive adhesive layer 166-1 and Polymer film 168 between 166-2.However, the endless rubber belt of Figure 14 has the notch only formed in adhesive phase 166-2 170.Polymer film 168 and adhesive phase 166-1 are not cut.This provides air openings without causing visible artifact.

Figure 15 is the cross-sectional side view using the embodiment of first kind endless rubber belt and Second Type endless rubber belt. The cleavable endless rubber belt 104-1 with the polymer film 168 being plugged between pressure sensitive adhesive layer 166-1 and 166-2, with shape At notch 164.In notch 164, the endless rubber belt 104-2 different from endless rubber belt 104-1 is formed.Endless rubber belt 104-2 can Such as only there is polymer film 174 and adhesive phase 172.Opening can be formed below polymer film 174.If desired, annular Adhesive tape 104-1 and 104-2 can be formed from different materials.

Figure 16 is the cross-sectional side view of endless rubber belt 104-1, and endless rubber belt 104-1 has across its all layers of notch 164.As shown, endless rubber belt 104-1 is by the polymerization that is plugged between upper adhesive phase 166-1 and lower adhesive phase 166-2 The formation of object film 168.In Figure 16, notch 164 passes through all layers of endless rubber belt 104-1.Second endless rubber belt 104-2 is formed On notch 164 and bridge notch 164.In Figure 16, endless rubber belt 104-2 is also by being plugged on upper adhesive phase 166-1 under The formation of polymer film 168 between adhesive phase 166-2.However, if it is desired to which endless rubber belt 104-1 and 104-2 can be by differences Material formed.

In the cross-sectional side view of Figure 17, endless rubber belt 104 again have be plugged on pressure sensitive adhesive layer 166-1 and Polymer film 168 between 166-2.However, the endless rubber belt of Figure 17 has the notch only formed in adhesive phase 166-2 170.Polymer film 168 and adhesive phase 166-1 are not cut.Notch 170 can extend only partway through adhesive phase 166-2 (as shown in figure 17).In other words, the second part guarantor of the first part of adhesive phase 166-2 and adhesive phase 166-2 are cut It holds and does not cut.The example is only illustrative, and if desired, notch 170 may extend entirely through adhesive phase 166-2 (as shown in figure 14).Extra play 182 can be formed in notch 170 (for example, on the expose portion of adhesive phase 166-2).It is attached Adding layer 182 can be non-adhesive layers.Layer 182 can be polymeric layer, as an example.Layer 182 can by with 168 phase of polymer film Same material is formed, or can be formed by the material different from polymer film 168.

In Figure 13-Figure 17, endless rubber belt can be attached to back light unit 42 at side (for example, chassis 102 in Fig. 6) Layer.The layer of back light unit 42 can be located at the either side of the endless rubber belt in Figure 13-17.For example, in Figure 14, back light unit 42 Layer could attach to adhesive phase 166-1 (for example, the upper surface for being attached to endless rubber belt) or be attached to lower adhesive layer agent 166-2 (for example, the lower surface for being attached to endless rubber belt).For all embodiments of Figure 13-Figure 17, the layer of back light unit 42 can be attached It is connected to the upper surface of endless rubber belt or the lower surface of endless rubber belt.

Foregoing teachings are exemplary only, and those skilled in the art can be in the range for not departing from the embodiment Various modification can be adapted in the case where essence.Foregoing embodiments can individually be implemented or can implement in any combination.

Patent application claims on August 23rd, the 2018 U.S. Patent application No.16/110,893 submitted and in The U.S. Provisional Patent Application No.62/662 that on April 24th, 2018 submits, 023 priority, these patent applications accordingly full text It is herein incorporated by reference.

Claims (20)

1. a kind of back light for display device, comprising:

Flexible printed circuit board；

Light emitting diode lines, the light emitting diode lines are mounted on the flexible printed circuit board；

Photoconductive layer, the photoconductive layer has the opposite first surface and second surface connected by edge, wherein the edge Receive the light from the light emitting diode lines；With

Chassis, the chassis extend around the periphery of the photoconductive layer, wherein the chassis has and the light emitting diode lines First part that is adjacent and being attached to the flexible printed circuit board, and wherein the chassis has in the light-emitting diodes The second part extended above pipe row.

