TWI312268B - - Google Patents
Download PDFInfo
- Publication number
- TWI312268B TWI312268B TW95129071A TW95129071A TWI312268B TW I312268 B TWI312268 B TW I312268B TW 95129071 A TW95129071 A TW 95129071A TW 95129071 A TW95129071 A TW 95129071A TW I312268 B TWI312268 B TW I312268B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- conducting
- seat
- hole
- conducting seat
- Prior art date
Links
- 238000005452 bending Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 2
- 230000032683 aging Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95129071A TW200810670A (en) | 2006-08-08 | 2006-08-08 | Manufacturing method of heat-conductive module and product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95129071A TW200810670A (en) | 2006-08-08 | 2006-08-08 | Manufacturing method of heat-conductive module and product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200810670A TW200810670A (en) | 2008-02-16 |
| TWI312268B true TWI312268B (enExample) | 2009-07-11 |
Family
ID=44767431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95129071A TW200810670A (en) | 2006-08-08 | 2006-08-08 | Manufacturing method of heat-conductive module and product thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200810670A (enExample) |
-
2006
- 2006-08-08 TW TW95129071A patent/TW200810670A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200810670A (en) | 2008-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI331205B (enExample) | ||
| TWI308052B (enExample) | ||
| TWI312268B (enExample) | ||
| CN102012183B (zh) | 散热器及其制作方法 | |
| CN101149234A (zh) | 热管散热器及其制造方法 | |
| JP2011508449A5 (enExample) | ||
| TW200848991A (en) | Processing method of graphite heat conductive sheet | |
| TW200300838A (en) | Method of manufacturing heat-dissipating device | |
| JP3137576U (ja) | 横型放熱装置 | |
| TWI270339B (en) | Heat conduits and method for forming heat-dissipating fins by squeeze-shaping | |
| CN102049672B (zh) | 多热管蒸发部共平面的制造方法及其成品结构、工具 | |
| TWI305132B (enExample) | ||
| CN104869783A (zh) | 散热模组组合结构及其制造方法 | |
| TWI236337B (en) | Forming method of heat pipe and dissipation fin | |
| CN203814119U (zh) | 散热模组 | |
| CN101128103A (zh) | 导热模块及其制造方法 | |
| TW200804750A (en) | An evenly thermal distributed plate with a thermal conductive base | |
| TW201021676A (en) | Heat dissipating module and heat dissipating apparatus | |
| TWI322258B (enExample) | ||
| TWM416067U (en) | Heat radiator with heat pipe having adhesive-type bottom-attached cooling fin | |
| WO2008037135A1 (fr) | Dissipateur thermique à caloduc et procédé de fabrication correspondant | |
| TWM392990U (en) | Heat-dissipating module | |
| CN105025683B (zh) | 散热模组及其制造方法 | |
| KR20090085296A (ko) | 클래드 파이프형 냉각장치 | |
| CN203072298U (zh) | 一种新型3u散热器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |