TW200707511A - Substrate Processing method and substrate processing apparatus - Google Patents

Substrate Processing method and substrate processing apparatus

Info

Publication number
TW200707511A
TW200707511A TW095122478A TW95122478A TW200707511A TW 200707511 A TW200707511 A TW 200707511A TW 095122478 A TW095122478 A TW 095122478A TW 95122478 A TW95122478 A TW 95122478A TW 200707511 A TW200707511 A TW 200707511A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate processing
fluid
process liquid
processing apparatus
Prior art date
Application number
TW095122478A
Other languages
English (en)
Chinese (zh)
Other versions
TWI311336B (enExample
Inventor
Kenji Sekiguchi
Noritaka Uchida
Satoru Tanaka
Hiroki Ohno
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200707511A publication Critical patent/TW200707511A/zh
Application granted granted Critical
Publication of TWI311336B publication Critical patent/TWI311336B/zh

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW095122478A 2005-06-23 2006-06-22 Substrate Processing method and substrate processing apparatus TW200707511A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005183549 2005-06-23

Publications (2)

Publication Number Publication Date
TW200707511A true TW200707511A (en) 2007-02-16
TWI311336B TWI311336B (enExample) 2009-06-21

Family

ID=45072406

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122478A TW200707511A (en) 2005-06-23 2006-06-22 Substrate Processing method and substrate processing apparatus

Country Status (1)

Country Link
TW (1) TW200707511A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409876B (zh) * 2007-02-23 2013-09-21 Sekisui Chemical Co Ltd Etching method and device
TWI607487B (zh) * 2015-06-10 2017-12-01 思可林集團股份有限公司 基板處理方法及基板處理裝置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409876B (zh) * 2007-02-23 2013-09-21 Sekisui Chemical Co Ltd Etching method and device
TWI607487B (zh) * 2015-06-10 2017-12-01 思可林集團股份有限公司 基板處理方法及基板處理裝置

Also Published As

Publication number Publication date
TWI311336B (enExample) 2009-06-21

Similar Documents

Publication Publication Date Title
TW200627537A (en) Substrate processing method and substrate processing apparatus
SG152980A1 (en) Method for the wet-chemical treatment of a semiconductor wafer
US10128102B2 (en) Methods and apparatus for wetting pretreatment for through resist metal plating
TW200640584A (en) Method and apparatus for cleaning and drying substrates
WO2010053280A3 (ko) 대상물의 습식 처리 장치 및 방법과 이에 사용되는 유체 확산판 및 배럴
TW200802581A (en) Substrate processing method and substrate processing apparatus
WO2008084658A1 (ja) 半導体装置の製造方法、半導体製造装置及び記憶媒体
KR930011129A (ko) 기판처리방법 및 처리장치
TWI263676B (en) Compositions for chemically treating a substrate using foam technology
MY143956A (en) Controls of ambient environment during wafer drying using proximity head
TW200717632A (en) Substrate processing apparatus and substrate processing method, and computer-readable storage medium
SG164385A1 (en) Composition useful for removal of post-etch photoresist and bottom anti- reflection coatings
CN104183524A (zh) 一种晶圆边缘的刻蚀装置
MY150143A (en) Method for removing material from semiconductor wafer and apparatus for performing the same
WO2009031270A1 (ja) ウエハ再生方法およびウエハ再生装置
JP6449097B2 (ja) 基板処理方法及び基板処理装置並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
KR20150111818A (ko) 기판 세정 방법 및 기판 세정 장치
WO2005050705A3 (en) Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
EP1748475A3 (en) Etching method and etching apparatus
TWI457993B (zh) 清潔表面的方法
TWI261290B (en) Removal of contaminants using supercritical processing
TW201939572A (zh) 具有可控制噴束尺寸之處理噴霧的微電子處理系統
TW200515498A (en) Coating film forming apparatus and coating film forming method
TW200515473A (en) System for rinsing and drying semiconductor substrates and method therefor
TW200700812A (en) Coating apparatus and operating method thereof