2. back light for display device according to claim 1, wherein each light emitting diode of the light emitting diode lines It is soldered to the flexible printed circuit board, the display backlight further include:

The first surface of the photoconductive layer is attached to the flexibility by multiple adhesive patch, the multiple adhesive patch Printed circuit board；With

Patterned adhesive phase, the patterned adhesive phase are formed in the light emitting diode lines and the photoconductive layer Above the second surface.

3. back light for display device according to claim 2, wherein the patterned adhesive phase has multiple protrusions Part, and wherein each protrusion in the multiple protrusion and the corresponding bonding in the multiple adhesive patch The overlapping of agent patch.

4. back light for display device according to claim 2, further includes:

First optical film, first optical film is formed in above the photoconductive layer, wherein a part of first optical film It is Chong Die with the patterned adhesive phase；

Second optical film, second optical film are formed in above first optical film；With

Additional adhesive layers, the additional adhesive layers are attached to the upper surface of second optical film and the upper table of the chassis Face.

5. back light for display device according to claim 4, wherein first optical film is diffuser layers and described Second optical film is brightness enhancement film.

6. back light for display device according to claim 4, wherein the additional adhesive layers include being plugged on the first pressure Polymer film between sensitive adhesive layer and the second pressure sensitive adhesive layer and the notch in first pressure sensitive adhesive layer.

7. back light for display device according to claim 6, further includes:

Additional polymer film, the additional polymer film are formed in the notch in first pressure sensitive adhesive layer.

8. back light for display device according to claim 7, wherein the notch in first pressure sensitive adhesive layer First pressure sensitive adhesive layer is extended only partway through, and wherein the additional polymer film is directly attached to described cut First pressure sensitive adhesive layer in mouthful.

9. back light for display device according to claim 4, wherein the additional adhesive layers include piece of tape and Second adhesive tape, wherein first adhesive tape includes being plugged between the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer Polymer film, wherein first adhesive tape includes across first pressure sensitive adhesive layer, the polymer film and described The notch of second pressure sensitive adhesive layer, and wherein second adhesive tape fills the notch in the piece of tape.

10. back light for display device according to claim 4, wherein the additional adhesive layers include piece of tape and Second adhesive tape, wherein first adhesive tape includes being plugged between the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer Polymer film, wherein first adhesive tape includes across first pressure sensitive adhesive layer, the polymer film and described The notch of second pressure sensitive adhesive layer, and wherein second adhesive tape is formed in above the notch and in the notch Opposite side on be attached to the piece of tape.

11. back light for display device according to claim 1, further includes:

Reflector layer, the reflector layer are located in below the first surface of the photoconductive layer；

Heat dissipating layer, the heat dissipating layer are attached to the flexible printed circuit board and the reflector layer；

The heat dissipating layer is attached to the flexible printed circuit board by strip of glue, described adhesive item；And

First adhesive patch and second adhesive patch, the first adhesive patch and second adhesive patch are dissipated described Thermosphere is attached to the reflector layer.

12. back light for display device according to claim 11, further includes:

First pad, the second pad and third pad, first pad, the second pad and third pad are located at the flexible print On printed circuit board, wherein the first light emitting diode of the light emitting diode lines and first pad, second pad and The third pad overlapping；With

First adhesive patch, the first adhesive patch be plugged between first pad and second pad and First light emitting diode is attached to the flexible printed circuit board；And

Second adhesive patch, the second adhesive patch be plugged between second pad and the third pad and First light emitting diode is attached to the flexible printed circuit board.

13. back light for display device according to claim 12, wherein the edge of the photoconductive layer is the light guide The first edge of layer, wherein the photoconductive layer has the second edge opposite with the first edge, wherein the photoconductive layer has There are opposite third edge and the 4th edge, wherein the photoconductive layer has the first edge and institute positioned at the photoconductive layer The first fillet between third edge is stated, second between the first edge and the 4th edge of the photoconductive layer Fillet, the third fillet between the second edge and the third edge of the photoconductive layer, and it is located at the light The 4th fillet between the second edge of conducting shell and the 4th edge, and wherein the photoconductive layer includes along described The recess of the receiving sensor element of the second edge of photoconductive layer.

