TWI311336B - - Google Patents
Download PDFInfo
- Publication number
- TWI311336B TWI311336B TW95122478A TW95122478A TWI311336B TW I311336 B TWI311336 B TW I311336B TW 95122478 A TW95122478 A TW 95122478A TW 95122478 A TW95122478 A TW 95122478A TW I311336 B TWI311336 B TW I311336B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- fluid
- nozzle
- liquid
- substrate processing
- Prior art date
Links
- 239000012530 fluid Substances 0.000 claims description 243
- 239000007788 liquid Substances 0.000 claims description 215
- 239000000758 substrate Substances 0.000 claims description 197
- 239000007789 gas Substances 0.000 claims description 137
- 238000001035 drying Methods 0.000 claims description 136
- 238000012545 processing Methods 0.000 claims description 127
- 239000000126 substance Substances 0.000 claims description 34
- 238000003672 processing method Methods 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 239000011261 inert gas Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 239000003595 mist Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010298 pulverizing process Methods 0.000 claims 1
- 239000005871 repellent Substances 0.000 claims 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 135
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 36
- 229910001873 dinitrogen Inorganic materials 0.000 description 19
- 206010036790 Productive cough Diseases 0.000 description 9
- 230000003028 elevating effect Effects 0.000 description 9
- 210000003802 sputum Anatomy 0.000 description 9
- 208000024794 sputum Diseases 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000010419 fine particle Substances 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-AKLPVKDBSA-N Ammonia-N17 Chemical compound [17NH3] QGZKDVFQNNGYKY-AKLPVKDBSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005183549 | 2005-06-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200707511A TW200707511A (en) | 2007-02-16 |
| TWI311336B true TWI311336B (enExample) | 2009-06-21 |
Family
ID=45072406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095122478A TW200707511A (en) | 2005-06-23 | 2006-06-22 | Substrate Processing method and substrate processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200707511A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101617393B (zh) * | 2007-02-23 | 2011-05-18 | 积水化学工业株式会社 | 蚀刻方法及装置 |
| JP6418554B2 (ja) * | 2015-06-10 | 2018-11-07 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
-
2006
- 2006-06-22 TW TW095122478A patent/TW200707511A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200707511A (en) | 2007-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100855279B1 (ko) | 기판 처리 방법 및 기판 처리 장치 | |
| JP5068801B2 (ja) | 基板処理方法および基板処理装置 | |
| JP7034634B2 (ja) | 基板処理方法および基板処理装置 | |
| CN107871691B (zh) | 基板处理方法和基板处理装置 | |
| KR101061931B1 (ko) | 기판 처리 방법, 기판 처리 장치 및 기록 매체 | |
| KR102584337B1 (ko) | 기판 처리 장치, 기판 처리 방법 및 기억 매체 | |
| JP6419053B2 (ja) | 基板処理方法および基板処理装置 | |
| JP2004119717A (ja) | 基板処理方法および基板処理装置 | |
| TWI687989B (zh) | 基板處理方法及基板處理裝置 | |
| TWI324091B (enExample) | ||
| JP2020017632A (ja) | 基板処理装置、および基板処理方法 | |
| JP4236109B2 (ja) | 基板処理方法及び基板処理装置 | |
| WO2020021903A1 (ja) | 基板処理方法および基板処理装置 | |
| TWI311336B (enExample) | ||
| TW202240681A (zh) | 基板處理方法及基板處理裝置 | |
| JP6454608B2 (ja) | 基板処理方法、基板処理装置および記憶媒体 | |
| JP7143465B2 (ja) | 基板処理装置および基板処理方法 | |
| KR20220031499A (ko) | 액 처리 방법 및 액 처리 장치 | |
| JP6571253B2 (ja) | 基板処理方法および基板処理装置 | |
| JP2024078250A (ja) | 基板処理方法および基板処理装置 | |
| KR20220115980A (ko) | 기판 처리 방법 |