14. a kind of back light for display device, comprising:

Flexible printed circuit board；

Light emitting diode lines, the light emitting diode lines are mounted on the flexible printed circuit board；

At least the first pad and the second pad, at least first pad and the second pad are located at the flexible printed circuit board On, wherein the first light emitting diode of the light emitting diode lines is Chong Die with first pad and second pad；

First light emitting diode is attached to the flexible printing electricity by first adhesive patch, the first adhesive patch Road plate；With

Photoconductive layer, the photoconductive layer has the opposite first surface and second surface connected by edge, wherein the edge Receive the light from the light emitting diode lines.

15. back light for display device according to claim 14, wherein the first adhesive patch be plugged on it is described soft Between first pad and second pad on property printed circuit board.

16. a kind of back light for display device, comprising:

Flexible printed circuit board；

Light emitting diode lines, the light emitting diode lines are mounted on the flexible printed circuit board；

Photoconductive layer, the photoconductive layer has the opposite first surface and second surface connected by edge, wherein the edge Receive the light from the light emitting diode lines；

Reflector layer, the reflector layer are located in below the first surface of the photoconductive layer and have the first width；

Heat dissipating layer, the heat dissipating layer are attached to the reflector layer and the flexible printed circuit board, wherein the heat dissipating layer has There is the second width less than first width；

The heat dissipating layer is attached to the flexible printed circuit board by strip of glue, described adhesive item；With

First adhesive patch and second adhesive patch, the first adhesive patch and second adhesive patch are dissipated described Thermosphere is attached to the reflector layer.

17. back light for display device according to claim 16, wherein the heat dissipating layer includes by opposite third side Edge and the 4th edge connection opposite first edge and second edge, wherein described adhesive item along the heat dissipating layer institute It states first edge to be formed, wherein the second edge and the third edge of the first adhesive patch in the heat dissipating layer It is formed in the first corner met, and the wherein second edge and institute of the second adhesive patch in the heat dissipating layer It states and is formed in the second corner that the 4th edge is met.

18. back light for display device according to claim 17, wherein the edge of the photoconductive layer is the light guide The first edge of layer, wherein the photoconductive layer has the second edge opposite with the first edge, wherein the photoconductive layer has Have opposite third edge and the 4th edge, wherein the photoconductive layer have the photoconductive layer the first edge with it is described The first fillet between third edge, the second circle between the first edge and the 4th edge of the photoconductive layer Angle, the third fillet between the second edge and the third edge of the photoconductive layer, and in the photoconductive layer The 4th fillet between the second edge and the 4th edge, and wherein the photoconductive layer includes along the photoconductive layer The second edge recess.

19. a kind of back light for display device, comprising:

Flexible printed circuit board；

Light emitting diode lines, the light emitting diode lines are mounted on the flexible printed circuit board；

Photoconductive layer, the photoconductive layer has the opposite first surface and second surface connected by edge, wherein the edge Receive the light for carrying out the light emitting diode lines；

The first surface of the photoconductive layer is attached to the flexibility by multiple adhesive patch, the multiple adhesive patch Printed circuit board；With

Patterned adhesive phase, the patterned adhesive phase are formed in the light emitting diode lines and the photoconductive layer Above the second surface, wherein the patterned adhesive phase has multiple protrusions, and wherein the multiple prominent The each protrusion risen in part is overlapped with the corresponding adhesive patch in the multiple adhesive patch.

20. back light for display device according to claim 19, wherein the multiple protrusion includes first group of protrusion Part and second group of protrusion, first group of protrusion are plugged on the adjacent light-emitting diodes in the light emitting diode lines Between pipe, second group of protrusion is respectively since the intermediate of the corresponding light emitting diode of the light emitting diode lines extends.